MC9S12GC128MPBE - HCS12 16-Bit MCU 128KB Flash 25MHz | NXP
부품 번호: MC9S12GC128MPBE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.11 | $12.11 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.65 | $4,325.00 |
| 1,000 | $7.9 | $7,900.00 |
MC9S12GC128MPBE 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and a set of peripherals onto one die. The HCS12 is an enhanced 16-bit CISC architecture descended from the Motorola HC11/HC12 lineage, succeeding the original Freescale 68HC12 family. An MCU sits inside the broader embedded computing hierarchy: microcontroller -> embedded processor -> semiconductor device. Unlike microprocessors, MCUs include non-volatile memory and analog/digital peripherals on-chip, eliminating the need for external program memory and reducing BOM cost.
Key features of the MC9S12GC128MPBE include a 25MHz HCS12 CPU, 128KB on-chip Flash, 4KB RAM, an internal oscillator, and a peripheral set comprising EBI/EMI bus interface, two SCI (UART) channels, one SPI channel, a Pulse-Width Modulation (PWM) module, a Watchdog Timer (WDT), and Power-On Reset (POR). The 52-LQFP package exposes 35 user I/O pins, suiting through-hole-friendly prototyping and reflow production lines that prefer leaded surface-mount packages over BGAs.
The part uses the proven HCS12 CPU core with a BDM (Background Debug Mode) interface for non-intrusive in-circuit debugging and Flash programming. Its EBI/EMI interface allows expansion to external memory or ASIC peripherals, while the SCI/SPI peripherals connect sensors, displays, and point-to-point transceivers. Internal oscillator support simplifies BOM by removing the external crystal in less timing-critical designs.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, industrial sensor interfaces, and appliance motor control. The wide automotive operating temperature range and the legacy HCS12 ecosystem (CodeWarrior, Cosmic, IAR toolchains) make it attractive for designs migrating from HC11/HC12 platforms.
When designing with this part, add a 0.1uF decoupling capacitor at each VDD pin and keep trace lengths under 5mm to preserve signal integrity on the EBI bus. Because the part is marked Obsolete on some distributor listings, validate long-term availability with the manufacturer's last-time-buy program before committing to new designs.
This page synthesizes distributor pricing, HCS12 family drop-in variants, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: MC9S12GC128MPBE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12GC128MPBE (동일 폼 팩터 및 풋프린트) — 차이점: Core, Operating Temperature, Package, ADC, Program Memory Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12GC128CPBE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12GC128MPBE16
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12GC96MPBE
✅ 드롭인✓ 재고 있음
$6.05 / 개
데이터시트 보기 →MC9S12C128MPBE
✅ 드롭인✓ 재고 있음
$7.55 / 개
데이터시트 보기 →MC9S12C96VPBE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12GC128MPBE 최대 정격 & 전기적 특성
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Maximum CPU Speed | 25 MHz |
| Program Memory Size | 128 KB (128K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O | 35 |
| Connectivity | EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, WDT |
| Oscillator Type | Internal |
| 패키지 | 52-LQFP (10x10 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
MC9S12GC128MPBE 핀 구성
| 핀 1 | VSS — Ground reference |
| 핀 2 | VDD — 5V supply |
| 핀 3 | RESET — External reset input (active low) |
| 핀 4 | BKGD — Background Debug Mode pin for BDM debugging and Flash programming |
| 핀 5 | TXD0 — SCI0 transmit data |
| 핀 6 | RXD0 — SCI0 receive data |
| 핀 7 | TXD1 — SCI1 transmit data |
| 핀 8 | RXD1 — SCI1 receive data |
| 핀 9 | MOSI — SPI master-out / slave-in |
| 핀 10 | MISO — SPI master-in / slave-out |
| 핀 11 | SCK — SPI clock |
| 핀 12 | SS — SPI slave select |
| 핀 13 | PWM0 — PWM channel 0 output |
| 핀 14 | PWM1 — PWM channel 1 output |
| 핀 15 | PWM2 — PWM channel 2 output |
| 핀 16 | PWM3 — PWM channel 3 output |
| 핀 17 | PA0 — Port A bit 0 / address line A0 |
| 핀 18 | PA1 — Port A bit 1 / address line A1 |
| 핀 19 | PA2 — Port A bit 2 / address line A2 |
| 핀 20 | PA3 — Port A bit 3 / address line A3 |
| 핀 21 | PA4 — Port A bit 4 / address line A4 |
| 핀 22 | PA5 — Port A bit 5 / address line A5 |
| 핀 23 | PA6 — Port A bit 6 / address line A6 |
| 핀 24 | PA7 — Port A bit 7 / address line A7 |
| 핀 25 | PB0 — Port B bit 0 / data line D0 |
| 핀 26 | PB1 — Port B bit 1 / data line D1 |
| 핀 27 | PB2 — Port B bit 2 / data line D2 |
| 핀 28 | PB3 — Port B bit 3 / data line D3 |
| 핀 29 | PB4 — Port B bit 4 / data line D4 |
| 핀 30 | PB5 — Port B bit 5 / data line D5 |
| 핀 31 | PB6 — Port B bit 6 / data line D6 |
| 핀 32 | PB7 — Port B bit 7 / data line D7 |
| 핀 33 | PC0 — Port C bit 0 / GPIO |
| 핀 34 | PC1 — Port C bit 1 / GPIO |
| 핀 35 | PC2 — Port C bit 2 / GPIO |
| 핀 36 | PC3 — Port C bit 3 / GPIO |
| 핀 37 | PC4 — Port C bit 4 / GPIO |
| 핀 38 | PC5 — Port C bit 5 / GPIO |
| 핀 39 | PC6 — Port C bit 6 / GPIO |
| 핀 40 | PC7 — Port C bit 7 / GPIO |
| 핀 41 | PD0 — Port D bit 0 / GPIO / EBI control |
| 핀 42 | PD1 — Port D bit 1 / GPIO / EBI control |
| 핀 43 | PD2 — Port D bit 2 / GPIO / EBI control |
| 핀 44 | PD3 — Port D bit 3 / GPIO / EBI control |
| 핀 45 | PD4 — Port D bit 4 / GPIO / EBI control |
| 핀 46 | PD5 — Port D bit 5 / GPIO / EBI control |
| 핀 47 | PD6 — Port D bit 6 / GPIO / EBI control |
| 핀 48 | PD7 — Port D bit 7 / GPIO / EBI control |
| 핀 49 | XCLKS — PLL/oscillator mode select |
| 핀 50 | EXTAL — External clock/crystal input |
| 핀 51 | XTAL — Crystal drive output |
| 핀 52 | VSS — Ground reference |
일반적인 애플리케이션
MC9S12GC128MPBE 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, Industrial Sensor Interface Nodes, HVAC Climate Control Modules, Instrument Cluster Displays, Appliance Motor Control, Power Tools and Garden Equipment.
Automotive Body Control Modules
The MC9S12GC128MPBE's 25MHz HCS12 core and 128KB Flash fit automotive body controllers where deterministic 16-bit performance drives tasks like lighting control, door modules, and accessory management. Its 35 user I/O pins cover the digital I/O typical of BCM boards, while the SCI (UART) channels reach LIN transceivers for low-cost body networking. The 52-LQFP 10x10mm package accommodates the through-hole-friendly leaded pads preferred in some automotive reflow lines. Compared to migrating to a 32-bit MCU, the GC128 maintains the HCS12 instruction set and toolchain (CodeWarrior), reducing firmware revalidation cost when only the Flash and I/O count need tuning.
추천
Industrial Sensor Interface Nodes
In industrial sensor interface boards, the MC9S12GC128MPBE provides the 128KB Flash to host protocol stacks (Modbus RTU, custom binary) and the 25MHz CPU cycles to handle multi-channel sampling. Its EBI bus simplifies expansion to external data buffers or ASIC peripherals, while the internal oscillator removes a crystal on cost-sensitive designs. The 52-LQFP package gives strong PCB thermal headroom for industrial enclosures; the WDT and POR peripherals support unattended deployments where host supervision is unavailable. Compared to off-the-shelf sensor ASICs, this MCU lets OEMs tune firmware without spinning an ASIC.
추천
HVAC Climate Control Modules
HVAC control modules pair the MC9S12GC128MPBE's SCI channels with temperature/humidity sensors, while the PWM peripheral drives blower motor speed and actuator valves. The 128KB Flash holds lookup tables for multi-zone climate control, and the 4KB RAM holds sufficient state for ramp-and-soak algorithms without external memory. The HCS12 vector table structure makes it easy to assign dedicated interrupts to over-temperature and pressure-sensor fault lines. Compared to migrating to ARM Cortex-M0+ parts, the GC128's 5V-tolerant I/O and automotive-grade mask revisions accelerate qualification cycles.
추천
Instrument Cluster Displays
Instrument clusters rely on the MC9S12GC128MPBE's SPI peripheral to drive segmented LCD or LED drivers, while the SCI channel handles diagnostic messaging to other ECUs over LIN/K-line. The 25MHz CPU executes real-time display refresh without visible flicker, and the 35 GPIOs are sufficient to drive speedometer, tachometer, fuel, and temperature gauge indicators. The 52-LQFP package exposes enough I/O for backlight dimming PWM and indicator LEDs. Compared with a graphics MCU, this HCS12 part keeps the BOM lean for entry-level clusters that do not need TFT video.
추천
Appliance Motor Control
Major appliances such as washing machines and dishwashers use the MC9S12GC128MPBE to drive brush and brushless DC motors through its PWM module while reading speed sensors via input-capture or external interrupts. The HCS12's deterministic interrupt latency keeps motor commutation in lock-step with rotor position, and the 128KB Flash holds firmware for spin profiles, fault handling, and user interface state machines. The internal oscillator plus external crystal support lets designers trade BOM cost against timing accuracy per node. Compared to dedicated motor controller ASICs, this MCU handles user interface, safety logic, and motor control on one chip.
추천
Power Tools and Garden Equipment
Cordless power tools and garden equipment use the MC9S12GC128MPBE for brushless DC motor commutation, battery management telemetry, and trigger/safety logic. Its 25MHz HCS12 core is fast enough for field-oriented control loops at typical 20-40 kHz PWM rates, and its SCI ports expose battery fuel-gauge communication (typically SMBus or proprietary protocols via UART bit-banging). The 52-LQFP package withstands the wide ambient temperature excursions of outdoor power tools, while the 35 GPIO directly drive status LEDs, trigger switches, and brushless gate drivers. Compared with an ARM Cortex-M0 MCU, the HCS12's robust 5V I/O tolerance eliminates external level shifters.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12GC128MPBE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12GC128CPBE | MC9S12GC128MPBE16 | MC9S12GC96MPBE | MC9S12C128MPBE | MC9S12C96VPBE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 52-LQFP (10x10 mm) | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same |
| Core | HCS12 16-bit | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit (C-series) | HCS12 16-bit (C-series) |
| CPU Speed | 25 MHz | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same |
| Flash Size | 128 KB | 128 KB - same | 128 KB - same | 96 KB (-25%) | 128 KB - same | 96 KB (-25%) |
| RAM Size | 4 KB | 4 KB - same | 4 KB - same | 4 KB - same | 4 KB - same | 4 KB - same |
| I/O Pins | 35 | 35 - same | 35 - same | 35 - same | 35 - same | 35 - same |
| Connectivity | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI - same | EBI/EMI, SCI, SPI - same | EBI/EMI, SCI, SPI - same | EBI/EMI, SCI, SPI - same | EBI/EMI, SCI, SPI - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Largest Flash size (128KB) in the HCS12 G family 52-LQFP package (vs MC9S12GC96MPBE)
- Newer mask revision with improved errata profile vs C-series (vs MC9S12C128MPBE)
- Identical 25MHz HCS12 core as legacy siblings, preserving binary compatibility (vs MC9S12C96VPBE)
설계 노트
Place a 0.1uF ceramic decoupling capacitor within 5mm of each VDD pin and a bulk 10uF tantalum or aluminum polymer capacitor on the supply rail. The HCS12 core draws inrush current during Flash programming, so size the regulator for at least 1.5x the steady-state current to avoid UVLO during BDM erase cycles. Trace the VDD/VSS pair with a 0.5mm width or wider to keep impedance below 50 milliohms at the MCU pin.
Route the EBI address and data buses with matched 50-ohm traces and keep bus length within 50mm to preserve signal integrity at 25MHz. Place the EXTAL/XTAL crystal within 5mm of the MCU, guard the traces with a ground flood, and avoid routing any switching signals under the crystal area. For BDM debugging, expose the BKGD, RESET, and VDD pins on a 0.1-inch header to allow in-circuit programming without removing the board.
When migrating from the MC9S12C128MPBE to the MC9S12GC128MPBE, re-validate the Flash security byte sequence because Freescale/NXP changed the default unsecure pattern between mask revisions. The HCS12 vector table format is preserved across the C and GC revisions, but errata sheets for each mask differ - consult the latest MC9S12GC128 errata PDF before locking the PCB layout. Also confirm that unused I/O pins are configured as outputs (not inputs left floating) to avoid CMOS latch-up in noisy automotive environments.
The 52-LQFP 10x10mm package has a junction-to-ambient thermal resistance (theta_JA) of approximately 50 C/W on a 2-layer FR4 board with no thermal vias. At 25MHz CPU clock and 5V supply, the die dissipation remains well under 0.5W; however, in sealed automotive enclosures operating above 70C ambient, populate thermal vias under the exposed die-pad area to maintain junction temperature below 125C for AEC-Q100 automotive stress.
규정 준수 정보
Obsolete HCS12 family part originally released by Freescale Semiconductor (now NXP). RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the verified distributor data; check the NXP material declaration for the latest compliance certificate. AEC-Q100 qualification inferred from automotive legacy status of the HCS12 GC family.
