MC9S12DB128BCPV - 16-Bit 25MHz 128KB Flash HCS12 MCU | NXP
부품 번호: MC9S12DB128BCPV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.75 | $207.50 |
| 100 | $18.9 | $1,890.00 |
| 500 | $16.5 | $8,250.00 |
| 1,000 | $14.2 | $14,200.00 |
MC9S12DB128BCPV 개요
An MCU (microcontroller unit) is a single-chip computer that combines a processor core, program memory (Flash), working memory (RAM), and a configurable set of peripherals on one die. Within the broader IC hierarchy, an MCU sits inside Embedded Microcontrollers, which are themselves a category of Integrated Circuits. The HCS12 family from NXP is a 16-bit CISC core derived from the original Motorola HC12 architecture, optimized for deterministic real-time control in automotive body and chassis applications.
Key features include the 25 MHz bus clock (effectively 50 MHz via internal PLL on related HCS12 derivatives), background debug mode (BDM) for non-intrusive in-circuit programming, and on-chip voltage regulation for single 5V supply operation. The 10-bit successive-approximation ADC with 8 channels supports 6 us analog software, 6-bit conversion at full speed, while the msCAN module complies with CAN 2.0A/B for body-network communication. Hardware timers include a 16-bit pulse accumulator and PWM channels suitable for motor and lighting control.
The HCS12 architecture uses a 16-bit data path with variable-length instructions, a hardware stack pointer, and interrupt-friendly indexed addressing. On-chip Flash supports in-application reprogramming via BDM or the in-application programming (IAP) routine, enabling firmware updates in the field. The 112-LQFP package exposes nearly all HCS12 pins including dedicated CAN TX/RX, SCI TX/RX, SPI MOSI/MISO/SCK and the BDM BKGD and MODC pins.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, industrial CAN nodes, and seat/mirror/window control ECUs. The msCAN peripheral and 5V-tolerant I/O make the device well matched to 12V automotive body electrical environments where robust in-vehicle networking and deterministic response to sensor inputs are required.
When designing with this part, ensure proper decoupling (100 nF ceramic per VDD pin, 10 uF bulk at the regulator output) and follow the BDM layout recommendations in the HCS12 family reference manual. The device is qualified for industrial temperature operation; select the -BCPV suffix variant for 0 to +70C ambient or -BCPV suffix with the automotive grade ordering code for -40 to +125C.
This page synthesizes the manufacturer datasheet, distributor pricing, drop-in same-package alternatives and practical design notes that are not co-located on the official NXP product folder, providing an information-gain reference for engineers selecting a 16-bit automotive MCU.
드롭인 대체품: MC9S12DB128BCPV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12DB128BCPV (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, RAM Size, RoHS Status, Package, Debug Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12DG128BCPV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12DT128BCPV
✅ 드롭인✓ 재고 있음
$18.45 / 개
데이터시트 보기 →MC9S12A128BCPV
✅ 드롭인✓ 재고 있음
$9.95 / 개
데이터시트 보기 →MC9S12DB128CPV
✅ 드롭인✓ 재고 있음
$10.95 / 개
데이터시트 보기 →MC9S12DG128CPVER
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12DP512CCPV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12DB128BCPV 최대 정격 & 전기적 특성
| Core | HCS12 (16-bit CISC) |
| CPU Bit Width | 16-bit |
| Bus Clock (max) | 25 MHz |
| Program Memory | 128 KB (128K x 8) Flash |
| RAM | 8 KB |
| EEPROM | 2 KB |
| 패키지 | 112-LQFP (20 x 20 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 C to +105 C (industrial) |
| 공급 전압 | 5 V (single supply, on-chip regulator) |
| ADC | 8-channel, 10-bit, ~6 us conversion |
| CAN | 1 x msCAN 2.0 A/B |
| SCI (UART) | 1 x SCI (asynchronous) |
| SPI | 2 x SPI |
| IIC | 1 x IIC (inter-IC bus) |
| PWM Channels | Up to 7 channels (8-bit or 16-bit) |
| Debug Interface | BDM (Background Debug Mode) |
| RoHS 상태 | Compliant (lead-free LQFP) |
MC9S12DB128BCPV 112-lqfp (20 x 20 mm) 핀 구성 가이드
MC9S12DB128BCPV(112-lqfp (20 x 20 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC9S12DB128BCPV.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC9S12DB128BCPV 적합 용도: 6 애플리케이션s: Automotive Body Control Module, HVAC Control Module, Instrument Cluster MCU, Industrial CAN Node, Seat / Mirror / Window ECU, Lighting Control Module.
Automotive Body Control Module
The MC9S12DB128BCPV is purpose-built for body-control ECUs: with 128 KB Flash / 8 KB RAM, an msCAN 2.0A/B interface, 8-channel 10-bit ADC and 7 PWM channels, it integrates lighting, door-lock, mirror and wiper logic on one chip. The HCS12 core's deterministic interrupt response and 25 MHz bus clock handle the multi-tasking load of CAN body-net messages while the on-chip 5V regulator and AEC-Q100 industrial-grade temperature rating let the module live directly on a 12V battery rail with minimal external conditioning. Pair the device with TJA1050 or TJA1040 CAN transceivers for a complete body-network node.
추천
HVAC Control Module
The MC9S12DB128BCPV suits HVAC control modules that read multiple temperature/pressure sensors via its 8-channel 10-bit ADC, drive blower and mode-door motors via PWM, and communicate with the body CAN network via msCAN. The HCS12 core's 16-bit math and 25 MHz clock handle proportional control loops on temperature while leaving cycles for CAN stack and diagnostics. The 112-LQFP (20x20 mm) footprint gives PCB designers enough board area for power conditioning and relay drives in a tightly packed HVAC housing.
추천
Instrument Cluster MCU
The MC9S12DB128BCPV drives instrument clusters by handling gauge stepper or DC-motor control via PWM, capturing speed/RPM via pulse accumulator timers, and pushing the cluster state onto CAN as a body-network node. With 128 KB Flash and 8 KB RAM, the HCS12 firmware can host gauge-damping algorithms and basic on-board diagnostics without external memory. The 112-LQFP package provides the GPIO count required for stepper motors, warning-LED drivers and backlight dimming simultaneously, replacing what previously needed two 8-bit MCUs.
추천
Industrial CAN Node
Industrial CAN nodes on CANopen or DeviceNet benefit from the MC9S12DB128BCPV's msCAN 2.0A/B peripheral and 16-bit HCS12 core that runs CANopen stacks efficiently at 25 MHz. The 128 KB Flash / 8 KB RAM comfortably host CiA 401/402/403 profiles, while the 8-channel 10-bit ADC handles analog sensor inputs (temperature, pressure, level) and the PWM channels drive proportional valves or heaters. Industrial temperature -40 C to +105 C rating makes the part suitable for factory-floor enclosures.
추천
Seat / Mirror / Window ECU
Power-seat, mirror and window ECUs use the MC9S12DB128BCPV's PWM channels and ADC to drive brushed-DC or memory-position motors while the msCAN peripheral keeps the body network informed of switch events. The HCS12 deterministic interrupt latency ensures that switch de-bounce, motor-current sensing and stall detection all respond within a tight cycle budget. The 112-LQFP (20x20 mm) package fits the compact ECU housing while exposing enough GPIO for switch matrices and motor-H-bridge control signals.
추천
Lighting Control Module
Exterior and interior lighting modules use the MC9S12DB128BCPV's PWM channels for LED dimming and headlamp leveling, msCAN for body-network commands, and the 10-bit ADC for current monitoring of LED strings. The 7-channel PWM at 8-bit or 16-bit resolution handles headlamp, DRL, fog and interior lighting fade-in/fade-out sequences. Industrial temperature operation lets the part live in the headlamp or tail-lamp housing where ambient can climb above 85 C, while the 112-LQFP package simplifies PCB thermal layout.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12DB128BCPV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12DG128BCPV | MC9S12DT128BCPV | MC9S12A128BCPV | MC9S12DB128CPV | MC9S12DP512CCPV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Core / Bit Width | HCS12 / 16-bit | HCS12 / 16-bit | HCS12 / 16-bit | HCS12 / 16-bit | HCS12 / 16-bit | HCS12 / 16-bit |
| Bus Clock (MHz) | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash (KB) | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 512 KB |
| RAM (KB) | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 32 KB |
| EEPROM (KB) | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 4 KB |
| CAN (msCAN) | 1 x msCAN 2.0A/B | 1 x msCAN 2.0A/B | 1 x msCAN 2.0A/B | 1 x msCAN 2.0A/B | 1 x msCAN 2.0A/B | 2 x msCAN 2.0A/B |
| ADC | 8-ch / 10-bit | 8-ch / 10-bit | 8-ch / 10-bit | 8-ch / 10-bit | 8-ch / 10-bit | 16-ch / 10-bit |
| Approx. Qty-100 Price (USD) | $18.90 | ~$18.50 | ~$19.50 | ~$17.80 | ~$18.90 | ~$26.00 |
주요 차별점
- On-chip 5V regulator with single-supply operation (vs MC9S12A128BCPV (earlier mask revision))
- Higher peripheral integration at lower price point (vs MC9S12DP512CCPV)
- Better PWM/timer peripheral mix for body-control applications (vs MC9S12DG128BCPV)
설계 노트
The MC9S12DB128BCPV has an on-chip 5V regulator but still requires careful decoupling: place a 100 nF X7R ceramic on every VDD pin, a 10 uF bulk tantalum or ceramic at the regulator output (VDDR), and a 10 uF + 100 nF pair at the MCU's VDDX/VSSX pins. Per the NXP HCS12 family reference manual, insufficient decoupling on the VDDR pin can cause core-voltage droop that manifests as BDM communication failures or random resets during high-current load steps. Keep the 5V regulator trace short to minimize inductive drop.
Follow the NXP BDM layout guide for the BKGD and MODC pins: provide a 4.7 kohm pull-up on BKGD to VDDX, place the BDM connector within 150 mm of the MCU, and avoid routing sensitive analog (ADC) traces under switching traces or near the PWM outputs. For CAN applications, keep the CAN_TX/CAN_RX traces short and matched in length, and place the CAN transceiver within 25 mm of the MCU. The 112-LQFP ground pins must all be soldered; floating grounds are the most common cause of EMC test failures on HCS12 designs.
Do not assume all 112-LQFP HCS12 family parts share identical peripheral mappings - the MC9S12DT128B, MC9S12DG128B and MC9S12DB128B have subtle differences in PWM, timer and SCI pin assignments across mask revisions. Always cross-check your firmware's pin configuration against the specific datasheet mask revision (register map), not just the family reference manual. Also note that the device enters stop/ wait mode when STOP instruction is executed - verify that the wake-up sources you need are configured in the appropriate interrupt enable registers before relying on low-power mode.
규정 준수 정보
RoHS-compliant lead-free LQFP package per NXP product page. B-suffix is industrial temperature grade (-40 to +105 C); A-suffix HCS12 variants carry AEC-Q100 automotive qualification. Confirm halogen-free status with your NXP distributor.
