MAXM17514ALI+ - 4A 2.4-5.5V Step-Down Power Module | Maxim
料号： MAXM17514ALI+ ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $9.14 | $9.14 |
| 10 | $8.21 | $82.10 |
| 100 | $6.96 | $696.00 |
| 500 | $5.84 | $2,920.00 |
| 1,000 | $5.12 | $5,120.00 |
MAXM17514ALI+ 概述
A step-down (buck) DC-DC converter is a switching voltage regulator that efficiently reduces a higher DC input voltage to a lower DC output voltage by rapidly switching an inductor and rectifying the resulting waveform. Compared with linear regulators, buck converters achieve substantially higher efficiency (often 90-95%) by cycling a transistor between saturation and cutoff instead of dissipating excess voltage as heat. Power modules such as the MAXM17514ALI+ extend this architecture by co-packaging the controller, MOSFETs, inductor, and feedback compensation, simplifying PCB layout and shortening time to market in space-constrained designs.
Key specifications include a 2.4V to 5.5V input voltage window, 0.75V to 3.6V programmable output voltage, 4A continuous output current, integrated dual nMOSFET switches, internal shielded inductor, internal compensation network, and a thermally-enhanced SiP package that simplifies thermal management. The device is well suited for point-of-load (PoL) applications where a low-voltage, high-current rail must be derived locally from a 3.3V or 5V system bus with minimal PCB area and minimal external component count.
The MAXM17514ALI+ uses a peak current-mode control architecture with internal compensation, which simplifies stability analysis and removes the need to design a Type-III compensation network. The fully shielded inductor reduces radiated EMI, an important consideration for noise-sensitive analog and RF subsystems powered from the same board.
Typical applications include FPGA core and I/O rails, ASIC point-of-load supplies, industrial 5V bus distributed power, networking switch ASICs, telecom board rails, and portable/embedded system 3.3V-to-1.xV conversion. The wide input range makes it compatible with both 3.3V and 5V system buses without external front-end regulation.
A key design consideration is input and output capacitor selection: use ceramic capacitors with low ESR placed as close as possible to the IN and OUT pins to minimize ripple and maintain regulation loop bandwidth. Ensure the upstream 5V or 3.3V source can supply the full 4A load transient.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling faster component selection and supply chain decisions.
直接替换替代料： MAXM17514ALI+ ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MAXM17515ALI+
✅ 直接替换📋 参考替代料（不在目录中）
MAXM17504ALI+
✅ 直接替换📋 参考替代料（不在目录中）
MAXM17516ALI+
✅ 直接替换📋 参考替代料（不在目录中）
MAXM17503ALI+
✅ 直接替换📋 参考替代料（不在目录中）
MAXM17514ALI+ 最大额定值与电气特性
| 拓扑 | Buck (Step-Down) |
| 功能 | Non-Isolated PoL Module DC-DC Converter |
| 输入电压范围 | 2.4 V to 5.5 V |
| 输出电压范围 | 0.75 V to 3.6 V (programmable) |
| 最大输出电流 | 4 A |
| 输出配置 | Positive |
| 输出数量 | 1 |
| Switch Type | Dual n-channel MOSFET (integrated) |
| Inductor | Fully shielded (integrated) |
| Compensation | Internal |
| Package Type | System-in-Package (SiP) - thermally enhanced |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| 效率 | High (typical buck topology) |
MAXM17514ALI+ system-in-package (sip) - thermally enhanced 引脚配置指南
MAXM17514ALI+（system-in-package (sip) - thermally enhanced 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： MAXM17514ALI+.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MAXM17514ALI+ 适用于 6 应用s: FPGA Core and I/O Voltage Rails, ASIC Point-of-Load (PoL) Supplies, Industrial 5V Bus Distributed Power, Networking Switch ASIC Power, Telecom Board Local Regulation, Embedded System 3.3V-to-1.xV Conversion.
FPGA Core and I/O Voltage Rails
The MAXM17514ALI+ delivers 0.75V to 3.6V at 4A, directly serving mid-range FPGA core rails (0.85V, 1.0V, 1.2V) and aux I/O voltages (1.8V, 2.5V, 3.3V). Its integrated inductor minimizes radiated EMI near the FPGA, which is critical for SERDES jitter performance. According to the Maxim datasheet, the device supports up to 4A continuous, covering most mid-range FPGA power budgets. Unlike a discrete buck, the SiP eliminates the inductor footprint and simplifies PCB layout in tight FPGA-adjacent areas.
推荐
ASIC Point-of-Load (PoL) Supplies
Distributed PoL architectures benefit from the MAXM17514ALI+'s compact SiP and 4A output. Placing one module per ASIC rail eliminates the long trace inductance that causes voltage droop during load transients. The 2.4V-5.5V input range accepts standard 3.3V or 5V system bus power without an upstream regulator. Internal compensation removes the need to design a Type-III network, reducing engineering time-to-market for ASIC reference designs.
推荐
Industrial 5V Bus Distributed Power
Industrial systems use a 5V rail that must be stepped down locally for digital subsystems. The MAXM17514ALI+ accepts 5V input and produces 0.75V-3.6V at 4A with high buck efficiency, minimizing heat dissipation in sealed enclosures. The thermally enhanced SiP package supports operation in industrial temperature environments. Per the Maxim datasheet, this module is designed for industrial distributed architectures where a 5V backplane powers multiple PoL modules.
推荐
Networking Switch ASIC Power
Networking switches require low-voltage, high-current rails for switch ASICs and PHYs. The MAXM17514ALI+'s 4A output and 0.75-3.6V range supports common switch ASIC core voltages (0.9V, 1.0V, 1.2V), and the fully shielded inductor reduces EMI that could couple into adjacent high-speed SerDes channels. Its small footprint allows dense placement near each ASIC, minimizing PDN impedance.
推荐
Telecom Board Local Regulation
Telecom boards derive 3.3V or 5V from a backplane and need local step-down to ASIC and DSP core levels. The MAXM17514ALI+'s 2.4V-5.5V input covers both bus voltages without a front-end regulator. The internal nMOSFETs and inductor enable efficient conversion at telecom load currents up to 4A. The SiP footprint reduces PCB area versus discrete buck solutions.
推荐
Embedded System 3.3V-to-1.xV Conversion
Embedded processors increasingly require sub-1V cores powered from a 3.3V system rail. The MAXM17514ALI+ steps 3.3V down to 0.75-1.2V at 4A, supporting ARM Cortex-A cores, DSPs, and SoCs. High buck efficiency reduces battery drain in portable embedded designs. The internal compensation network eliminates loop design time versus discrete buck controllers.
推荐
推荐产品汇总
工程参考数据： MAXM17514ALI+ ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MAXM17515ALI+ | MAXM17504ALI+ | MAXM17516ALI+ | MAXM17503ALI+ |
|---|---|---|---|---|---|
| Brand | Maxim | Maxim | Maxim | Maxim | Maxim |
| Package | SiP (thermally enhanced) | SiP (thermally enhanced) - same family | SiP (thermally enhanced) - same family | SiP (thermally enhanced) - same family | SiP (thermally enhanced) - same family |
| Input Voltage Range | 2.4V to 5.5V | 2.4V to 5.5V | 2.4V to 5.5V | 2.4V to 5.5V | 2.4V to 5.5V |
| Output Voltage Range | 0.75V to 3.6V | 0.75V to 3.6V | 0.75V to 3.6V | 0.75V to 5.5V | 0.75V to 3.6V |
| Maximum Output Current | 4 A | 5 A (+25%) | 3.5 A (-12.5%) | 6 A (+50%) | 5 A (+25%) |
| Inductor | Integrated (shielded) | Integrated (shielded) | Integrated (shielded) | Integrated (shielded) | Integrated (shielded) |
| Compensation | Internal | Internal | Internal | Internal | Internal |
| Topology | Buck (Step-Down) | Buck (Step-Down) | Buck (Step-Down) | Buck (Step-Down) | Buck (Step-Down) |
关键差异点
- Highest 4A rating in the 2.4-5.5V SiP family （对比 MAXM17504ALI+)
- Lower output voltage cap than MAXM17516 （对比 MAXM17516ALI+)
- Fully integrated SiP versus discrete buck （对比 TPS54360 (discrete buck controller))
设计说明
Estimated: place input and output ceramic capacitors as close as possible to the IN and OUT pins of the MAXM17514ALI+ SiP to minimize parasitic inductance. Use X5R or X7R MLCCs with low ESR. The SiP integrates the inductor, but external input/output capacitors must still be sized per the Maxim datasheet reference design to maintain stable operation and limit output ripple at 4A loads.
At 4A load stepping 5V to 3.3V, power dissipation is approximately 6.8W worst-case (10% efficiency derating from ideal). The thermally enhanced SiP relies on PCB copper spreading for heat removal; design at least 1 square inch of 2oz copper on the package footprint. Without this, junction temperature can exceed 125C under sustained 4A loads.
Do not operate the MAXM17514ALI+ above 5.5V input - the integrated MOSFETs and inductor are rated only for 5.5V. Output voltages above 3.6V are not supported by this specific module; for higher output use the MAXM17516 family. Also ensure the feedback resistor divider uses 1% tolerance resistors to maintain output voltage accuracy at low Vout (e.g., 0.75V).
合规信息
RoHS compliant per Maxim/Analog Devices product page. Not AEC-Q100 qualified (industrial/consumer grade); for automotive designs, contact Maxim about AEC-Q100 variants. Lead-free (Pb-free) per the part suffix.
