MCIMX31CJMN4CR2 - i.MX31 ARM1136 MPU 400MHz 473-LFBGA | NXP
부품 번호: MCIMX31CJMN4CR2 ✗ 단종MCIMX31CJMN4CR2 개요
An applications processor (AP) is a system-on-chip category that integrates a CPU core with memory interfaces, multimedia accelerators, and connectivity peripherals in a single die. The i.MX31 sits in the taxonomy: applications processor -> microprocessor (MPU) -> integrated circuit -> semiconductor. It extends the classical microcontroller concept by adding an external memory bus, MMU, and high-bandwidth peripherals needed to run rich operating systems such as Linux, Windows CE, and Symbian.
Key features of the MCIMX31CJMN4CR2 include a single ARM1136JF-S core with Jazelle Java acceleration, an integrated vector floating-point coprocessor (VFP), and an image-processing unit supporting MPEG-4/H.263 hardware encode and decode. The device integrates a 16 KB/16 KB L1 cache split between instruction and data, plus a unified 128 KB L2 cache. The peripheral set covers USB 2.0 high-speed OTG, MMC/SD, ATA/CompactFlash, I2S audio, a CMOS sensor interface, and an LCD controller capable of WXGA resolution.
Architecturally, the i.MX31 was fabricated on a 130 nm CMOS process, which trades power efficiency for the analog-rich multimedia IP blocks that defined the generation. The ARM1136 core implements the ARMv6 instruction set with SIMD media extensions, enabling video codecs and image-pipeline tasks that would otherwise overload a slower CPU. An on-chip power-management controller and multiple low-power retention modes (Stop, Doze, Wait) make the device practical for handheld and battery-backed products.
Typical applications of the MCIMX31CJMN4CR2 include portable media players, point-of-sale terminals, industrial human-machine interfaces (HMIs), automotive infotainment and telematics head units, and medical patient-monitoring displays. The integrated LCD controller and CMOS sensor interface also make it suitable for digital photo frames and low-cost video conferencing peripherals.
Designers should treat the 473-LFBGA package as a fine-pitch, mostly-RF-sensitive substrate; the reference manual recommends a 6-layer PCB with continuous ground planes, controlled impedance for USB and memory traces, and decoupling placed within 5 mm of every power pin. Thermal management is mandatory because the device dissipates up to approximately 1 W under full multimedia load; a thermal pad, exposed vias, and adequate airflow are required for reliable operation in enclosed housings.
This page synthesizes distributor pricing, package information, and design considerations from NXP product documentation and authorized distributors - data not consolidated on the manufacturer product page alone.
드롭인 대체품: MCIMX31CJMN4CR2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MCIMX31LCVMN4DR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX31CSCM4CR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX31CSQEPC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX31CJMN4CR2 최대 정격 & 전기적 특성
| Part Family | i.MX31 Applications Processor |
| Core Architecture | ARM1136JF-S (ARMv6 with Jazelle and SIMD) |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Frequency | 400 MHz |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| L2 Cache | 128 KB unified |
| Floating Point Unit | VFP coprocessor integrated |
| Image Processing Unit | MPEG-4/H.263 encode & decode hardware |
| 패키지 | 473-LFBGA / MAPBGA, 19 x 19 mm |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Packaging Type | Tape & Reel (TR) |
MCIMX31CJMN4CR2 473-lfbga / mapbga, 19 x 19 mm 핀 구성 가이드
MCIMX31CJMN4CR2(473-lfbga / mapbga, 19 x 19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX31CJMN4CR2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX31CJMN4CR2 적합 용도: 6 애플리케이션s: Portable Media Player, Industrial HMI Touch Panel, Automotive Infotainment Head Unit, Point-of-Sale Terminal, Medical Patient Monitoring Display, Digital Photo Frame.
Portable Media Player
The MCIMX31CJMN4CR2 is well-matched to portable media player (PMP) designs because its ARM1136JF-S core at 400 MHz can decode MPEG-4 and H.263 video streams in hardware via the integrated image processing unit, offloading the CPU. The chip's LCD controller drives WQVGA/WVGA panels up to WXGA resolution, while the I2S audio port streams 16-24 bit PCM to an external codec. Power management is critical: the i.MX31's stop and doze modes cut quiescent draw below 1 mA between tracks, extending battery life. Compared with a software-decoded PMP, the i.MX31's hardware codecs roughly halve CPU utilization, leaving headroom for UI rendering and metadata parsing. Reference designs in the NXP i.MX31 reference manual show the IC paired with a Wolfson WM8983 codec and 64 MB mobile DDR.
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Industrial HMI Touch Panel
The MCIMX31CJMN4CR2's 473-LFBGA integration, LCD controller, and USB OTG make it a practical choice for industrial human-machine interface (HMI) panels up to 7 inches. Its MMU enables modern embedded Linux, allowing Qt-based UI frameworks to render touch menus, gauges, and SCADA widgets. Industrial environments require sustained operation across extended temperatures, but the consumer-grade suffix (C) limits this part to commercial environments; the MCIMX31LCVMN4DR2 industrial variant is preferable here. The on-chip CMOS sensor interface can capture 30 fps VGA streams from a camera module for video-feedback HMIs. Power dissipation under full UI render averages 600-800 mW, manageable with a 4-layer thermal via array.
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Automotive Infotainment Head Unit
For automotive infotainment head units, the i.MX31 family supports audio routing, radio display, and basic navigation graphics. The standard MCIMX31CJMN4CR2 consumer-grade is NOT AEC-Q100 qualified, so designers targeting production vehicles must select the automotive suffix (for example MCIMX31CSQEPC) which shares the same 473-LFBGA footprint. The chip's ATA/CompactFlash interface hosts mechanical HDD media for music libraries, while the I2S port drives the DSP amplifier. Designers must observe the 0.8 mm BGA pitch and ensure the PCB survives automotive vibration profiles per USCAR or LV214. Software stack typically includes a real-time OS (Nucleus, ThreadX) plus a multimedia framework.
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Point-of-Sale Terminal
The MCIMX31CJMN4CR2 suits point-of-sale (POS) terminals because it integrates USB host for barcode scanners and receipt printers, plus the LCD controller for customer-facing displays and the CMOS sensor interface for 2D imager cameras. The ARM1136 core runs a Linux BSP with familiar networking stacks, enabling encrypted payment flows and remote management. Compared with discrete microcontrollers, the integrated peripherals eliminate three to five support ICs and shrink the BOM. The chip's legacy status means security patches are community-only, so designers must implement application-layer hardening. Thermal design must account for sealed enclosures in retail installations.
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Medical Patient Monitoring Display
Medical patient monitoring displays rely on the MCIMX31CJMN4CR2's strong LCD controller to render real-time waveforms (ECG, SpO2, respiration) and the I2S interface to drive alarm audio. The 400 MHz ARM1136 has headroom to render three to four waveform channels at 60 fps without dropping samples. Designers must implement IEC 60601-1 isolation barriers around the IC because the i.MX31 itself is not medical-grade certified - it serves only the display/HMI subsystem. The USB OTG port supports external Wi-Fi or Bluetooth dongles for bedside telemetry. Note that the consumer temperature grade limits deployment to climate-controlled clinical environments.
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Digital Photo Frame
The MCIMX31CJMN4CR2's integrated image processing unit (IPU) and LCD controller make it ideal for digital photo frames handling JPEG decoding and slide-show playback. The IPU accelerates JPEG decode in hardware, leaving the CPU free for transitions and metadata rendering. SD/MMC host accepts consumer memory cards up to 32 GB, holding roughly 10,000 photos. Power dissipation at typical slideshow brightness averages 500 mW, well within the budget for an AC-powered wall-wart design. Designers should add a hardware watchdog and brown-out detector since legacy parts sometimes have sporadic boot failures on weak rails.
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추천 제품 요약
엔지니어링 참조 데이터: MCIMX31CJMN4CR2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX31LCVMN4DR2 | MCIMX31CSCM4CR2 | MCIMX31CSQEPC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 473-LFBGA / MAPBGA (19x19 mm) | 473-LFBGA / MAPBGA - same footprint | 473-LFBGA / MAPBGA - same footprint | 473-LFBGA / MAPBGA - same footprint |
| Core Architecture | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Maximum Frequency | 400 MHz | 532 MHz (+33%) | 400 MHz | 400 MHz |
| Temperature Grade | Consumer (0C to +70C) | Industrial (-40C to +85C) | Consumer (0C to +70C) | Automotive AEC-Q100 |
| L2 Cache | 128 KB unified | 128 KB unified | 128 KB unified | 128 KB unified |
| Image Processing Unit | Yes (MPEG-4/H.263 encode+decode) | Yes (MPEG-4/H.263) | Yes (MPEG-4/H.263) | Yes (MPEG-4/H.263) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (last time buy may apply) |
주요 차별점
- Lower cost than the industrial variant at commercial temperatures (vs MCIMX31LCVMN4DR2)
- Same 473-LFBGA footprint as automotive variant (vs MCIMX31CSQEPC)
- Hardware video encode/decode via integrated IPU (vs MCIMX31CSCM4CR2)
설계 노트
Estimated: The 473-LFBGA 0.8 mm pitch package requires a 6-layer PCB with continuous ground plane beneath the BGA, microvia-in-pad construction is recommended for production yields above 95%. Decoupling capacitors must be placed within 5 mm of each power pin pair with a 0.1 uF X7R for high-frequency noise and a 4.7 uF bulk cap per power rail. Controlled-impedance routing is required for USB DP/DN (90 ohm differential) and memory address/command traces (50 ohm single-ended to a 50 ohm termination).
Estimated: At 400 MHz full CPU load with peripherals active, the i.MX31 dissipates roughly 1 W. With theta_JA around 25 C/W on a 4-layer JEDEC test board, junction temperature rises about 25 C above ambient. Designers must provide a thermal pad under the BGA with at least 25 thermal vias connecting to the inner ground plane, and ensure the housing provides some airflow to keep Tj below 105 C in 50 C ambient enclosures.
The DDR/mobile-DDR memory interface requires matched-length traces within 25 ps skew between byte lanes, and a VREF training sequence at boot. Series-stubs should be avoided on DDR clock and DQS lines - route these on the top layer with the i.MX31 BGA breakout. Use IBIS simulation before tape-out because the i.MX31 family has well-documented SI issues on improperly terminated memory buses, especially at the 532 MHz speed grades.
Do not assume the consumer-grade suffix (C) supports industrial or automotive temperature ranges - the silicon is characterized only for 0C to +70C. Always verify the suffix against the NXP i.MX31 ordering information table. Also note that some i.MX31 SKUs require external boot configuration resistors on the BOOT[3:0] pins, and failure to strap them correctly results in a non-booting board that mimics a dead IC. Reference the i.MX31 reference manual section 3 for the boot mode table.
규정 준수 정보
RoHS compliant per NXP product page. NOT AEC-Q100 qualified - the standard suffix targets commercial applications. For automotive, choose the Q-suffixed variant (MCIMX31CSQEPC) which carries the qualification. REACH status inherited from NXP global compliance declaration.
