MC68MH360VR25VL - 25MHz QUICC M683xx MPU 357-BGA | NXP
부품 번호: MC68MH360VR25VL ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $101.34 | $101.34 |
| 10 | $95.5 | $955.00 |
| 100 | $86.2 | $8,620.00 |
| 500 | $78.4 | $39,200.00 |
| 1,000 | $72.1 | $72,100.00 |
MC68MH360VR25VL 개요
What is a MPU with an integrated CPM? A microprocessor unit (MPU) executes program code while the Communications Processor Module (CPM) offloads serial and networking protocol work, allowing the core to focus on application logic. Within the broader hierarchy, the MC68MH360VR25VL is a microprocessor -> 32-bit MPU -> integrated communications controller -> embedded SoC. This architecture became the foundation of Freescale/NXP's QUICC and later PowerQUICC families.
Key features include 25 MHz CPU32+ core, integrated CPM with multi-channel QMC supporting up to 64 logical channels, 10 Mbps Ethernet MAC, DRAM controller, and a 357-ball PBGA package for high-density board designs. Operating voltage is 3.3 V with 5 V tolerant I/O on selected pins per the M683xx family specification.
The device uses a Harvard-style CPU32+ core coupled to the CPM via dual-port internal RAM. The QMC (QUICC Multi-Channel) controller emulates up to 64 logical channels within one SCC using time-division multiplexing (TDM), enabling ISDN, HDLC, and other channelized protocols without external glue logic. A bus arbiter supports external masters and the on-chip DMA.
Typical applications include telecommunications line cards, ISDN modem pools, industrial Ethernet bridges, and legacy SCADA controllers. The 25 MHz core suits deterministic bit-banged I/O and small embedded protocol stacks where modern Cortex-M parts would over-engineer the cost target.
When designing with this part, allocate generous PCB area for the 357-ball PBGA (25 x 25 mm) and follow NXP's recommended decoupling scheme; supply sequencing for 3.3 V core and I/O rails must be respected to avoid bus contention. Lead-free reflow profiles (JEDEC J-STD-020) are required.
This page synthesizes distributor stock levels, packaging variants, and drop-in compatible alternatives not consolidated in the manufacturer datasheet, helping sourcing engineers navigate the EOL transition noted on the NXP product page.
드롭인 대체품: MC68MH360VR25VL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC68MH360VR25VL (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC68MH360VR25L
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC68MH360VR25LR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC68EN360VR25VL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC68EN360VR25L
✅ 드롭인✓ 재고 있음
$71.41 / 개
데이터시트 보기 →MC68360ZQ25VL
✅ 드롭인✓ 재고 있음
$81.25 / 개
데이터시트 보기 →MC68MH360VR25VL 최대 정격 & 전기적 특성
| Core Processor | CPU32+ |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Series | M683xx (QUICC) |
| Speed | 25 MHz |
| Co-Processors / DSP | Communications; CPM (with QMC) |
| RAM Controllers | DRAM |
| Ethernet | 10 Mbps (1) |
| Operating Voltage | 3.3 V |
| 패키지 / 케이스 | 357-PBGA (25 x 25 mm) |
| Packaging | Tray |
| 실장 유형 | Surface Mount |
| Graphics Acceleration | No |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| Part Status | Obsolete / EOL per NXP product page |
MC68MH360VR25VL 357-pbga (25 x 25 mm) 핀 구성 가이드
MC68MH360VR25VL(357-pbga (25 x 25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC68MH360VR25VL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC68MH360VR25VL 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Industrial Ethernet Bridges, ISDN Modem Pool Controllers, SCADA and Industrial Control, Embedded Protocol Converters, Legacy Telecom Backplane Controllers.
Telecommunications Line Cards
The MC68MH360VR25VL's integrated CPM with QMC engine supports up to 64 logical channels per SCC using time-division multiplexing, which is exactly the topology used in legacy ISDN and T1/E1 line card designs. At 25 MHz the CPU32+ core handles supervisory state machines and HDLC framing while the CPM drives physical-layer drivers. The 357-PBGA package accommodates the high ball count required for parallel bus glue logic and external PHY/MAC connections, and 3.3 V operation simplifies interface to standard telecom ASICs of that era.
추천
Industrial Ethernet Bridges
The MC68MH360VR25VL integrates a 10 Mbps Ethernet MAC and a DRAM controller, which together support 10Base-T bridge/router designs without external protocol ASICs. The CPU32+ core at 25 MHz runs the bridging/filtering table while the CPM offloads serial port and SCC management. The 357-PBGA package's high pin count exposes multiple SCC/SMC/SPI interfaces for diagnostic UARTs, console ports, and side-band management buses. Designers benefit from reduced BOM count versus discrete MCU + external MAC designs of the same era.
추천
ISDN Modem Pool Controllers
The QMC multi-channel engine emulates up to 64 logical channels within one SCC using TDM, making the MC68MH360VR25VL well suited for ISDN modem pool and channelized data concentrator designs. Its CPM drives the channelized HDLC protocol while the CPU32+ core handles call setup and routing state. The 357-PBGA footprint provides the bus bandwidth and peripheral count needed to aggregate multiple B-channels onto a single backplane. Reference designs from the late 1990s used this exact configuration in central-office equipment.
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SCADA and Industrial Control
The MC68MH360VR25VL's combination of a deterministic 25 MHz CPU32+ core, multiple SCC/SMC channels, and integrated DRAM controller supports SCADA outstation designs where deterministic serial polling is required. The CPM can drive RS-485 multidrop protocols while the core executes the application telemetry stack. The 357-PBGA package provides the I/O density needed for parallel GPIO expansion and external memory-mapped peripherals. Operating at 3.3 V keeps power dissipation compatible with sealed industrial enclosures.
추천
Embedded Protocol Converters
Protocol converters between legacy serial buses and Ethernet benefit from the MC68MH360VR25VL's mix of SCC, SMC, SPI, and 10 Mbps Ethernet MAC on a single die. The CPU32+ core runs the conversion state machine while the CPM offloads framing for each physical interface. The 357-PBGA package's 25 x 25 mm footprint fits the high I/O density needed for multi-drop serial transceivers and external PHY/MAC partners. The part's mature firmware ecosystem (uClinux, RTEMS, custom CPM microcode) accelerates development.
추천
Legacy Telecom Backplane Controllers
Backplane controllers in legacy central-office and PBX systems use the MC68MH360VR25VL's external bus arbiter and DRAM controller to manage shared backplane memory. The CPU32+ core arbitrates bus mastership between on-chip DMA, external masters, and the CPM. The 357-PBGA package exposes the full bus and arbitration pin set, which smaller BGA variants cannot. Designers favor this part for field-proven reliability and broad firmware support across telecom OEMs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC68MH360VR25VL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC68MH360VR25L | MC68MH360VR25LR2 | MC68EN360VR25VL | MC68EN360VR25L | MC68360ZQ25VL |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (ZQ package) - same BGA, different ball map |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Core Architecture | CPU32+ | CPU32+ | CPU32+ | CPU32+ (Enhanced) | CPU32+ (Enhanced) | CPU32+ |
| Ethernet | 10 Mbps (1) | 10 Mbps (1) | 10 Mbps (1) | 10/100 Mbps (1) | 10/100 Mbps (1) | 10 Mbps (1) |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Packaging Format | Tray | Tray | Reel (R2 = 2000 pcs) | Tray | Tray | Tray |
| Lifecycle Status | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy |
주요 차별점
- Integrated Communications Processor Module (CPM) with QMC engine (vs MC68EN360VR25VL)
- Tray packaging for prototype and low-volume production (vs MC68MH360VR25LR2)
- Standard 10 Mbps Ethernet MAC for cost-sensitive designs (vs MC68EN360VR25VL)
설계 노트
The 357-ball PBGA (25 x 25 mm) requires 0.8 mm ball pitch and a 4-6 layer PCB stack-up with continuous reference planes under the BGA to control impedance for the external bus and Ethernet MAC signals. Place all decoupling capacitors within 2 mm of the corresponding balls per NXP M683xx hardware design guidelines. Use a microvia-in-pad or dog-bone fanout with via-in-pad plating for reliable BGA breakout on standard 0.1 mm dielectric stack-ups.
The MC68MH360VR25VL requires sequenced power: the 3.3 V core rail must ramp before the I/O ring to avoid bus contention on the integrated DRAM controller and external bus. Use a reset supervisor such as the DS1231 or MAX811 to hold the part in reset until both rails are within tolerance. Estimated: at 25 MHz and typical 1.2 W core power, plan for a 3.3 V regulator rated at least 1.5 A with adequate thermal margin at the highest operating temperature.
Estimated: at 3.3 V core supply and 25 MHz, the MC68MH360VR25VL dissipates approximately 1.2 W typical, which can rise to 1.8 W under full CPM load. The 357-PBGA package's theta_JA of roughly 18 C/W (with adequate PCB copper) requires thermal vias under the die-attached balls to keep junction temperature below 125 C at 70 C ambient. For sealed enclosures, derate by 20 percent or add heat-spreader copper to the top of the package.
Route the Ethernet MII signals (TXD/RXD, TX_CLK, RX_CLK, CRS, COL) as a matched-length group within 50 mil of each other to keep the 10 Mbps MAC timing within specification. Keep the DRAM address/clock group matched and isolated from the SCC serial output drivers to reduce crosstalk. Reference the manufacturer datasheet's hardware design chapter for the canonical layout and decoupling scheme before tape-out.
Do not assume the MC68360ZQ25VL is a drop-in replacement for the MC68MH360VR25VL even though both share 357-ball BGA; the ZQ suffix denotes a different ball map per the Utmel comparison data. Always check the silicon revision mask and ball-map against the target PCB before re-spinning a layout. Also note that reel-pack variants (R2 suffix) differ only in packaging format, not in silicon behavior, so firmware is identical.
규정 준수 정보
RoHS-compliant and lead-free per distributor listing (DigiKey / digchip.com). AEC-Q100 not applicable for legacy telecom MPU. Halogen-free status not explicitly stated in the verified data; set to unknown.
