MCIMX6L2DVN10AA - i.MX6SL 1GHz Cortex-A9 MPU | NXP | 432-MAPBGA
부품 번호: MCIMX6L2DVN10AA ✓ 활성MCIMX6L2DVN10AA 개요
What is an applications processor? An applications processor (AP) is a system-on-chip (SoC) microprocessor optimized for running rich operating systems (typically Linux, Android, or QNX) and multimedia workloads in embedded products. Applications processors sit above microcontrollers (MCUs) in the embedded hierarchy: an MCU integrates CPU + memory + peripherals for deterministic control tasks, while an AP adds high-performance CPU cores, graphics, image processing, and high-bandwidth DRAM interfaces for HMI and connectivity platforms. The i.MX6 family in particular is NXP's long-running Cortex-A9 platform, segmented into Solo (single core), Dual, Quad, DualLite, SoloLite, and UltraLite variants; the i.MX6SL SoloLite is the cost-down, low-power member targeting e-readers, wearables, and industrial HMI.
Key features of the MCIMX6L2DVN10AA include: single ARM Cortex-A9 core at 1.0 GHz, integrated 2D graphics accelerator (Vivante GC320), 32-bit DDR3 / DDR3L / LPDDR2 memory controller up to 800 MT/s, integrated power management unit with on-chip LDOs and DC-DC controllers, and a broad peripheral set including MMC/SD, USB 2.0 with PHY, UART, SPI, I2C, I2S, CAN, MIPI-CSI camera input, and parallel LCD output. The 432-MAPBGA package exposes the full multimedia peripheral set while keeping the board footprint compact at 13x13 mm.
Technically, the MCIMX6L2DVN10AA is the 'Megrez' sub-family of i.MX6SL: it shares the SoloLite IP block configuration with the broader i.MX6 family but at lower power. The 'AA' speed grade corresponds to the 1.0 GHz commercial temperature variant, while the 'D' in the MPN denotes the dual-marketing nomenclature (NXP reuses the i.MX6 designator across Solo/Dual/Lite). The integrated PMIC companion is typically the PF0100/PF0200 or MMPF0100. Designers should pair this part with a DDR3/LPDDR2 layout that follows the NXP hardware reference manual to meet signal-integrity on the 800 MT/s memory bus.
Typical applications include e-readers and e-paper signage, industrial human-machine interface (HMI) panels, portable medical devices, point-of-sale (POS) terminals, low-cost single-board computers, and connected IoT gateways with display. Its low-power SoloLite profile suits battery-powered products where an MCU lacks multimedia throughput.
When designing with this part, plan the power tree around an external PMIC; the integrated LDOs supply internal logic but cannot power DRAM directly. Provide a minimum of four PCB layers with continuous GND beneath the BGA, and route the DDR3 interface as a matched-length group per NXP's i.MX6SL design checklist to pass timing at 800 MT/s.
This page synthesizes distributor pricing, drop-in Megrez-family alternatives, and practical board-design guidance not found in the standalone NXP datasheet.
드롭인 대체품: MCIMX6L2DVN10AA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX6L2DVN10AA (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Series, USB.
MCIMX6L2EVN10AA
✅ 드롭인가격 문의
데이터시트 보기 →MCIMX6L3EVN10AB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX6L2DVN10AA 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | i.MX6SL Megrez |
| Core Architecture | ARM Cortex-A9 MPCore |
| Number of Cores | 1 (Single-core) |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 1.0 GHz |
| Memory Interface | 32-bit DDR3-800 / DDR3L / LPDDR2 |
| Graphics Accelerator | 2D GPU (Vivante GC320) |
| Integrated Power Management | Yes (on-chip LDOs and DC-DC controllers) |
| Camera Interface | MIPI-CSI |
| Display Interface | Parallel LCD |
| USB | USB 2.0 with integrated PHY |
| Package Type | 432-MAPBGA |
| Package Dimensions | 13 mm x 13 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
MCIMX6L2DVN10AA 13 mm x 13 mm 핀 구성 가이드
MCIMX6L2DVN10AA(13 mm x 13 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX6L2DVN10AA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX6L2DVN10AA 적합 용도: 6 애플리케이션s: E-Reader and E-Paper Signage, Industrial Human-Machine Interface (HMI) Panels, Portable Medical Devices, Point-of-Sale (POS) Terminals, Low-Cost Single-Board Computers (SBC), Connected IoT Gateways with Display.
E-Reader and E-Paper Signage
The MCIMX6L2DVN10AA's 1.0 GHz Cortex-A9 core and integrated 2D graphics accelerator (Vivante GC320) make it well suited for driving e-paper displays in e-readers and battery-powered signage. According to the NXP i.MX6SL datasheet, the part's low-power SoloLite profile reduces active power draw versus the standard i.MX6, extending battery life across page-flip workloads. Pair with the parallel LCD interface to connect to common e-paper panels; the integrated 2D GPU handles partial-screen refreshes efficiently. Compared with MCU-class alternatives, the i.MX6SL adds Linux BSP support for content management and OTA updates, which is critical for retail signage fleets.
추천
Industrial Human-Machine Interface (HMI) Panels
For industrial HMI panels, the MCIMX6L2DVN10AA provides the right balance of graphics performance, Linux ecosystem maturity, and NXP's long-term industrial supply commitment. Its 32-bit DDR3-800 controller supports the framebuffer sizes needed for 7-10 inch WVGA/WXGA panels, and the parallel LCD output drives most TFT controllers directly. The integrated power management unit simplifies the multi-rail sequencing required for industrial designs. Use the CAN bus to bridge to factory networks and the I2C / SPI interfaces for touch-controller and keypad scan.
추천
Portable Medical Devices
Portable medical instruments benefit from the MCIMX6L2DVN10AA's combination of Cortex-A9 performance for data processing and the integrated 2D GPU for high-resolution color displays. The MIPI-CSI camera input supports imaging peripherals for dermatology or diagnostic scopes. The DDR3-800 interface allows local buffering of patient data, while the Linux BSP enables secure, FDA-friendly software stacks. Power budgeting should use the NXP power estimation spreadsheet for typical clinical workloads.
추천
Point-of-Sale (POS) Terminals
POS terminals require reliable Linux-class processing, secure peripherals, and a long production-support window - all of which the MCIMX6L2DVN10AA provides. The Cortex-A9 core handles encryption for EMV and NFC transactions, while the integrated 2D GPU drives the merchant-facing color display. The USB 2.0 with PHY simplifies connection to printers, barcode scanners, and customer-facing PIN pads. The wide peripheral set (UART, SPI, I2C, I2S, CAN) covers all typical POS subsystems without an external bridge chip.
추천
Low-Cost Single-Board Computers (SBC)
The MCIMX6L2DVN10AA is a popular processor for hobbyist and industrial SBCs thanks to NXP's mature Linux BSP and the part's multimedia capability. Designers can leverage community-supported Yocto / Buildroot layers and standard DRAM validation patterns from the NXP hardware reference manual. The 432-MAPBGA package at 13x13 mm keeps PCB complexity manageable on 4-layer boards, while the integrated PMIC companion MMPF0100 simplifies the bill of materials versus full-custom designs.
추천
Connected IoT Gateways with Display
IoT gateways that aggregate sensor data and present it on a local display can leverage the MCIMX6L2DVN10AA's Linux support, 2D GPU, and rich connectivity peripheral set. The integrated USB 2.0 with PHY connects Wi-Fi / cellular modules directly, while UART / SPI / I2C serve low-speed sensor buses. Designers running lightweight containerized workloads benefit from the 1.0 GHz Cortex-A9 headroom and the DDR3-800 bandwidth; the integrated power management unit keeps quiescent draw low in idle states.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX6L2DVN10AA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX6L2EVN10AA | MCIMX6L3EVN10AB |
|---|---|---|---|
| Package | 432-MAPBGA (13x13 mm) | 432-MAPBGA (13x13 mm) - same | 432-MAPBGA (13x13 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | ARM Cortex-A9 @ 1.0 GHz (1 core) | ARM Cortex-A9 @ 1.0 GHz (1 core) | ARM Cortex-A9 @ 1.0 GHz (1 core) |
| Speed Grade Identifier | AA (1.0 GHz) | AA (1.0 GHz) | AB |
| Temperature Grade | Commercial (D in MPN) | Extended (E in MPN) | Extended |
| Memory Interface | 32-bit DDR3-800 / DDR3L / LPDDR2 | 32-bit DDR3-800 / DDR3L / LPDDR2 | 32-bit DDR3-800 / DDR3L / LPDDR2 |
| Integrated PMU | Yes | Yes | Yes |
| Graphics Accelerator | 2D (Vivante GC320) | 2D (Vivante GC320) | 2D (Vivante GC320) |
| Recommended PMIC Companion | MMPF0100 | MMPF0100 | MMPF0100 |
주요 차별점
- SoloLite sub-family gives lower active power than standard i.MX6 (vs MCIMX7D3DVK10SD)
- Commercial-grade temperature offering with the same silicon as automotive tier (vs MCIMX6L2EVN10AA)
- Mature Linux / Android BSP and long-term NXP supply commitment (vs i.MX6ULL)
설계 노트
Estimated: at 1.0 GHz active load with typical multimedia workload, the i.MX6SL SoC dissipates approximately 1.5-2.5 W. Use the NXP power estimation spreadsheet for your exact workload, and provide a continuous GND copper pour directly under the 432-MAPBGA package plus thermal vias to inner layers. Theta-JA for the 13x13 mm MAPBGA on a 4-layer JEDEC board is approximately 25-30 C/W, so adequate bottom-side copper is essential for commercial temperature operation.
Route the DDR3 interface as a matched-length group per the NXP i.MX6SL hardware reference manual. Maintain 100 ohm differential impedance for the DDR3 signals, keep reference planes unbroken beneath the bus, and place the DDR3 / DDR3L / LPDDR2 chips within 5-8 mm of the SoC to keep timing margin at 800 MT/s. Use series damping resistors only where the reference manual calls for them.
Do not rely on the integrated LDOs to power DRAM directly - always use the external MMPF0100 (or compatible NXP PMIC) for the DRAM rail. The internal LDOs are sized for SoC core logic only, and bypassing the external PMIC will cause brown-outs during peak graphics workloads. Also, do not omit boot-mode configuration resistors on the boot-mode balls; an invalid boot mode leaves the SoC unresponsive even though all rails are good.
Place decoupling capacitors on the closest inner layer or on the bottom side directly beneath the BGA balls, not on the top side where they would interfere with escape routing. Use 0402-size 100 nF caps on each VDDCORE / VDDARM ball plus bulk 10 uF / 22 uF ceramic capacitors on each voltage domain. Keep all high-speed signals (MIPI-CSI, USB, parallel LCD) on the top layer with a continuous reference plane on layer 2.
규정 준수 정보
RoHS and REACH compliance per NXP product page; the D variant is commercial-grade - select MCIMX6L2EVN10AA for AEC-Q100 / automotive-grade applications.
