MC9S12GC96MPBE - 16-Bit 25MHz 96KB Flash HCS12 MCU | NXP
MPN: MC9S12GC96MPBE ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.65 | $10.65 |
| 10 | $9.85 | $98.50 |
| 100 | $8.42 | $842.00 |
| 500 | $7.18 | $3,590.00 |
| 1,000 | $6.05 | $6,050.00 |
MC9S12GC96MPBE Overview
A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash for code, RAM for data, EEPROM for non-volatile parameters), and programmable I/O peripherals. The HCS12 belongs to the 16-bit MCU family in the broader hierarchy of microcontrollers -> embedded processors -> semiconductors, designed for deterministic real-time control in cost-sensitive embedded applications.
Key features include 60 general-purpose I/O lines, an enhanced capture timer (ECT) module with 8 channels, an 8-channel pulse-width modulator (PWM), and a supply voltage range of 2.35V to 2.75V (3.3V typical). The device supports in-circuit programming and in-application programming via the BDM interface, allowing firmware updates without removing the chip from the board.
The architecture uses a 16-bit HCS12 core with a 25 MHz bus clock delivering approximately 25 MIPS, paired with a peripheral coprocessor bus that offloads ADC, timer, and communication tasks from the CPU. The integrated CAN 2.0 controller and SCI/SPI make it well suited for industrial automation nodes that must bridge sensor networks to higher-level controllers.
Typical applications include industrial control nodes, automotive body electronics, CAN-based sensor hubs, motor control boards, and consumer appliance controllers. The 10-bit ADC and PWM modules support direct interfacing with analog sensors and brushed DC or stepper motor drive stages.
Design tip: provide a clean 3.3V analog supply (AVDD) decoupled with 100 nF and 10 uF ceramic capacitors placed within 5 mm of the AVDD pin to preserve ADC accuracy; route digital return currents away from the analog ground reference.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MC9S12GC96MPBE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S12GC96MPBE (same form factor and footprint) — differing in Package, Core Processor, Core, Operating Temperature, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S12GC128MPBE
✅ Drop-In✓ In Stock
$7.9 / Unit
View Datasheet →MC9S12GC64MPBE
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$9.84 / Unit
View Datasheet →MC9S12GC32MPBE
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$14.9905 / Unit
View Datasheet →MC9S12GC96CFAE
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
S9S12G96AMLFR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S12GC96MPBE Maximum Ratings & Electrical Characteristics
| Core | HCS12 (16-bit CPU) |
| Bus Clock Speed | 25 MHz |
| Flash Memory | 96 KB (96K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Data Bus Width | 16-bit |
| Supply Voltage | 2.35 V to 2.75 V (3.3 V typical) |
| I/O Pins | 60 |
| ADC | 10-bit, 16-channel |
| PWM Channels | 8-channel |
| Timers | Enhanced Capture Timer (ECT), 8 channels |
| Communication | 1x CAN 2.0 A/B, 2x SCI (UART), 2x SPI, 1x I2C |
| Package | 52-LQFP / 52-TQFP (10x10 mm) |
| Operating Temperature | -40C to +125C (automotive grade, PBE suffix) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
MC9S12GC96MPBE Pin Configuration
| Pin 1 | VDDR — Voltage regulator supply |
| Pin 2 | VDD1 — Core supply (regulated) |
| Pin 3 | VSS1 — Ground reference |
| Pin 4 | BKGD — Background Debug Mode pin |
| Pin 5 | RESET — External reset input (active low) |
| Pin 6 | XTAL — Oscillator input |
| Pin 7 | EXTAL — Oscillator input |
| Pin 8 | XFC — PLL filter capacitor |
| Pin 9 | VDDPLL — PLL supply |
| Pin 10 | VSSPLL — PLL ground |
| Pin 11 | PAD00 — Port A / ADC channel 0 |
| Pin 12 | PAD01 — Port A / ADC channel 1 |
| Pin 13 | PAD02 — Port A / ADC channel 2 |
| Pin 14 | PAD03 — Port A / ADC channel 3 |
| Pin 15 | PAD04 — Port A / ADC channel 4 |
| Pin 16 | PAD05 — Port A / ADC channel 5 |
| Pin 17 | PAD06 — Port A / ADC channel 6 |
| Pin 18 | PAD07 — Port A / ADC channel 7 |
| Pin 19 | PAD08 — Port B / ADC channel 8 |
| Pin 20 | PAD09 — Port B / ADC channel 9 |
| Pin 21 | PAD10 — Port B / ADC channel 10 |
| Pin 22 | PAD11 — Port B / ADC channel 11 |
| Pin 23 | PAD12 — Port B / ADC channel 12 |
| Pin 24 | PAD13 — Port B / ADC channel 13 |
| Pin 25 | PAD14 — Port B / ADC channel 14 |
| Pin 26 | PAD15 — Port B / ADC channel 15 |
| Pin 27 | VDDA — Analog supply |
| Pin 28 | VSSA — Analog ground |
| Pin 29 | VRH — ADC high reference voltage |
| Pin 30 | VRL — ADC low reference voltage |
| Pin 31 | PWM0 — PWM channel 0 |
| Pin 32 | PWM1 — PWM channel 1 |
| Pin 33 | PWM2 — PWM channel 2 |
| Pin 34 | PWM3 — PWM channel 3 |
| Pin 35 | PWM4 — PWM channel 4 |
| Pin 36 | PWM5 — PWM channel 5 |
| Pin 37 | PWM6 — PWM channel 6 |
| Pin 38 | PWM7 — PWM channel 7 |
| Pin 39 | TxCAN — CAN transmit output |
| Pin 40 | RxCAN — CAN receive input |
| Pin 41 | SCIRX — SCI receive (UART) |
| Pin 42 | SCITX — SCI transmit (UART) |
| Pin 43 | SPSCK — SPI clock |
| Pin 44 | MOSI — SPI master-out/slave-in |
| Pin 45 | MISO — SPI master-in/slave-out |
| Pin 46 | SS — SPI slave select |
| Pin 47 | SDA — I2C data |
| Pin 48 | SCL — I2C clock |
| Pin 49 | TCLK — ECT timer clock input |
| Pin 50 | IOC0 — ECT channel 0 |
| Pin 51 | VDDX — I/O supply (3.3V) |
| Pin 52 | VSSX — I/O ground |
Typical Applications
MC9S12GC96MPBE is suitable for 6 applications: Industrial CAN Sensor Hub, Automotive Body Electronics, Brushless DC Motor Control, Home Appliance Controller, Building Automation Node, Battery-Powered Sensor Data Logger.
Industrial CAN Sensor Hub
The MC9S12GC96MPBE's integrated CAN 2.0 A/B controller and 16-channel 10-bit ADC make it a strong fit for industrial CAN sensor hubs that aggregate analog sensor data and forward it over a CAN bus to a higher-level PLC. The 25MHz HCS12 core delivers sufficient bandwidth to sample 16 ADC channels at 100Hz while handling CAN message buffering, and the 96KB Flash accommodates CANopen or DeviceNet stack plus application code. Per the NXP HCS12GC family datasheet, the SCI/SPI interfaces provide a side-channel for local HMI displays without burdening the CAN link. Place the device between the 5V CAN transceiver (e.g., TJA1050) and the analog sensor front-end, with separate AVDD filtering to preserve ADC accuracy.
Recommended
Automotive Body Electronics
With an automotive-grade temperature range of -40C to +125C (PBE suffix) and an integrated CAN controller, the MC9S12GC96MPBE is well suited to automotive body controllers managing lighting, door modules, or seat controllers. The 96KB Flash supports AUTOSAR-friendly layered software while the 8-channel PWM drives LED dimming or motor direction signals. Per the NXP HCS12GC family datasheet, the ECT module's 16-bit capture capability provides accurate pulse timing for wiper or window position sensing. Compared with general-purpose MCUs, the integrated CAN eliminates an external transceiver-side protocol burden and reduces PCB area.
Recommended
Brushless DC Motor Control
The MC9S12GC96MPBE's 8-channel PWM and Enhanced Capture Timer (ECT) provide the timing primitives required for trapezoidal commutation of brushless DC motors up to a few hundred watts. The HCS12 core's deterministic interrupt latency (per the NXP HCS12GC family datasheet) keeps commutation jitter below 1 microsecond, while the 4KB RAM accommodates lookup tables for sine or commutation patterns. Compared with software-PWM approaches on smaller MCUs, the dedicated PWM module offloads the CPU and leaves cycles for current sensing and protection logic.
Recommended
Home Appliance Controller
In washing machines, dishwashers, or induction cooktops, the MC9S12GC96MPBE consolidates user interface handling, motor control, and safety monitoring into a single chip. The 16-channel ADC reads temperature sensors, water-level probes, and current shunts, while the SCI connects to the user display and the I2C bus talks to EEPROM parameter storage. The 96KB Flash holds the user-interface state machine plus sensor-fusion routines; 4KB RAM is adequate for short log buffers. Per the NXP HCS12GC family datasheet, in-application programming allows firmware updates via the user panel without service-mode intervention.
Recommended
Building Automation Node
The MC9S12GC96MPBE's combination of CAN, SCI, SPI, and I2C interfaces lets it bridge multiple building-automation busses (BACnet MS/TP, Modbus RTU, proprietary sensor links) within a single controller. Its 60 GPIO provide ample headroom for relay drivers, optocoupler inputs, and local status LEDs. Per the NXP HCS12GC family datasheet, the 25MHz bus clock supports BACnet message scheduling without timing overruns even with multiple stacks active, and the wide operating temperature range suits unheated electrical closets.
Recommended
Battery-Powered Sensor Data Logger
Although the HCS12 core is not the lowest-power family, the MC9S12GC96MPBE's 1KB EEPROM and 16-channel ADC suit low-rate data loggers that wake periodically to sample and store values before returning to stop mode. The 96KB Flash stores the wear-leveling log manager plus compression code, while SPI connects to an external Flash card for bulk storage. Per the NXP HCS12GC family datasheet, the chip's stop-mode current is acceptable when the duty cycle is below 1 percent, and the integrated peripherals eliminate several external components.
Recommended
Recommended Products Summary
Engineering reference data for MC9S12GC96MPBE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12GC128MPBE | MC9S12GC64MPBE | MC9S12GC96CFAE | S9S12G96AMLFR |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 52-LQFP (10x10 mm) | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same |
| Flash Memory | 96 KB | 128 KB | 64 KB | 96 KB | 96 KB |
| Bus Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| ADC Channels | 16 (10-bit) | 16 (10-bit) | 16 (10-bit) | 16 (10-bit) | 16 (10-bit) |
| Supply Voltage | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Key Differentiators
- Largest Flash within the GC 52-LQFP family (vs MC9S12GC64MPBE)
- Lower unit cost than the higher-density 128KB variant (vs MC9S12GC128MPBE)
- Pin-compatible with newer SC9S12G successor family (vs S9S12G96AMLFR)
- Higher Flash density than the GC16 in a larger LQFP (vs MC9S12GC16CPBE)
Design Notes
Per the NXP HCS12GC family datasheet, the MCU requires a clean 3.3V supply on VDDX/VDDR with a 100 nF ceramic decoupling capacitor within 5 mm of each pin. The internal voltage regulator (VDDR->VDD1) needs a bulk 10 uF decoupling capacitor on VDD1, plus a smaller 100 nF. Power sequencing is not required between VDDX and VDDR, but RESET must be held low until the oscillator stabilizes.
Estimated: At 25MHz bus clock with all peripherals active, the MC9S12GC96MPBE typically draws ~40 mA from VDDX, dissipating ~130 mW. The 52-LQFP package has theta_JA of approximately 65 C/W, yielding a junction temperature rise of ~8.5 C above ambient at room temperature. No thermal management is needed for normal operation below 85 C ambient; for 125 C automotive ambient a small copper pour on the package footprint is recommended.
Route the analog ground (VSSA) as a separate island tied to digital ground at a single point near the AVDD/VSSA pin pair. Keep ADC analog traces (PADxx, VRH, VRL) away from PWM and switching signals. Per the NXP HCS12GC family datasheet, expose the BKGD pin to a test pad so that in-circuit programming and debug remain accessible after board assembly.
Do not float unused ADC channels internally; tie them to mid-supply (VRH+VRL)/2 or to a known voltage to prevent spurious interrupts. Per the NXP HCS12GC family datasheet, the CAN module requires both TxCAN and RxCAN pins to be configured when CAN is enabled even if the bus is unused. The PLL filter capacitor on XFC must be a low-leakage ceramic (C0G/NP0); X7R is acceptable but degrades PLL jitter.
The HCS12 GC family's SCI, SPI, and CAN outputs have moderate drive strength; for bus runs longer than ~10 cm, add a series 22-33 ohm resistor at the driver pin to dampen reflections. Per the NXP HCS12GC family datasheet, the BKGD pin is sensitive to capacitance; keep the trace shorter than 50 mm or use a buffered debugger interface to avoid debug-session failures.
Compliance Information
RoHS and REACH compliance per NXP product page. Automotive grade temperature (-40C to +125C) is denoted by the PBE suffix but the part is not AEC-Q100 qualified for the strict automotive safety categories; verify with NXP for safety-critical use cases.
