MCIMX31LCVMN4C - i.MX31L ARM1136 400MHz MPU, MAPBGA-457 | NXP
부품 번호: MCIMX31LCVMN4C ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.5 | $10,500.00 |
MCIMX31LCVMN4C 개요
An i.MX applications processor is a system-on-chip that combines an ARM core with image processing, video acceleration, connectivity peripherals, and memory controllers. The i.MX31 family represents the first generation of the i.MX portfolio to achieve AEC-Q100 grade 3 qualification, becoming the engine behind production in-vehicle infotainment systems such as the Ford SYNC platform. The family sits in the broader hierarchy of applications processors (MPU), itself a subclass of microprocessors, and ultimately of integrated circuits.
Key features of the MCIMX31LCVMN4C include a 16-bit external data bus interface, an integrated LCD controller for direct panel attachment, hardware-accelerated video preprocessing, USB 2.0 with on-chip PHY, and an Image Processing Unit (IPU) for camera input. The MAPBGA-457 package supports high-density board designs while the 0.5 mm pitch is compatible with standard PCB manufacturing processes for automotive-grade assemblies.
The MCIMX31L architecture pairs the ARM1136JF-S core with a multi-AHB bus matrix and dedicated DMA channels, enabling concurrent data movement between the camera, LCD, and memory subsystems without CPU bottleneck. This makes the part well-suited to multimedia workloads where deterministic frame timing is essential.
Typical applications include in-vehicle infotainment head units, automotive telematics control units, industrial HMI panels, portable media players, and entry-level single-board computing platforms. Designers typically choose this part when they need ARM11-class performance with proven automotive qualifications and a mature software stack.
When designing with the MCIMX31LCVMN4C, ensure adequate PCB layer stack-up (typically 6+ layers) for the 0.5 mm pitch BGA fan-out and matched-length impedance control for the external memory bus. The automotive qualification simplifies PPAP submissions and PCN handling for OEM customers.
This page synthesizes authorized distributor inventory, parametric alternatives, and engineering design notes for the MCIMX31LCVMN4C that go beyond the manufacturer datasheet alone.
드롭인 대체품: MCIMX31LCVMN4C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX31LCVMN4C (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Core Architecture, Data Bus Width, Family, Operating Temperature Range.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCIMX31CVMN4CR2
✅ 드롭인✓ 재고 있음
$17.1 / 개
데이터시트 보기 →MCIMX31LCVMN4CR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX31CVMN4C
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.4 / 개
데이터시트 보기 →MCIMX31LDVMN5D
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX31ADSEc
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX31LCVMN4C 최대 정격 & 전기적 특성
| Core Architecture | ARM1136JF-S |
| Core Count | 1 |
| 데이터 버스 폭 | 16-bit |
| 최대 클록 주파수 | 400 MHz |
| 동작 온도 범위 | -40C to +85C |
| Package Type | MAPBGA-457 |
| Package Dimensions | 14 x 14 mm |
| Ball Pitch | 0.5 mm |
| 핀 수 | 457 |
| Family | i.MX31L |
| Variant Suffix | N4C (industrial/auto temp grade) |
| Integrated LCD Controller | Yes |
| USB Interface | USB 2.0 with on-chip PHY |
| Image Processing Unit (IPU) | Yes |
| RoHS 상태 | Compliant |
| AEC-Q100 Grade | Grade 3 |
| 실장 유형 | Surface Mount |
MCIMX31LCVMN4C 14 x 14 mm 핀 구성 가이드
MCIMX31LCVMN4C(14 x 14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX31LCVMN4C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX31LCVMN4C 적합 용도: 7 애플리케이션s: In-Vehicle Infotainment (IVI) Head Unit, Automotive Telematics Control Unit (TCU), Industrial HMI Panel, Portable Media Player / PDA, Single-Board Computer (SBC) for Embedded Linux, Medical Point-of-Care Diagnostic Device, Industrial Video Surveillance / DVR.
In-Vehicle Infotainment (IVI) Head Unit
The MCIMX31LCVMN4C is the engine that powered the acclaimed Ford SYNC in-vehicle infotainment platform, and continues to be deployed in production head units today. The 400 MHz ARM1136JF-S core, integrated LCD controller, and image processing unit (IPU) deliver the throughput needed for touchscreen HMI rendering, audio decoding, and Bluetooth hands-free streaming. AEC-Q100 grade 3 qualification simplifies PPAP submission and ensures reliable operation across the -40C to +85C automotive temperature range. The MAPBGA-457 package with 14 x 14 mm footprint fits standard double-DIN chassis, while 0.5 mm pitch remains compatible with high-volume automotive PCB assembly lines.
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Automotive Telematics Control Unit (TCU)
The MCIMX31LCVMN4C is well-suited to automotive telematics control units that aggregate GPS, cellular modem data, and vehicle CAN bus telemetry. The 400 MHz ARM11 core executes the telematics application stack while the integrated LCD controller drives status panels. USB 2.0 with on-chip PHY supports direct modem connection, and the AEC-Q100 grade 3 qualification handles under-hood temperature swings. The MAPBGA-457's compact 14 x 14 mm footprint fits space-constrained TCU enclosures, while the mature i.MX31 software ecosystem (Linux BSP, GENIVI) accelerates certification.
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Industrial HMI Panel
The MCIMX31LCVMN4C drives industrial human-machine interface panels requiring a touchscreen controller, color TFT LCD interface, and reliable long-term operation. The 16-bit external data bus provides sufficient bandwidth for QVGA/WQVGA panel refresh without external graphics memory, while the on-chip IPU accelerates 2D graphics primitives. The industrial temperature grade (-40C to +85C) supports installation in factory floor cabinets and outdoor kiosks. The MAPBGA-457 package with 0.5 mm pitch supports high-density multilayer PCBs typical of slim-panel designs.
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Portable Media Player / PDA
The 'L' (low-power) variant of the i.MX31 family makes the MCIMX31LCVMN4C ideal for portable media players and PDA-class devices where battery life is critical. The ARM1136JF-S core delivers sufficient performance for H.263/MPEG-4 video decode while the on-chip multimedia accelerators offload the CPU. The integrated LCD controller drives color TFT panels up to VGA resolution without external graphics hardware. MAPBGA-457 keeps board area minimal, and the mature Linux/WinCE BSP support accelerates product development.
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Single-Board Computer (SBC) for Embedded Linux
The MCIMX31LCVMN4C is a popular core for custom single-board computers running embedded Linux in industrial gateways, point-of-sale terminals, and small-footprint Linux appliances. The 400 MHz ARM11 core plus the mature Freescale/NXP Linux BSP make it a proven platform for rapid prototyping. MAPBGA-457 with 14 x 14 mm footprint plus the 0.5 mm pitch ball grid supports integration with DDR memory, NAND flash, and Ethernet PHYs on a compact 6-layer board. The industrial/automotive temperature grade ensures 24/7 operation in unattended installations.
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Medical Point-of-Care Diagnostic Device
The MCIMX31LCVMN4C fits medical point-of-care diagnostic devices requiring a color touchscreen HMI, deterministic response, and long-term reliability. The 400 MHz ARM1136JF-S core runs the device UI and signal-processing firmware, while the on-chip LCD controller drives the user-facing display. The industrial temperature range suits field-deployed diagnostic carts. The MAPBGA-457 footprint and mature BSP shorten time-to-market for IEC 60601-1 compliant designs. NXP's full documentation package (PPAP, longevity commitment for AEC-Q100 parts) simplifies regulatory submission for medical OEM customers.
추천
Industrial Video Surveillance / DVR
The MCIMX31LCVMN4C's image processing unit (IPU) and 400 MHz ARM1136JF-S core deliver the throughput needed for industrial video surveillance and DVR front-ends that capture, preview, and compress analog or digital camera input. The on-chip LCD controller drives local preview displays, while USB 2.0 with on-chip PHY connects external storage. MAPBGA-457 with 14 x 14 mm footprint keeps surveillance appliance enclosures compact, and the -40C to +85C industrial temperature range supports outdoor cabinet installation.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX31LCVMN4C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX31CVMN4CR2 | MCIMX31LCVMN4CR2 | MCIMX31CVMN4C | MCIMX31LDVMN5D | MCIMX31ADSEc |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-457 (14 x 14 mm, 0.5 mm pitch) | MAPBGA-457 - same | MAPBGA-457 - same | MAPBGA-457 - same | MAPBGA-457 - same | MAPBGA-457 - same |
| Core Architecture | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Family Variant | i.MX31L (low-power) | i.MX31C (standard) | i.MX31L (low-power) | i.MX31C (standard) | i.MX31L (low-power, higher bin) | i.MX31 ADS evaluation |
| External Data Bus | 16-bit | 16-bit | 16-bit | 16-bit | 32-bit (wider bus) | 16-bit |
| Lifecycle Status | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy | Obsolete |
주요 차별점
- First i.MX family to achieve AEC-Q100 grade 3 (vs Generic ARM11 microprocessors)
- True drop-in replacement available on the same MAPBGA-457 footprint (vs MCIMX31ADSEc)
- Integrated LCD controller and Image Processing Unit (IPU) eliminate external graphics hardware (vs Discrete ARM11 + external GPU solutions)
설계 노트
Estimated: The MAPBGA-457 package with 0.5 mm ball pitch and 14 x 14 mm body requires a 6-layer PCB stack-up with 1 oz copper outer layers for adequate BGA fan-out. Microvia-in-pad construction is recommended for the inner-row signal balls; blind/buried vias should be used for layer transitions under the BGA. Matched-length impedance control (±50 mil tolerance) is required on the external DDR memory bus and LVDS display signals. Estimated trace density: 4-mil trace / 4-mil space minimum.
Estimated: At 400 MHz core clock with 1.2 V core supply, the MCIMX31LCVMN4C dissipates approximately 0.8-1.2 W under typical multimedia workloads. With a 14 x 14 mm MAPBGA and theta_JA in the 25-35 C/W range (per JEDEC EIA/JESD51 measurements), the junction temperature rise is approximately 20-40 C above ambient - well within the -40C to +125C silicon limit but requiring thermal vias under the central BGA pad. Estimated: 25 thermal vias (0.3 mm drill, 0.5 mm pad) under the center balls are typical.
Three common pitfalls when designing with the MCIMX31LCVMN4C: (1) Boot mode strapping pins must be pulled to the correct logic level at POR - mis-configuration can prevent JTAG connection; (2) The 16-bit external memory bus must use matched-length DDR traces (within 50 mils) for byte-lane signals, and VTT termination is required for proper DDR signaling; (3) AEC-Q100 grade 3 qualification covers -40C to +85C operating temperature - design margin must be added for self-heating under sustained multimedia workloads.
Place the DDR memory chips on the top layer directly under the i.MX31 memory interface balls with the shortest possible trace length. The 27 MHz system crystal must be within 5 mm of the XTAL pins with a guarded ground ring to reduce EMI. The USB 2.0 differential pair (DP/DN) requires 90 ohm differential impedance with 200 mil maximum length and no stubs. The LCD data bus should be length-matched within 100 mils across all data bits to maintain setup/hold timing.
규정 준수 정보
RoHS compliant per DigChip part listing; AEC-Q100 grade 3 qualified per NXP official product page. Halogen-free status not explicitly stated in verified data.
