MC8641VU1500KE557 - PowerPC e600 2-Core 1.5GHz MPU | NXP
부품 번호: MC8641VU1500KE557 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $225 | $22,500.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $178 | $178,000.00 |
MC8641VU1500KE557 개요
A microprocessor (MPU) is a single-chip or multi-core central processing unit that fetches, decodes, and executes machine instructions from external memory. Within the broader hierarchy, the MC8641VU1500KE557 sits in the PowerPC e600 family -> Power Architecture microprocessors -> 32-bit embedded MPU -> high-performance computing IC. The MPC86xx series historically targeted routers, switches, RAID controllers, and military/aerospace platforms, providing deterministic performance that contemporary ARM SoCs could not match in the late 2000s.
Key features include dual e600 cores with AltiVec SIMD support, integrated L1 caches per core, a large shared L2 cache, a 64-bit on-chip coherent fabric, integrated DDR2 memory controller, integrated PCI Express and RapidIO serial interfaces, four Gigabit Ethernet MACs, and hardware-assisted SMP coherency. The 1.05 V core supply reduces power consumption while preserving GHz-class throughput.
The architecture combines superscalar out-of-order execution with the AltiVec vector unit, enabling strong performance per MHz on signal-processing workloads. The integrated memory and I/O controllers eliminate the need for a separate northbridge, reducing BOM cost and latency. The platform targets applications where deterministic response and ECC memory integrity matter more than absolute single-thread performance.
Typical applications include high-end enterprise routers and switches, telecom baseband processing, network-attached storage controllers, military/aerospace mission computers, industrial automation controllers, and high-performance imaging systems. Drop-in variants exist at different core counts (single-core vs dual-core), cache sizes, and speed grades.
When designing with this MPU, allocate a minimum of six PCB layers for power/ground integrity, follow NXP's thermal management guidelines for FCCBGA packages, and use ECC memory to maintain data integrity. Layout must respect the BGA escape routing rules; impedance-controlled differential pairs are required for SERDES lanes.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the MC8641VU1500KE557 not found in the manufacturer datasheet alone.
드롭인 대체품: MC8641VU1500KE557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC8641VU1333KE557
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC8641VU1000KE557
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8641DTHX1500KE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC8641VU1500KE557 최대 정격 & 전기적 특성
| Series | PowerPC e600 (MPC86xx) |
| Core Processor | PowerPC e600 |
| Core Count | 2 (Dual-Core) |
| 데이터 버스 폭 | 32-Bit |
| Maximum Clock Speed | 1.5 GHz |
| 동작 공급 전압 | 1.05 V core |
| Package Type | FCCBGA-1023 (33 x 33 mm) |
| 핀 수 | 1023 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes (per verified distributor data) |
| Integrated Memory Controller | DDR2 (per MPC86xx family) |
MC8641VU1500KE557 fccbga-1023 (33 x 33 mm) 핀 구성 가이드
MC8641VU1500KE557(fccbga-1023 (33 x 33 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC8641VU1500KE557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC8641VU1500KE557 적합 용도: 6 애플리케이션s: Enterprise Router / Switch Control Plane, Telecom Baseband Processing, Network-Attached Storage (NAS) Controllers, Military / Aerospace Mission Computer, Industrial Automation / Machine Control, High-Performance Imaging / Surveillance.
Enterprise Router / Switch Control Plane
The MC8641VU1500KE557's dual PowerPC e600 cores at 1.5 GHz provide the symmetric multiprocessing throughput required to run control-plane routing protocols such as OSPF and BGP on enterprise-class routers and L2/L3 switches. The integrated DDR2 memory controller with ECC preserves routing-table integrity under sustained load, while the integrated Gigabit Ethernet MACs reduce external chip count. Engineers choose this part for designs that must run legacy firmware stacks without re-validation on newer architectures.
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Telecom Baseband Processing
In telecom baseband line cards, the MC8641VU1500KE557 handles DSP-like packet-processing tasks using its AltiVec SIMD unit, which can accelerate channel-coding and FEC workloads. The integrated PCI Express and RapidIO SERDES interfaces let the MPU connect to baseband framer ASICs and DSP clusters without external glue logic. Dual-core support allows one core to run the RTOS scheduler while the other handles time-critical PHY interrupts.
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Network-Attached Storage (NAS) Controllers
The MC8641VU1500KE557 is well suited to mid-range NAS and RAID controllers because the dual e600 cores can split file-system and RAID-engine workloads, while the integrated DDR2 controller with ECC maintains data integrity across drive failures. The hardware-coherent fabric between cores avoids software-cache-coherency overhead in high-IOPS workloads. Compared to newer ARM SoCs, the part offers more deterministic latency under sustained write loads.
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Military / Aerospace Mission Computer
Defense and aerospace mission computers favor the MC8641VU1500KE557 because PowerPC e600 is a long-lived, deterministic CPU architecture with mature MIL-spec toolchains and ruggedized variants available. The integrated memory controller with ECC and the dual-core coherency fabric support the high-reliability fault-tolerant operating systems common in mission-critical avionics and ground-vehicle computers. Industrial temperature grades are available within the same package for harsh-environment deployments.
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Industrial Automation / Machine Control
Factory automation controllers and PLCs benefit from the MC8641VU1500KE557's deterministic interrupt response and AltiVec-driven signal-processing throughput, which lets the same MPU run motion-control loops and vision-inspection pre-processing concurrently. The integrated Gigabit Ethernet and SERDES interfaces provide the fieldbus and industrial-Ethernet connectivity required by modern Industry 4.0 designs without external bridge chips.
추천
High-Performance Imaging / Surveillance
Surveillance video servers and medical imaging systems leverage the MC8641VU1500KE557's AltiVec SIMD engine to accelerate JPEG/H.264 pre-processing and image-pipeline operations on multiple video streams simultaneously. Dual-core coherency allows one core to handle camera ingestion while the second runs analytics, and the integrated DDR2 ECC controller protects against bit-rot in long-term video archives.
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추천 제품 요약
엔지니어링 참조 데이터: MC8641VU1500KE557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC8641VU1333KE557 | MC8641VU1000KE557 | MPC8641DTHX1500KE |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) |
| Core | Dual PowerPC e600 | Dual PowerPC e600 | Dual PowerPC e600 | Dual PowerPC e600 |
| Clock Speed | 1.5 GHz | 1.333 GHz (-11%) | 1.0 GHz (-33%) | 1.5 GHz (identical) |
| Data Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| Temperature Grade | Commercial (per -KE suffix) | Commercial | Commercial | Industrial (-THX grade) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- 1.5 GHz maximum speed grade in dual-core variant (vs MC8641VU1333KE557)
- Same 1.5 GHz speed at industrial temperature grade (vs MPC8641DTHX1500KE)
- Dual-core e600 vs single-core e600 (vs MC8641VU1500KE (single-core variant))
설계 노트
Estimated: at 1.05 V core and 1.5 GHz dual-core operation, the FCCBGA-1023 power dissipation typically falls in the 15-25 W range per MPC86xx family datasheets. Designers must allocate a minimum 4-layer PCB with continuous ground planes beneath the BGA and follow NXP's thermal-management reference design; junction-temperature monitoring via on-die thermal diode is required for safety-critical deployments.
The 1023-ball FCCBGA at 33x33 mm requires at least a 6-layer PCB with microvia or via-in-pad construction for inner-row ball escape. Maintain 100-ohm differential impedance for SERDES pairs (PCIe, RapidIO) and 50-ohm single-ended for the DDR2 address/command bus. Per NXP hardware-specifications document, place decoupling capacitors on the bottom side directly beneath the BGA footprint within 5 mm of each power pin.
Estimated: because the MC8641VU1500KE557 has been obsolete since approximately 2011, designers frequently encounter counterfeit or remarked parts from unauthorized distributors. Always request lot-traceability documentation, perform incoming x-ray inspection of the BGA balls, and validate against the original Freescale/NXP marking spec. Verify RoHS/REACH compliance for the specific lot rather than relying on the datasheet declaration alone.
규정 준수 정보
RoHS compliance confirmed via JLCPCB and DigiKey third-party distributor data; REACH, halogen-free, and conflict-minerals declarations should be requested from the supplier for the specific lot because the part is obsolete.
