MC9S08DN16ACLC - 40MHz 16KB 8-Bit MCU | NXP | 32-LQFP
부품 번호: MC9S08DN16ACLC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.3343 | $5.33 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MC9S08DN16ACLC 개요
A microcontroller integrates a processor core, program memory, data memory, peripherals, interrupt control, and debug or emulation resources on one semiconductor device. The S08 family targets automotive and industrial embedded systems where deterministic control, low pin count, and communication peripherals are valuable. MC9S08DN16ACLC belongs to the broader semiconductor hierarchy: MCU, embedded processor, 8-bit microcontroller, and S08DN device.
The principal verified features are a 40 MHz maximum clock, 20 MHz bus operation, 16 KB Flash organized as 16K x 8, 512 B RAM, an S08 core, an 8-bit data bus, and a 32-LQFP package measuring 7 x 7 mm. The integrated communication set includes LIN, I2C, and SPI. A cited HCS08-family source also identifies support for as many as 32 interrupt or reset sources, although device-specific applicability must be confirmed against the exact manufacturer documentation.
Technically, the MCU combines a relatively high-frequency 8-bit core with modest on-chip memory, making it appropriate for compact control logic rather than high-memory graphical workloads. Its bus speed is half the stated 40 MHz CPU frequency, a useful constraint when timing peripherals or external bus transactions. The 8-bit data architecture simplifies peripheral integration while limiting throughput compared with modern 16-bit or 32-bit MCUs.
Typical uses include LIN-connected automotive modules, industrial sensors, compact motor or actuator controllers, communication bridges, and embedded control panels. I2C suits low-speed sensors and EEPROMs, SPI supports faster peripherals, and LIN provides a vehicle-network-oriented serial interface when its electrical transceiver is implemented externally.
Designers should preserve the 20 MHz bus constraint, confirm every peripheral and pin against the exact datasheet, and design the LIN physical layer separately when the MCU is used in a vehicle network. Current distributor information lists the device in 32-LQFP, but exposed operating limits, pin names, timing values, and package thermal details require exact manufacturer data.
This page consolidates verified NXP and distributor information with selection guidance, application fit, interface considerations, and drop-in-replacement validation. It distinguishes confirmed values from parameters that still require datasheet confirmation, helping engineers avoid treating search snippets as a substitute for the exact MC9S08DN16ACLC datasheet.
드롭인 대체품: MC9S08DN16ACLC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08DN16ACLC (동일 폼 팩터 및 풋프린트) — 차이점: Package, RAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08DN16ACLC
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S08DN16ACLC 최대 정격 & 전기적 특성
| Product Type | 8-bit microcontroller |
| Core Architecture | S08 |
| Maximum CPU Frequency | 40 MHz |
| Bus Frequency | 20 MHz |
| 데이터 버스 폭 | 8 bit |
| Flash Memory | 16 KB (16K x 8) |
| RAM | 512 B |
| LIN Connectivity | Yes |
| I2C Interface | Yes |
| SPI Interface | Yes |
| 패키지 | 32-LQFP (7 x 7 mm) |
| 핀 수 | 32 pins |
| 실장 유형 | Surface mount |
| Instruction Set | HCS08 instruction set with BGND instruction |
| Maximum Interrupt and Reset Sources | Up to 32 sources |
| Embedded Emulation and Debug | Supported by the cited HCS08 family information |
MC9S08DN16ACLC 32-lqfp (7 x 7 mm) 핀 구성 가이드
MC9S08DN16ACLC(32-lqfp (7 x 7 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC9S08DN16ACLC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC9S08DN16ACLC 적합 용도: 6 애플리케이션s: LIN-Connected Automotive Control Module, Industrial Sensor Interface, Compact Communication Bridge, Actuator and Small Motor Controller, Battery-Powered Sensor Hub, Industrial HMI and Keypad Controller.
LIN-Connected Automotive Control Module
The MC9S08DN16ACLC fits a compact LIN node because NXP identifies LIN connectivity alongside a 40 MHz S08 core, 16 KB Flash, and 512 B RAM. The MCU can execute control logic, monitor inputs, and drive actuators while communicating through a dedicated LIN transceiver. Its 20 MHz bus must be considered when timing communication and control tasks. This is a suitable architectural starting point for body, seat, climate, or sensor modules where memory demand is modest and deterministic embedded behavior is important. Production qualification still depends on verifying the exact electrical limits, temperature grade, LIN timing parameters, and external transceiver requirements in the device documentation.
추천
Industrial Sensor Interface
The MC9S08DN16ACLC can consolidate readings from slower digital sensors and compact control logic because it provides 512 B RAM, 16 KB Flash, I2C, and SPI. I2C is useful for compatible sensors and memory devices, while SPI provides a faster path for peripherals that need greater transfer throughput. The 40 MHz core can support responsive state-machine-based measurement, and the 8-bit data bus aligns with many compact sensor registers. Design work should verify exact multiplexed pin assignments, peripheral instance availability, timing values, and electrical limits before assigning sensors to specific pins.
추천
Compact Communication Bridge
With both I2C and SPI, the MC9S08DN16ACLC can bridge sensors or memory devices to a higher-level communications processor. Its 16 KB Flash and 512 B RAM are appropriate for protocol framing, buffering, and a compact control layer rather than demanding applications. The MCU executes instructions at up to 40 MHz through a 20 MHz bus, which must be reflected in timing budgets. Engineers should avoid assuming arbitrary pin remapping and should confirm the exact peripheral channels, alternate functions, interrupt vectors, and electrical constraints in the manufacturer documentation.
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Actuator and Small Motor Controller
The MC9S08DN16ACLC is suitable for basic actuator, valve, or small-motor control where firmware must combine serial configuration with deterministic output sequencing. Its 40 MHz S08 core offers more headroom than many simpler 8-bit controllers, while 16 KB Flash can hold application code and 512 B RAM can support local state. The 32-LQFP package also exposes more pins than a minimal controller. Motor-drive circuitry remains external, so developers must verify available timer channels, PWM features, pin assignments, and protection requirements for the exact device before selecting the MCU.
추천
Battery-Powered Sensor Hub
The MC9S08DN16ACLC can serve as a low-to-moderate-complexity sensor hub because it combines serial sensor connectivity with compact 16 KB Flash and 512 B RAM. I2C supports compatible low-speed sensors, while SPI can accommodate higher-rate devices. The exact low-power modes, active current, sleep current, and wakeup sources were not supplied, so battery-life claims require measurement and exact datasheet confirmation. A successful design should isolate unused peripherals, manage clock and bus activity, and use the MCU's documented low-power modes only after their wakeup behavior and timing are verified.
추천
Industrial HMI and Keypad Controller
The MC9S08DN16ACLC can manage a compact keypad, indicator logic, status display, and serial configuration in a small human-machine interface. Its 40 MHz S08 core provides processing margin, while 16 KB Flash supports menu logic and 512 B RAM can hold short input and display buffers. I2C is useful for compatible displays or expanders, and SPI can serve faster display or storage peripherals when supported by the exact pin map. Engineers must confirm available I/O count, interrupt behavior, display timing, and pin multiplexing because the supplied data does not provide the complete pinout.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08DN16ACLC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08DN16ACLC |
|---|---|---|
| Package | 32-LQFP (7 x 7 mm) | 32-LQFP (7 x 7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | S08, 8-bit | S08, 8-bit |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 16 KB (16K x 8) | 16 KB (16K x 8) |
| RAM | 512 B | 512 B |
| Serial Interfaces | LIN, I2C, SPI | LIN, I2C, SPI |
| Unit Price | USD 5.3343 as of 2026-10-21 | USD 5.3343 reference listing as of 2026-10-21 |
주요 차별점
- Verified communication-interface combination (vs MC9S08QE32CLCR)
- Known CPU and bus timing relationship (vs MC9S08AC60CPUE)
- Verified compact package footprint (vs MC9S08QE32CLCR)
설계 노트
Design the supply rail only after confirming the exact MC9S08DN16ACLC voltage limits and external component recommendations in the manufacturer documentation. Place required bypass capacitors at the specified power pins with short ground returns, and keep switching-regulator or motor-driver nodes away from sensitive communication traces. Because the supplied data does not state current consumption or operating voltage, do not calculate regulator headroom or thermal margins from assumed values.
Treat LIN, SPI, and I2C as separate physical routing domains. SPI traces should be short and impedance controlled where the clock rate requires it; I2C should follow its rise-time and pull-up requirements; LIN requires a suitable external transceiver, bus protection, and compliant termination. Preserve current firmware timing around the verified 20 MHz bus and validate edge rates, capacitance, and grounding in the final board.
Use the manufacturer 32-LQFP land pattern and verify pin 1 orientation from the exact package drawing before routing. Decouple power pins close to their associated ground reference and route high-current actuator or transceiver outputs away from the MCU. A solid, uninterrupted ground strategy reduces return-path discontinuities, but pad geometry, exposed thermal requirements, and assembly rules must follow the official package documentation rather than a generic 32-LQFP footprint.
Do not substitute a similarly named HCS08 device merely because it has a 32-pin package. A true drop-in replacement must preserve the exact pinout, alternate functions, power pins, reset and debug behavior, interrupt mapping, memory organization, peripheral set, electrical ratings, and firmware compatibility. MC9S08QE32CLCR appeared only in a comparison result and is not approved as a replacement by the evidence supplied.
규정 준수 정보
The supplied market results do not explicitly provide part-specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Automotive-market positioning in a cited family description is not treated as evidence that this exact ordering code is AEC-Q100 qualified.