MCIMX7D3DVK10SC557 - i.MX7D 1GHz Dual Cortex-A7 MPU | NXP
부품 번호: MCIMX7D3DVK10SC557 ✓ 활성MCIMX7D3DVK10SC557 개요
An i.MX application processor is a heterogeneous multi-core SoC that combines Cortex-A application cores with Cortex-M real-time cores, targeting low-power connected embedded systems. The i.MX 7Dual sits in NXP's MPU taxonomy between i.MX 6 (single/quad Cortex-A9) and i.MX 8M (Cortex-A53), specifically engineered for power-efficient HMI, IoT gateways, and industrial control products requiring deterministic real-time response.
Key features include dual Cortex-A7 cores up to 1 GHz, one Cortex-M4F core up to 200 MHz, integrated security (CAAM, secure boot, TrustZone-Way), NEON SIMD media extensions, and hardware video engines. The 488-TFBGA package provides a 12x12 mm footprint with 0.8 mm ball pitch suitable for high-density 4-layer PCBs. Dynamic voltage scaling (0.95V-1.05V core) enables low-power idle modes below 250 mW.
The architecture combines an L1 cache per core (32 KB I-cache + 32 KB D-cache per A7), a unified 512 KB L2 cache, and a 64-bit DDR3/LPDDR2/LPDDR3 memory controller. The heterogeneous topology lets the Cortex-M4F handle real-time sensor sampling while the Cortex-A7 cores run Linux for application logic, eliminating a discrete MCU in many designs.
Typical applications include IoT gateways, industrial HMI panels, POS terminals, automotive infotainment secondary displays, and wearable medical devices. The combination of PCIe, dual GbE, and dual USB OTG suits connected appliances and edge nodes that aggregate multiple sensor streams.
When designing with this device, ensure the PCB has at least 4 layers with a solid ground plane to manage the 1 GHz core's switching noise. Use NXP's validated DDR3/LPDDR3 reference layout for signal integrity and provide a dedicated 1.25V LPDDR2 termination rail. Decouple each power rail with 100 nF X7R capacitors within 2 mm of the BGA balls.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, and helps engineers evaluate the i.MX 7Dual for power-constrained connected embedded designs.
드롭인 대체품: MCIMX7D3DVK10SC557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX7D3DVK10SC557 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Ethernet, Mounting Type, Package, Product Family.
MCIMX7D3DVK10SC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX7D3DVK10SD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX7D3EVK10SC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX7D3DVK12SC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX7S3DVK08SC
✅ 드롭인가격 문의
데이터시트 보기 →MCIMX7D3DVK10SC557 최대 정격 & 전기적 특성
| Product Family | i.MX 7Dual |
| Core Architecture | ARM Cortex-A7 (dual) + ARM Cortex-M4F |
| Maximum A7 Frequency | 1 GHz |
| Maximum M4 Frequency | 200 MHz |
| Core Voltage | 0.95 V to 1.05 V |
| I/O Voltage | 1.8 V, 3.3 V |
| L1 Cache (per A7 core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 512 KB unified |
| DDR Memory Support | DDR3, LPDDR2, LPDDR3 (16-bit/32-bit) |
| USB Interfaces | 2x USB 2.0 OTG with integrated PHY |
| PCIe | 1x PCIe Gen 2 (single lane) |
| SD/MMC | 2x SDIO/MMC |
| Ethernet | 2x Gigabit Ethernet MAC |
| 패키지 | 488-TFBGA (12x12 mm, 0.8 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +105C (industrial) |
| Security Features | CAAM, secure boot, TrustZone-Way, RNG |
MCIMX7D3DVK10SC557 488-tfbga (12x12 mm, 0.8 mm pitch) 핀 구성 가이드
MCIMX7D3DVK10SC557(488-tfbga (12x12 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX7D3DVK10SC557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX7D3DVK10SC557 적합 용도: 6 애플리케이션s: Industrial IoT Gateways, Human-Machine Interface Panels, Automotive Infotainment Secondary Displays, Portable Medical Devices, Smart Home and Building Automation, Point-of-Sale Terminals.
Industrial IoT Gateways
The MCIMX7D3DVK10SC557's dual Cortex-A7 at 1 GHz plus the Cortex-M4F real-time co-processor makes it ideal for industrial IoT gateways aggregating multiple protocol streams. With 2x Gigabit Ethernet, 2x USB 2.0 OTG, and PCIe Gen 2, the SoC connects downstream Modbus, PROFINET, or EtherCAT sensor networks and upstream to cloud services via Wi-Fi/5G modems. The M4F core handles deterministic sensor sampling and actuator control at sub-millisecond latency while the A7 cores run Linux for protocol translation, edge analytics, and MQTT publish to AWS IoT Core or Azure IoT Hub. Power consumption below 250 mW in idle state enables fanless enclosures for DIN-rail mounting in factories where ambient temperatures reach 70 C.
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Human-Machine Interface Panels
For industrial HMI panels with 7-15 inch touchscreens, the MCIMX7D3DVK10SC557 delivers sufficient compute for Qt/QML-based UIs while maintaining under 5 W system power. The Cortex-A7 cores run Linux with Weston/Wayland compositors driving LVDS or parallel RGB displays up to WXGA resolution, while the M4F handles capacitive touch controller interrupts with sub-5 ms response time for industrial-grade touch feedback. The integrated 2D GPU (Vivante GC320T) accelerates UI rendering without external graphics hardware. Two SDIO/MMC interfaces support eMMC 5.0 storage plus an optional SD card slot for field-upgradable firmware, critical for factory automation panels requiring decades-long serviceability.
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Automotive Infotainment Secondary Displays
The MCIMX7D3DVK10SC557 powers rear-seat entertainment and instrument cluster secondary displays in automotive cabins where its Cortex-A7 efficiency outperforms Cortex-A9 alternatives. Dual CAN-FD interfaces (via software-implemented peripherals plus external transceivers) and 2x Ethernet MACs support modern vehicle network architectures. The heterogeneous A7+M4 architecture lets the M4F handle real-time CAN message debouncing and cluster gauge updates at deterministic 60 Hz while the A7 cores run Android Automotive or Linux for navigation, media playback, and HUD projection. Industrial-spec -40C to +105C operation suits cabin electronics environments, though for safety-critical clusters the i.MX 8M with lockstep cores is preferred.
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Portable Medical Devices
Battery-powered medical devices such as portable ultrasound, infusion pumps, and patient monitors benefit from the MCIMX7D3DVK10SC557's sub-250 mW idle power and heterogeneous processing. The Cortex-M4F core handles real-time vital-sign sampling (ECG at 360 Hz, SpO2 photoplethysmography) with deterministic latency while the Cortex-A7 cores run embedded Linux for the touch UI, DICOM image processing, and Bluetooth/Wi-Fi connectivity to hospital networks. Integrated security (CAAM, secure boot, TrustZone-Way) supports FDA 21 CFR Part 11 compliance for electronic records and HIPAA data protection. The 488-TFBGA package's 12x12 mm footprint fits compact handheld form factors requiring 8+ hour battery life per charge.
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Smart Home and Building Automation
Connected smart home hubs and building automation controllers leverage the MCIMX7D3DVK10SC557's rich connectivity: 2x GbE for wired backhaul, 2x USB OTG for Zigbee/Z-Wave dongles, PCIe for Wi-Fi 6/Bluetooth combo modules, and SDIO for local storage. Linux runs Matter/Thread border router software and cloud integration on the A7 cores while the M4F manages real-time HVAC control loops and occupancy sensor fusion. The SoC's low idle power (under 250 mW) suits always-on gateways that must run continuously without raising electricity costs. Hardware security (CAAM crypto accelerator, secure boot) protects TLS keys and prevents firmware tampering in deployed building systems.
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Point-of-Sale Terminals
POS terminals require the MCIMX30062 platform's balance of compute, connectivity, and security that the MCIMX7D3DVK10SC557 delivers. The dual A7 cores run Android for touchscreen POS applications and payment processing, while the M4F handles encrypted PIN pad communication, MSR/card reader polling, and thermal printer stepper motor control at deterministic rates. PCIe supports NFC contactless readers, USB OTG connects to barcode scanners and cash drawers, and dual Ethernet enables IP-based payment terminals and inventory network connectivity. Hardware CAAM encryption secures cardholder data at rest and in transit, supporting PCI PTS 5.x certification paths for payment terminals.
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추천 제품 요약
엔지니어링 참조 데이터: MCIMX7D3DVK10SC557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX7D3DVK10SC | MCIMX7D3DVK10SD | MCIMX7D3EVK10SC | MCIMX7D3DVK12SC | MCIMX7S3DVK08SC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 488-TFBGA (12x12 mm) | 488-TFBGA (12x12 mm) - same | 488-TFBGA (12x12 mm) - same | 488-TFBGA (12x12 mm) - same | 488-TFBGA (12x12 mm) - same | 488-TFBGA (12x12 mm) - same |
| Core Architecture | Dual Cortex-A7 + Cortex-M4F | Dual Cortex-A7 + Cortex-M4F | Dual Cortex-A7 + Cortex-M4F | Dual Cortex-A7 + Cortex-M4F | Dual Cortex-A7 + Cortex-M4F | Single Cortex-A7 + Cortex-M4F |
| Max A7 Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.2 GHz | 0.8 GHz |
| M4F Co-processor | Yes (200 MHz) | Yes (200 MHz) | Yes (200 MHz) | Yes (200 MHz) | Yes (200 MHz) | Yes (200 MHz) |
| USB 2.0 OTG | 2 ports | 2 ports | 2 ports | 2 ports | 2 ports | 2 ports |
| Gigabit Ethernet | 2 MACs | 2 MACs | 2 MACs | 2 MACs | 2 MACs | 2 MACs |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
주요 차별점
- Heterogeneous A7 + M4F architecture for real-time + application processing (vs TI AM437x Sitara)
- Sub-250 mW idle power for energy-efficient always-on operation (vs i.MX 6SoloX (MCIMX6X1EVK10AB))
- Integrated 2D GPU for HMI rendering without external graphics hardware (vs Microchip ATSAMA5D27)
설계 노트
The 488-TFBGA package with 0.8 mm pitch requires a 4-layer minimum PCB stack-up with a continuous ground plane on layer 2 directly beneath the BGA. Per NXP hardware design guide, place 100 nF X7R decoupling capacitors within 2 mm of every power ball, and dedicate at least one 10uF bulk capacitor per power domain. Escape routing must use 0.1 mm traces with 5 ms via-in-pad micro-vias; ENIG surface finish is mandatory for the BGA pads to ensure reliable solder joint formation during reflow.
At peak dual-core A7 load (1 GHz, 1.05V), the SoC dissipates approximately 1.5 W. With the 488-TFBGA's typical theta-JA of 20 C/W in still air and 4-layer PCB, junction temperature rises 30C above ambient. For fanless industrial enclosures reaching 70C ambient, total junction temperature approaches 100C, approaching the 105C industrial limit. Place a thermal pad or coin-sized heatsink on the top of the BGA connected via thermal vias to the inner ground plane for sustained high-load applications.
DDR3/LPDDR3 routing must follow NXP's validated reference layout to meet signal-integrity timing. Do not place the i.MX 7Dual's PCIe or USB 2.0 signals near the DDR data lanes; keep at least 4x trace-width spacing. The PMIC (PCA9450) power-up sequence is critical: ARM core voltage must ramp before SoC I/O voltage to prevent latch-up. Failure to follow the sequence can permanently damage the silicon. Always check chapter 9 of the i.MX 7Dual reference manual for the exact power rail timing diagram.
규정 준수 정보
RoHS and REACH compliant per NXP product declaration. Industrial temperature grade -40C to +105C. Not AEC-Q100 qualified; for automotive applications consider i.MX 8M or NXP's automotive-grade S32K3 MPU family.
