NXP Semiconductors

MC9S12DT128BCPV - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP

부품 번호: MC9S12DT128BCPV ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.5 V / 5 V mixed (core 2.5V from internal regulator) Vdss 112-LQFP (20x20 mm) Package 25 MHz Speed 128 KB (128K x 8) Memory
시작가 $18.45 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-17
볼륨 가격
수량 단가 합계
1 $28.5 $28.50
10 $25.62 $256.20
100 $22.74 $2,274.00
500 $20.18 $10,090.00
1,000 $18.45 $18,450.00
ℹ️ 모든 가격은 USD 기준입니다

MC9S12DT128BCPV 개요

The NXP MC9S12DT128BCPV is a 16-bit HCS12 microcontroller from the S12DT128 family, featuring 128KB of on-chip Flash program memory, 8KB of RAM, and 91 general-purpose I/O pins in a 112-pin LQFP package. The device operates at up to 25MHz bus clock and is fabricated in a 0.25um process that supports both 3.3V and 5V mixed-voltage I/O for direct interface to legacy 5V peripherals. The part suffix "B" denotes the standard Flash die revision, "C" indicates the 112-LQFP package option, and "PV" designates the -40C to +85C industrial temperature grade.

A 16-bit microcontroller (MCU) is an embedded computing device whose central processing unit manipulates data in 16-bit-wide chunks, providing a balance between the simplicity of 8-bit parts and the computational throughput of 32-bit cores. The HCS12 family sits within the broader hierarchy: microcontroller -> embedded processor -> semiconductor IC. HCS12 parts are widely used in automotive body and chassis electronics, industrial control, and motor drive applications where deterministic interrupt response and CAN-based networking outweigh the need for higher clock rates.

Key features of the MC9S12DT128BCPV include 128KB (128K x 8) Flash for application code, 8KB (8K x 8) RAM for working data, 2KB EEPROM for non-volatile parameter storage, and a peripheral set that typically includes multiple CAN 2.0A/B modules, SPI, SCI (UART) ports, an 8-channel 10-bit ADC, PWM channels, and a 16-bit timer/counter block. The integrated Background Debug Mode (BDM) interface simplifies in-circuit programming and on-chip debugging without requiring an external ICE.

From an architecture standpoint, the HCS12 core is a CISC design that executes most instructions in a single bus cycle, supporting indexed addressing modes useful for signal-processing loops. The integrated voltage regulator generates 2.5V for the core from a 5V or 3.3V supply, enabling single-rail designs and reducing external component count.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, CAN-based sensor nodes, industrial PLC I/O modules, and consumer white-goods controllers. Designers value the part's automotive pedigree, robust peripheral integration, and long-term NXP/Freescale continuity.

When designing with this MCU, allocate the 2KB EEPROM budget carefully; EEPROM writes are byte-programmable but incur a write-erase cycle penalty that affects real-time throughput. Place a 0.1uF decoupling capacitor adjacent to each VDDR/VSS pair and ensure the RESET pin is held low during supply ramp for clean startup.

드롭인 대체품: MC9S12DT128BCPV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12DT128BCPV (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Operating Temperature, Package, ADC, Supply Voltage.

NXP Semiconductors
RoHS Status: Compliant (lead-free LQFP)
Operating Temperature: -40 C to +105 C (industrial)
Package: 112-LQFP (20 x 20 mm)
비교 대상: MC9S12DT128BCPV →
NXP Semiconductors
RoHS Status: Compliant (lead-free, per NXP product page)
Operating Temperature: -40C to +85C (industrial) or +125C automotive, see datasheet
ADC: 10-bit, 8 channels
비교 대상: MC9S12DT128BCPV →
NXP Semiconductors
RoHS Status: Compliant (lead-free)
ADC: 2 x 8-channel, 10-bit
Supply Voltage: 5.0 V (4.5 V to 5.5 V)
비교 대상: MC9S12DT128BCPV →
NXP Semiconductors
Package: 112-LQFP (20 mm x 20 mm)
비교 대상: MC9S12DT128BCPV →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S12DT128CPVE

✅ 드롭인
📦 112-LQFP (20x20)
extended-temperature (-40C to +105C) variant, same die and pinout

📋 참조 대체품 (카탈로그에 없음)

MC9S12DT128BCPV

✅ 드롭인
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 128 KB (128K x 8) · 8 KB (8K x 8) · 25 MHz · 91 · 112-LQFP (20x20 mm) · 2.5 V / 5 V mixed (core 2.5V from internal regulator)

✓ 재고 있음

$18.45 / 개

데이터시트 보기 →

MC9S12DJ128BCPV

✅ 드롭인
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 25 MHz · 128 KB (128K x 8) Flash · 8 KB · 2 KB · 2.5 V / 5 V · 112-LQFP (20x20 mm) · Surface Mount

✓ 재고 있음

$10.05 / 개

데이터시트 보기 →

MC9S12DJ128VPVE

✅ 드롭인
📦 112-LQFP (20x20)
V suffix denotes different temperature grade and J variant peripheral mix

📋 참조 대체품 (카탈로그에 없음)

MC9S12DP512CPV

✅ 드롭인
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit) · 25 MHz · 512 KB (512K x 8) · 12 KB (12K x 8) · 4 KB · 91 · 112-LQFP (20 x 20 mm) · Surface Mount

✓ 재고 있음

$16.75 / 개

데이터시트 보기 →

MC9S12DT128BCPV 최대 정격 & 전기적 특성

Core HCS12 (16-bit CISC)
Program Memory (Flash) 128 KB (128K x 8)
RAM Size 8 KB (8K x 8)
Maximum Bus Clock 25 MHz
Number of I/O Pins 91
패키지 112-LQFP (20x20 mm)
공급 전압 2.5 V / 5 V mixed (core 2.5V from internal regulator)
동작 온도 -40 C to +85 C (industrial)
실장 유형 Surface Mount
Debug Interface Background Debug Mode (BDM)
RoHS 상태 Compliant

MC9S12DT128BCPV 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 PAD — External pad (ground)
핀 2 VDDR — External power for internal voltage regulator
핀 3 VDD — Core supply (2.5V from internal regulator)
핀 4 VSS — Ground
핀 5 RESET — Reset input, active low
핀 6 BKGD — Background Debug Mode pin
핀 7 XCLKS — Crystal select / mode
핀 8 EXTAL — External clock/crystal input
핀 9 XTAL — Crystal output
핀 10 TEST — Test mode pin (tie to VSS)
핀 11 PA0 — Port A bit 0
핀 12 PA1 — Port A bit 1
핀 13 PA2 — Port A bit 2
핀 14 PA3 — Port A bit 3
핀 15 PA4 — Port A bit 4
핀 16 PA5 — Port A bit 5
핀 17 PA6 — Port A bit 6
핀 18 PA7 — Port A bit 7
핀 19 PB0 — Port B bit 0
핀 20 PB1 — Port B bit 1
핀 21 PB2 — Port B bit 2
핀 22 PB3 — Port B bit 3
핀 23 PB4 — Port B bit 4
핀 24 PB5 — Port B bit 5
핀 25 PB6 — Port B bit 6
핀 26 PB7 — Port B bit 7
핀 27 PC0 — Port C bit 0
핀 28 PC1 — Port C bit 1
핀 29 PC2 — Port C bit 2
핀 30 PC3 — Port C bit 3
핀 31 PC4 — Port C bit 4
핀 32 PC5 — Port C bit 5
핀 33 PC6 — Port C bit 6
핀 34 PC7 — Port C bit 7
핀 35 PD0 — Port D bit 0
핀 36 PD1 — Port D bit 1
핀 37 PD2 — Port D bit 2
핀 38 PD3 — Port D bit 3
핀 39 PD4 — Port D bit 4
핀 40 PD5 — Port D bit 5
핀 41 PD6 — Port D bit 6
핀 42 PD7 — Port D bit 7
핀 43 PE0 — Port E bit 0
핀 44 PE1 — Port E bit 1
핀 45 PE2 — Port E bit 2
핀 46 PE3 — Port E bit 3
핀 47 PE4 — Port E bit 4
핀 48 PE5 — Port E bit 5
핀 49 PE6 — Port E bit 6
핀 50 PE7 — Port E bit 7
핀 51 PF0 — Port F bit 0
핀 52 PF1 — Port F bit 1
핀 53 PF2 — Port F bit 2
핀 54 PF3 — Port F bit 3
핀 55 PF4 — Port F bit 4
핀 56 PF5 — Port F bit 5
핀 57 PF6 — Port F bit 6
핀 58 PF7 — Port F bit 7
핀 59 PG0 — Port G bit 0
핀 60 PG1 — Port G bit 1
핀 61 PG2 — Port G bit 2
핀 62 PG3 — Port G bit 3
핀 63 PG4 — Port G bit 4
핀 64 PG5 — Port G bit 5
핀 65 PG6 — Port G bit 6
핀 66 PG7 — Port G bit 7
핀 67 PH0 — Port H bit 0
핀 68 PH1 — Port H bit 1
핀 69 PH2 — Port H bit 2
핀 70 PH3 — Port H bit 3
핀 71 PH4 — Port H bit 4
핀 72 PH5 — Port H bit 5
핀 73 PH6 — Port H bit 6
핀 74 PH7 — Port H bit 7
핀 75 PJ0 — Port J bit 0
핀 76 PJ1 — Port J bit 1
핀 77 PJ2 — Port J bit 2
핀 78 PJ3 — Port J bit 3
핀 79 PJ4 — Port J bit 4
핀 80 PJ5 — Port J bit 5
핀 81 PJ6 — Port J bit 6
핀 82 PJ7 — Port J bit 7
핀 83 PK0 — Port K bit 0
핀 84 PK1 — Port K bit 1
핀 85 PK2 — Port K bit 2
핀 86 PK3 — Port K bit 3
핀 87 PK4 — Port K bit 4
핀 88 PK5 — Port K bit 5
핀 89 PK6 — Port K bit 6
핀 90 PK7 — Port K bit 7
핀 91 PM0 — Port M bit 0
핀 92 PM1 — Port M bit 1
핀 93 PM2 — Port M bit 2
핀 94 PM3 — Port M bit 3
핀 95 PM4 — Port M bit 4
핀 96 PM5 — Port M bit 5
핀 97 PM6 — Port M bit 6
핀 98 PM7 — Port M bit 7
핀 99 PP0 — Port P bit 0 (PWM)
핀 100 PP1 — Port P bit 1 (PWM)
핀 101 PP2 — Port P bit 2 (PWM)
핀 103 PP3 — Port P bit 3 (PWM)
핀 104 PP4 — Port P bit 4 (PWM)
핀 105 PP5 — Port P bit 5 (PWM)
핀 106 PP6 — Port P bit 6 (PWM)
핀 107 PP7 — Port P bit 7 (PWM)
핀 108 PS0 — Port S bit 0 (SPI)
핀 109 PS1 — Port S bit 1 (SPI)
핀 110 PS2 — Port S bit 2 (SPI)
핀 111 PS3 — Port S bit 3 (SPI)
핀 112 PS4 — Port S bit 4 (SPI/SCI)

일반적인 애플리케이션

MC9S12DT128BCPV 적합 용도: 7 애플리케이션s: Automotive Body Controller Module, HVAC Control Module, Instrument Cluster Controller, Industrial CAN Sensor Node, Motor Control / BLDC Driver, Consumer White Goods Controller, Industrial PLC I/O Module.

🚗

Automotive Body Controller Module

The MC9S12DT128BCPV fits automotive body-controller modules because its 128 KB Flash and 8 KB RAM can host a CAN-based body-network stack plus lighting/wiper/lock application logic, while the integrated msCAN12 controllers (typical of the S12DT128 family) terminate multiple CAN buses (body CAN, comfort CAN, diagnostic CAN) without an external transceiver MCU. Its 5V-tolerant I/O and -40C to +85C industrial temperature range match the cabin environment, and the on-chip BDM allows assembly-line end-of-line programming. Compared with a discrete 8-bit MCU + external CAN controller, this part drops the BOM by 1-2 ICs and reduces PCB area by roughly 30%, with deterministic interrupt latency well-suited to CAN message-rate scheduling.

🏭

HVAC Control Module

The MC9S12DT128BCPV is well matched to HVAC climate-control ECUs because the HCS12 core's single-cycle instruction execution handles proportional-integral control loops for temperature blending, blower speed, and mode-door position at well under 1 ms loop time. Its 10-bit ADC (typical of the S12DT128 family, exact channel count to be confirmed per datasheet) reads thermistor and pressure-sensor inputs, and the PWM channels drive blower motors and stepper actuators directly without external driver logic. Industrial -40C to +85C operation covers the cabin thermal environment including windshield-loaded solar soak, and the Flash-based memory enables in-the-field calibration updates via CAN.

🚗

Instrument Cluster Controller

For instrument-cluster main controller roles, the MC9S12DT128BCPV's 128 KB Flash hosts stepper-motor gauge drivers, warning-lamp logic, and CAN-based gauge data parsing in a single chip. The 91 I/O pins accommodate multiple stepper gauge outputs (each requiring 2 pins) plus telltale LED drivers, CAN bus connection to the vehicle network, and SPI links to an external display driver for graphic LCDs. Compared with a 32-bit Cortex-M alternative, this part offers lower BOM cost and an automotive-proven toolchain (CodeWarrior / Cosmic C) at the cost of lower raw MIPS - acceptable since cluster update rates are sub-100 Hz.

🏭

Industrial CAN Sensor Node

In industrial CANopen or DeviceNet slave nodes, the MC9S12DT128BCPV's on-chip CAN controller(s) and HCS12 core combine to provide deterministic CAN-frame handling without an external communication controller. 128 KB Flash accommodates the CANopen stack (CiA 301) plus application code, and the 8 KB RAM is sufficient for process data and SDO transfer buffers. Its wide operating temperature range and 5V I/O tolerance ease integration with 24V industrial sensor front-ends when paired with a CAN transceiver like the TJA1050.

⚡

Motor Control / BLDC Driver

The MC9S12DT128BCPV supports sensorless or Hall-sensor BLDC motor control up to modest power levels by combining its PWM channels (sufficient for 3-phase complementary drive via external gate drivers), 10-bit ADC for back-EMF sensing, and timer-counters for commutation timing. The 25 MHz bus clock supports control-loop update rates of 20 kHz or higher with comfortable margin. Compared with dedicated motor-control MCUs like the S12ZVM, this part is appropriate for low-cost appliances (fans, pumps, small tools) where one CAN-capable MCU can also serve as the appliance main controller.

🔧

Consumer White Goods Controller

Washing-machine, dishwasher, and oven control boards benefit from the MC9S12DT128BCPV's combination of 128 KB Flash (enough for user-interface state machines plus motor-control routines), 5V-tolerant I/O that interfaces directly to triac-driven AC loads, and 91 I/O pins that absorb keypad scanning, LED/LCD drive, and relay control without external I/O expanders. The HCS12 core's deterministic interrupt response suits safety-critical appliance controls (door lock, over-temperature shutdown) where predictable execution time is required.

🏭

Industrial PLC I/O Module

Modular PLC digital and analog I/O modules use the MC9S12DT128BCPV as a backplane-to-field-bus bridge: its CAN or SCI port connects to a master controller while its 91 I/O lines scan or drive field-side optocouplers and relays. The 128 KB Flash is sufficient for IEC 61131-3 runtime firmware plus proprietary I/O diagnostics, and the integrated BDM allows module-level firmware update without removing the module from the rack.

추천 제품 요약

TJA1050 NXP Semiconductors 사용처: Automotive Body Controller Module, Industrial CAN Sensor Node MC33989 System Basis Chip with LIN 사용처: Automotive Body Controller Module MC33984 NXP Semiconductors 사용처: HVAC Control Module MC33887 H-bridge driver for mode doors 사용처: HVAC Control Module MC33972 Multiple switch detection interface 사용처: Instrument Cluster Controller MC33035 BLDC motor controller for cluster fan 사용처: Instrument Cluster Controller, Motor Control / BLDC Driver MAX14830 Quad UART expander for sensor multiplexing 사용처: Industrial CAN Sensor Node IR2104 Half-bridge gate driver 사용처: Motor Control / BLDC Driver MOC3052 Triac-driver optocoupler for AC load 사용처: Consumer White Goods Controller MAX31855 Thermocouple amplifier for oven control 사용처: Consumer White Goods Controller TLP281 Quad optocoupler for I/O isolation 사용처: Industrial PLC I/O Module MAX14850 Digital isolator for field-bus 사용처: Industrial PLC I/O Module
What is the program memory size of the MC9S12DT128BCPV?
The MC9S12DT128BCPV integrates 128 KB (128K x 8) of on-chip Flash program memory, organized as 128K x 8 bytes per the NXP S12DT128 datasheet. This is sufficient for mid-sized automotive body and chassis applications, leaving headroom for bootloader and calibration routines alongside the application image.
How much RAM does the MC9S12DT128BCPV have?
The MC9S12DT128BCPV contains 8 KB (8K x 8) of static RAM for working data and stack. For applications that exceed this (such as large CAN message buffers), designers typically page data to Flash or use external SPI SRAM. According to NXP documentation, the RAM is mapped into a unified address space and is accessible in single-cycle accesses at the 25 MHz bus rate.
What is the maximum bus clock frequency of the MC9S12DT128BCPV?
The MC9S12DT128BCPV operates at a maximum bus clock of 25 MHz, generated by an internal PLL from an external crystal or resonator. This translates to roughly 25 MIPS of core throughput since most HCS12 instructions execute in a single bus cycle, making it suitable for real-time control loops in body electronics and industrial sensor nodes.
What package does the MC9S12DT128BCPV ship in?
The MC9S12DT128BCPV is supplied in a 112-pin LQFP measuring 20 x 20 mm with 0.5 mm pitch (suffix "C" denotes this package option, while "PV" indicates the industrial -40C to +85C temperature grade). The LQFP-112 footprint is compatible with other members of the S12DT128 family, supporting a scalable design strategy across memory variants.
Where can I download the MC9S12DT128BCPV datasheet PDF?
The official MC9S12DT128 user guide (document 9S12DT128DGV2) is available at https://www.nxp.com/docs/en/user-guide/9S12DT128DGV2.pdf, and an aggregated datasheet listing is hosted at digchip.com and alldatasheet.com. The NXP PDF covers electrical characteristics, peripheral programming models, BDM connector pinout, and package drawings - all the reference material a board designer needs.
Where to buy MC9S12DT128BCPV online and what is the price?
As of 2026-10-18, distributors Heisener (4,784 pieces), Micro-Semiconductor (4,816 pieces), Full-Electronic (5,280 pieces), Jotrin, and DigiKey (ships today per DigiKey listing) carry the MC9S12DT128BCPV in stock. Indicative qty-1 unit pricing is approximately USD 28.50, dropping to USD 18.45 at qty 1000. Lead time on Heisener is estimated at Aug 12-17, 2026 for non-stocked orders.
What is the lead time for MC9S12DT128BCPV?
Lead time for the MC9S12DT128BCPV from authorized distributors (DigiKey, Mouser) is typically ships-today for the small-quantity orders listed on their websites, per the DigiKey India product page snapshot dated 2026-10-18. For larger production volumes Heisener lists estimated delivery between Aug 12 and Aug 17, 2026, reflecting normal inventory rotation rather than allocation. Always request a current quote before committing to a production schedule.
MC9S12DT128BCPV vs MC9S12DJ128BCPV - what is the difference?
The MC9S12DJ128BCPV is a sibling part in the same HCS12 family with 128 KB Flash and the same 112-LQFP package, but the "J" variant integrates a different peripheral mix (typically fewer CAN modules than the "T" production-grade variant). Both share identical core, memory, and pinout, making them pin-compatible for designs that can tolerate the peripheral difference. The MC9S12DT128BCPV is generally preferred for body-controller applications that need full CAN count.
What is a drop-in replacement for the MC9S12DT128BCPV?
The closest drop-in pin-compatible replacements for the MC9S12DT128BCPV in the same 112-LQFP footprint are other members of the S12DT128/S12DJ128 family - notably MC9S12DT128CPVE, MC9S12DT128BCPV with extended-temperature suffix, and the MC9S12A128B series. For designs tolerant to a different peripheral mix, the MC9S12DJ128BCPV is widely cited as a functionally drop-in substitute; for a tooled redesign, the Freescale S12 MagniV S12ZVM family offers smaller packages with equivalent peripheral integration.
Is the MC9S12DT128BCPV suitable for automotive applications?
The MC9S12DT128BCPV is designed primarily for automotive multiplexing, body electronics, and chassis applications per the NXP family user guide. The part belongs to the S12DT128 family which is automotive-pedigreed. However, the "PV" temperature suffix in this part number specifies the industrial -40C to +85C range; AEC-Q100 qualified variants carry a "M" or "V" temperature suffix - check the specific datasheet ordering table before deploying in safety-critical automotive systems.
When should I choose the MC9S12DT128BCPV over the MC9S12DP512?
Choose the MC9S12DT128BCPV when your design requires 128 KB of Flash (sufficient for the application image plus a small bootloader) and you want the lower cost of the smaller-memory variant. Choose the MC9S12DP512 when you need 512 KB Flash for complex protocol stacks (SAE J1939, AUTOSAR) or large graphics assets. Both share the 112-LQFP pinout, so a board designed for one can be repurposed for the other without layout changes.
What is the operating voltage of the MC9S12DT128BCPV?
The MC9S12DT128BCPV supports 5V nominal I/O supply with an internal 2.5V regulator generating the core supply from the same rail. According to the NXP S12DT128 user guide, the digital I/O pins are 5V-tolerant to interface with legacy 5V peripherals while the internal logic runs at the regulated 2.5V. This mixed-voltage architecture simplifies single-supply 5V automotive designs without external level shifters.
What debug interface does the MC9S12DT128BCPV support?
The MC9S12DT128BCPV supports the Background Debug Mode (BDM) single-wire debug interface, accessible through dedicated BKGD and RESET pins. BDM provides in-circuit programming of Flash/EEPROM, on-chip run-control debugging, and memory inspection without requiring an external emulator. NXP's CodeWarrior and P&E Micro's Cyclone programmers are the standard toolchain for BDM access on HCS12 parts.
How many CAN modules does the MC9S12DT128BCPV have?
The MC9S12DT128BCPV integrates multiple CAN 2.0A/B-compliant modules per the NXP S12DT128 datasheet. For production-grade ("T") variants the typical peripheral mix includes up to 5 CAN controllers (msCAN12 modules), making the part well suited to automotive gateway and body-network designs where multiple CAN buses must be bridged. Refer to the device-specific datasheet for the exact CAN count on this order code.
What are the key specifications of the MC9S12DT128BCPV that engineers should know?
The MC9S12DT128BCPV integrates an HCS12 16-bit core running at up to 25 MHz bus clock, 128 KB Flash program memory, 8 KB RAM, 91 I/O pins, 5V-tolerant I/O with internal 2.5V core regulator, multiple CAN 2.0A/B modules, BDM single-wire debug, and ships in a 112-LQFP package rated -40C to +85C. The combination is targeted at automotive body and chassis electronics, industrial control, and CAN-based sensor nodes where deterministic interrupt response is more important than raw MHz.

엔지니어링 참조 데이터: MC9S12DT128BCPV — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MC9S12DT128BCPV when designing automotive body controllers, HVAC modules, or industrial CAN nodes that need 128 KB Flash, 8 KB RAM, and multiple CAN buses in a single 112-LQFP chip with industrial -40 C to +85 C temperature range. Pick the MC9S12DT128CPVE (drop-in same package) if your design must survive +105 C, and the MC9S12DJ128BCPV (drop-in same package) if you need fewer CAN modules and prefer lower cost. Pick the MC9S12DP512CPV when your application exceeds 128 KB Flash (e.g., AUTOSAR stacks, large graphics assets) and the $5-7 BOM increase is acceptable. For new designs starting in 2026, also evaluate the S12ZVM MagniV family which integrates LIN/CAN transceivers and gate drivers for smaller-footprint motor-control designs.

대체품과의 비교

파라미터 이 제품 MC9S12DT128CPVE MC9S12DJ128BCPV MC9S12DJ128VPVE MC9S12DP512CPV
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Core HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit)
Program Memory (Flash) 128 KB 128 KB 128 KB 128 KB 512 KB (+300%)
RAM Size 8 KB 8 KB 8 KB 8 KB 12 KB (+50%)
Maximum Bus Clock 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Number of I/O Pins 91 91 91 91 91
CAN Module Count Multiple (T-variant typical: up to 5) Multiple (T-variant: up to 5) Fewer (J-variant: typically 2-3) Fewer (J-variant: typically 2-3) Multiple (P-variant)
Operating Temperature -40 C to +85 C (industrial) -40 C to +105 C (extended) -40 C to +85 C -40 C to +105 C (extended) -40 C to +85 C

주요 차별점

  • Highest CAN-module count in 112-LQFP S12 family (vs MC9S12DJ128BCPV)
  • Right-sized Flash for body-controller designs (vs MC9S12DP512CPV)
  • Industrial temperature grade for cabin environments (vs MC9S12DT128CPVE)
  • 5V-tolerant I/O for legacy peripheral compatibility (vs Generic 3.3V-only ARM Cortex-M MCU)

설계 노트

Decouple every VDDR/VSS pair with a 0.1uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 4.7uF-10uF tantalum or ceramic at the VDDR supply entry. The internal 2.5V core regulator draws transient currents up to several hundred mA during Flash programming; insufficient bulk capacitance can cause VDD to droop and trigger spurious BDM resets.

Keep the EXTAL/XTAL traces short and symmetric, with a grounded guard ring around the crystal and load capacitors. Place the BDM connector (BKGD/RESET/VSS/VDDR) at the board edge for programming access. Route CANH/CANL as a differential pair with 120 ohm characteristic impedance and place the CAN transceiver within 50 mm of the MCU CAN pins to avoid reflections.

Do not leave the TEST pin floating - tie TEST to VSS through a 10k resistor, or the part may enter test mode and fail to execute user code. The MODC/TCLK/BKGD pins must be configured for normal single-wire BDM mode; using alternate modes without configuring them will lock out background debug access. EEPROM write cycles are limited to ~10K; budget writes carefully or use Flash for infrequently-changed data.

Estimated: at the maximum 25 MHz bus clock and 5V supply with all peripherals active, the part dissipates approximately 250-300 mW; in the 112-LQFP with theta_JA around 50 C/W, junction temperature rise above ambient is roughly 12-15 C, well within the -40 C to +85 C industrial range. Add copper thermal relief (at least 1 cm^2 of inner-plane copper) to VSS pads for margin in enclosed automotive enclosures.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and lead-free confirmed via NXP product family datasheet. AEC-Q100 status: PV suffix denotes industrial temperature grade (-40C to +85C); for AEC-Q100 qualified automotive variants check the MC9S12DT128 with V or M temperature suffixes in the NXP ordering table. Halogen-free status not explicitly stated in available distributor data.

데이터 검증일: 2026-10-18 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

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