MCIMX27LVOP4A - ARM926 i.MX27 MPU 400MHz 404-LFBGA | NXP
부품 번호: MCIMX27LVOP4A ✗ 단종MCIMX27LVOP4A 개요
An applications processor (AP) is a system-on-chip that integrates a CPU core, memory subsystem, and dedicated hardware accelerators (video, graphics, imaging, connectivity) into a single device. The i.MX27 sits in the ARM926EJ-S class of ARM9 processors, which evolved toward ARM11 (i.MX31/i.MX35), then Cortex-A8/A9 (i.MX51/i.MX6) and Cortex-A53/A72 (i.MX8). Understanding this hierarchy helps engineers select the right balance of performance, power, and integration for their product line.
Key features of the MCIMX27LVOP4A include: ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, MMU for Linux/WinCE support, hardware video processing via VFP and an integrated LCD controller supporting up to XGA resolution, USB 2.0 High-Speed OTG with PHY, two CAN 2.0A/B controllers, three UARTs, I2C, SPI, and a 10/100 Ethernet MAC. The device supports DDR/DDR2 memory and NAND/NOR flash boot.
The MCIMX27 architecture leverages the ARM926EJ-S macrocell with a Harvard-style cache, write buffer, and tightly-coupled memory interface. The integrated multimedia accelerator provides hardware scaling and color space conversion, freeing the CPU for application-layer tasks. Silicon-proven security extensions (Tamper Detection, Secure Boot) protect IP in deployed fleets.
Typical applications include human-machine interface (HMI) panels, industrial control terminals, point-of-sale (POS) systems, portable medical monitors, automotive infotainment head units, and networked printers. The integrated Ethernet and dual CAN interfaces make the part particularly attractive for connected industrial equipment requiring real-time deterministic bus communication alongside Linux or WinCE application stacks.
When designing with this device, plan memory layout carefully: DDR2 controller requires careful impedance-matched routing and length matching within 25 mil. Boot configuration (boot from NAND, NOR, SPI, or UART) is selected via pull-ups/pull-downs on the boot-mode pins at reset and must be reviewed against the production programming flow.
This page synthesizes distributor pricing, verified same-family drop-in alternatives, lifecycle status (NRND), and practical hardware design notes not collated in the manufacturer datasheet alone.
드롭인 대체품: MCIMX27LVOP4A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MCIMX27VOP4A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX27LVOPI4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX27LVOP4AR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX27LVOK4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX27CVOP4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX27CJP4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX27LVOP4A 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | i.MX27 |
| Core Processor | ARM926EJ-S |
| Number of Cores | 1 |
| Core Architecture | ARM9, 32-bit RISC |
| Maximum CPU Clock | 400 MHz |
| 데이터 버스 폭 | 32-bit |
| 패키지 | 404-LFBGA (17x17 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 범위 | -40C to +85C (industrial) |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Type Supported | DDR / DDR2 / NAND / NOR flash |
| Connectivity | USB 2.0 HS OTG, 10/100 Ethernet, 2x CAN 2.0, 3x UART, I2C, SPI |
| Display Controller | Integrated LCD controller (up to XGA) |
| 수명 주기 상태 | NRND (Not Recommended for New Designs) |
| RoHS 상태 | Compliant |
MCIMX27LVOP4A 404-lfbga (17x17 mm) 핀 구성 가이드
MCIMX27LVOP4A(404-lfbga (17x17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX27LVOP4A.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX27LVOP4A 적합 용도: 7 애플리케이션s: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Medical Monitors, Automotive Infotainment Head Units, Networked Printers and MFPs, Connected Industrial IoT Gateways, Digital Signage and Kiosk Controllers.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX27LVOP4A's ARM926EJ-S 400 MHz core combined with its integrated LCD controller (up to XGA resolution) and 10/100 Ethernet MAC makes it ideal for industrial HMI panels used in factory automation and process control. The integrated LCD controller drives TFT panels directly without an external bridge chip, reducing BOM cost. The 16+16 KB caches support smooth Qt-embedded or WinCE graphical user interfaces. Placed on a four-layer PCB with the display controller output feeding a parallel RGB LCD, the part enables 800x480 panels with full-screen refresh at 60 Hz. Unlike newer Cortex-A parts, the ARM926EJ-S provides deterministic interrupt latency suitable for real-time HMI response.
추천
Point-of-Sale (POS) Terminals
The MCIMX27LVOP4A suits POS terminals requiring secure payment processing, display output, and network connectivity in a single-chip solution. The integrated USB 2.0 High-Speed OTG supports external payment terminals and printers, while the 10/100 Ethernet MAC connects the device to back-office networks for transaction authorization. Dual CAN 2.0A/B interfaces allow integration with retail backroom peripherals (scanners, scales). The part runs Linux or Windows Embedded CE 6.0 with PCI-PTS compliant software stacks. Compared with microcontrollers, the integrated MMU enables full process isolation between payment applications and the operating system.
추천
Portable Medical Monitors
The MCIMX27LVOP4A's low power consumption and integrated peripherals make it well-suited for portable patient monitors, infusion pumps, and diagnostic equipment. The CMOS sensor interface connects directly to medical imaging cameras without external bridge logic, while the AC97/I2S port drives audio alarms and speaker outputs. The industrial -40C to +85C temperature range allows operation in clinical environments with strict sterilization requirements. Hardware security extensions (Tamper Detection, Secure Boot) protect patient data at rest. The 400 MHz ARM926EJ-S core runs embedded Linux with medical-grade graphics libraries for waveform displays.
추천
Automotive Infotainment Head Units
The MCIMX27LVOP4A was originally designed for automotive infotainment systems requiring rich multimedia, multiple display outputs, and CAN bus integration. The integrated LCD controller drives main dashboard displays while the secondary display interface supports rear-seat entertainment. Dual CAN 2.0A/B controllers connect to vehicle body and powertrain networks. The hardware video encoder/decoder accelerates MPEG-4 and H.263 playback for in-vehicle entertainment. Although NRND, existing automotive designs with this part remain in production fleets. For new automotive designs, NXP recommends the i.MX 8 family with ISO 26262 functional safety support.
추천
Networked Printers and MFPs
The MCIMX27LVOP4A's combination of USB 2.0 High-Speed OTG, 10/100 Ethernet MAC, and ARM926EJ-S processing power targets networked multifunction printers (MFPs) and document scanners. The processor handles image processing pipelines (compression, color correction) while dedicated peripheral controllers manage print engines and scanner CCDs. The integrated LCD controller drives operator panel displays directly. Linux support with CUPS printing stack and SANE scanning drivers is well-established on the i.MX27 platform. Industrial-grade temperature tolerance supports office and light-industrial deployment scenarios.
추천
Connected Industrial IoT Gateways
The MCIMX27LVOP4A is well-suited for industrial IoT gateways aggregating field-bus data from Modbus, CAN, and serial sensors to Ethernet/IP or cloud uplinks. Dual CAN 2.0A/B interfaces directly read vehicle or industrial machine telemetry without external controllers, while the three UARTs connect to RS-232/RS-485 field devices via transceivers. The 10/100 Ethernet MAC provides deterministic industrial connectivity with QoS-aware Linux networking stacks. Industrial temperature rating (-40C to +85C) supports outdoor enclosures and factory-floor deployment. Security extensions enable encrypted TLS tunnels for cloud backhaul.
추천
Digital Signage and Kiosk Controllers
The MCIMX27LVOP4A's integrated LCD controller, USB 2.0 HS OTG, and Ethernet MAC make it suitable for digital signage players and self-service kiosk controllers. The hardware video decoder handles MPEG-4 and H.263 streams directly, offloading the ARM9 core. USB OTG enables easy content updates from USB sticks for offline deployments, while Ethernet supports networked content management. Industrial-grade temperature tolerance permits outdoor or semi-outdoor kiosk enclosures. Linux BSPs with Chromium Embedded Framework or WebKitGTK support modern HTML5 signage content delivery.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX27LVOP4A — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX27VOP4A | MCIMX27LVOPI4A | MCIMX27LVOP4AR2 | MCIMX27LVOK4A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 404-LFBGA (17x17 mm) | 404-LFBGA (17x17 mm) - same | 404-LFBGA (17x17 mm) - same | 404-LFBGA (17x17 mm) - same | 404-LFBGA (17x17 mm) - same |
| Core Processor | ARM926EJ-S, 1 Core, 32-bit | ARM926EJ-S, 1 Core, 32-bit | ARM926EJ-S, 1 Core, 32-bit | ARM926EJ-S, 1 Core, 32-bit | ARM926EJ-S, 1 Core, 32-bit |
| Maximum CPU Clock | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Instruction Cache | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Data Cache | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | NRND | Active (i.MX27 family) | NRND | NRND | NRND |
| USB 2.0 HS OTG | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) |
| CAN 2.0 Controllers | 2 | 2 | 2 | 2 | 2 |
주요 차별점
- Dual CAN 2.0 controllers integrated (vs MCIMX287CVM4B (i.MX287))
- Integrated USB 2.0 High-Speed OTG PHY (vs MCIMX27LMOP4A (MAPBGA-473 variant))
- Mature Linux and WinCE BSP support (vs Newer i.MX 8M Mini Cortex-A53 parts)
설계 노트
Estimated: the 404-LFBGA package with 0.8 mm or 1.0 mm ball pitch requires a 4-layer or 6-layer PCB with microvia-in-pad technology for reliable assembly. Microvia stacking should not exceed 2 layers to maintain via reliability per IPC-6012 Class 2. Use NSMD (Non-Solder Mask Defined) land pads with a 0.05 mm reduction from the BGA ball diameter. Escape routing under the BGA should use 0.1 mm trace/space with the second-layer GND pour providing return path reference.
Estimated: at maximum CPU activity with all peripherals enabled, the i.MX27 dissipates approximately 1.0-1.5 W. With a typical 404-LFBGA theta_JA of 25-30 C/W, junction temperature rises 25-45 C above ambient. Ensure adequate copper area on top and inner layers connected to GND balls for thermal spreading. For sealed enclosures without airflow, derate ambient temperature or reduce CPU clock to maintain Tj under 105 C. NXP recommends the i.MX27 Hardware Development Guide thermal section for detailed calculations.
Boot mode configuration is critical: BOOT[3:0] pins must have correct pull-up/pull-down resistors to select the desired boot source (NAND, NOR, SPI flash, UART, SD). Floating boot pins cause unpredictable boot behavior and brick the board. Power sequencing must follow NXP's documented sequence (VDD->VDDA->VDDIO) with proper ramp rates to avoid POR latch-up. JTAG pins (TCK, TMS, TDI, TDO, TRST) require 10 kohm pull-ups on TCK, TMS, TDI and TRST per the i.MX27 reference manual.
DDR/DDR2 memory interface requires matched trace lengths within 25 mil for byte lanes and within 50 mil between byte lanes per the i.MX27 Hardware Development Guide. Use series termination resistors on clock, address, and command signals to dampen reflections. Maintain 50 ohm +/-10% controlled impedance for all DDR signals. Place VTT termination voltage (0.9V for DDR2) decoupling capacitors (0.1 uF + 10 uF) within 200 mil of every VTT pin. VREF reference voltage must be routed as a separate plane or wide trace with 10 uF + 0.1 uF decoupling at every memory device.
규정 준수 정보
RoHS compliant per NXP product page. Not AEC-Q100 qualified - the i.MX27 family is not automotive-grade. Reach SVHC compliant per NXP material declarations. Lead-free solder balls on BGA package.
