MCZ33905CD3EK - SBC CAN HS 3.3V Dual LIN 54-SOIC-EP | NXP
부품 번호: MCZ33905CD3EK ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.5 | $9.50 |
| 10 | $8.55 | $85.50 |
| 100 | $7.6 | $760.00 |
| 500 | $6.84 | $3,420.00 |
| 1,000 | $6.08 | $6,080.00 |
MCZ33905CD3EK 개요
A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that consolidates the power management, communication transceivers, and protective functions a microcontroller needs around it. Instead of placing a stand-alone LDO, CAN transceiver, LIN transceiver, and reset supervisor separately, an SBC merges these blocks behind a single fault-tolerant interface, which simplifies board layout, reduces BOM count, and improves diagnostic coverage for chassis and body electronics modules.
The device operates from a 5.5V to 28V supply range and supports normal/sleep modes with low quiescent current for battery-friendly standby. It integrates enhanced high-speed CAN compliant with ISO 11898-2 and ISO 11898-5, with local and bus failure diagnostics, protection, and fail-safe behavior. Two LIN 2.x transceivers support body-domain slaves such as seat controllers, window lifters, mirror modules, and sensor clusters. A dedicated 3.3V low-dropout regulator powers the host MCU, while a separate tracker/auxiliary output supports additional ICs.
In operation, the MC33905 sits between the 12V automotive battery rail and a 32-bit MCU. The internal 3.3V LDO feeds the MCU core, the CAN bus is routed through the integrated HS-CAN transceiver to bus pins, and the dual LIN channels are exposed for slave-node communication. The exposed pad (EP) of the 54-SOIC-EP provides the thermal path for sustained battery-voltage load transients.
Key applications include automotive body control modules, gateway modules, HVAC controllers, instrument clusters, and industrial CAN nodes that require both LIN master/slave and HS-CAN. Engineers typically select this SBC when a single-chip solution reduces PCB area, BOM cost, and EMC complexity in mixed CAN/LIN networks.
This page synthesizes distributor availability, parametric positioning, and design guidance not found in the manufacturer datasheet, including a curated cross-reference of same-family NXP SBCs that share the same footprint and pinout, enabling drop-in replacement in long-life programs.
When designing, ensure the exposed pad is soldered to a sufficiently large copper pour to meet the thermal and ground-return requirements of automotive load-dump and jump-start transients, and respect the absolute maximum Vbat rating during reverse-battery events.
드롭인 대체품: MCZ33905CD3EK — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCZ33905CD3EK (동일 폼 팩터 및 풋프린트) — 차이점: CAN Data Rate, CAN Interface, Function, LIN Interface, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCZ33903CD3EK
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.9 / 개
데이터시트 보기 →MCZ33904CD3EK
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCZ33905D3EK
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCZ33905CD3EKR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCZ33905CD3EK 최대 정격 & 전기적 특성
| Product Type | System Basis Chip (SBC) |
| Manufacturer | NXP Semiconductors |
| Series | MC33903/4/5 second-generation SBC |
| 기능 | CAN + LIN + 3.3V LDO System Basis Chip |
| Supply Voltage Range | 5.5 V to 28 V |
| On-board MCU Regulator | 3.3 V LDO |
| CAN Interface | High-Speed CAN (ISO 11898-2 and ISO 11898-5) |
| CAN Data Rate | 20 kbps minimum; up to 1 Mbps typical for HS-CAN |
| LIN Interface | Dual LIN 2.x transceivers |
| Operating Modes | Normal / Sleep |
| 패키지 | 54-SOIC-EP (54-pin SOIC with Exposed Pad) |
| 실장 유형 | Surface Mount |
| Lead-Free / RoHS | Compliant |
| Operating Temperature (Automotive) | -40C to +125C (Grade 1) |
| Applications | Body Control Modules, Gateway, HVAC, Instrument Cluster, Industrial CAN |
| Diagnostic Features | Local and bus failure diagnostics, protection, fail-safe |
MCZ33905CD3EK 54-soic-ep (54-pin soic with exposed pad) 핀 구성 가이드
MCZ33905CD3EK(54-soic-ep (54-pin soic with exposed pad) 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: MCZ33905CD3EK.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCZ33905CD3EK 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Central Gateway ECU, HVAC Control Module, Instrument Cluster, Industrial CAN/LIN Node, Seat / Mirror / Window-Lifter Module.
Automotive Body Control Module (BCM)
The MCZ33905CD3EK is purpose-built for automotive body control modules where it consolidates a 3.3V MCU supply, an ISO 11898-2/-5 HS-CAN transceiver, and two LIN 2.x slaves behind one chip. With a 5.5V to 28V battery input it tolerates 12V jump-start and load-dump transients without external protection, while the integrated 3.3V LDO feeds the host MCU directly. The exposed pad of the 54-SOIC-EP provides the ground and heatsinking path required for sustained body-electronics duty cycles.
추천
Central Gateway ECU
In a central gateway ECU the MCZ33905CD3EK provides the HS-CAN physical layer for backbone communication between CAN sub-networks while the dual LIN channels bridge body-domain LIN clusters to the CAN backbone. The 3.3V LDO powers a 32-bit gateway MCU, and the wide 5.5V to 28V input range accepts direct battery feed in passenger and commercial vehicles. Its diagnostic coverage for local and bus failures supports the fail-safe behavior demanded by gateway architectures.
추천
HVAC Control Module
The MCZ33905CD3EK fits HVAC modules that need to communicate on the vehicle CAN bus while driving multiple LIN-based flaps, blowers, and sensor nodes. Its dual LIN channels let a single SBC drive two independent LIN sub-nets, while the HS-CAN interface talks to the climate-control master on the chassis CAN bus. The integrated 3.3V regulator eliminates an external LDO and the -40C to +125C grade-1 rating supports cabin and engine-bay HVAC packaging.
추천
Instrument Cluster
The MCZ33905CD3EK supports instrument clusters that receive drive data over HS-CAN and control tell-tales or backlighting through LIN. Its integrated 3.3V LDO powers the cluster MCU and display driver, while the wide supply tolerance covers cold-crank and load-dump events on the vehicle battery. The 54-SOIC-EP package is well-suited to the constrained PCB area behind the cluster bezel and offers the ground-return performance needed for EMC-sensitive display signals.
추천
Industrial CAN/LIN Node
The MCZ33905CD3EK serves industrial controllers exposed to wide DC bus voltages from 5.5V to 28V and requiring both CAN and LIN connectivity in one footprint. The integrated HS-CAN and dual LIN make it suitable for factory automation I/O blocks, building automation panels, and agricultural machinery networks. The exposed pad of the SOIC-EP provides the thermal path for sustained 24V industrial operation.
추천
Seat / Mirror / Window-Lifter Module
Body-domain LIN slave modules such as seat controllers, mirror adjusters, and window lifters benefit from the dual LIN channels and the HS-CAN connectivity of the MCZ33905CD3EK. The 3.3V LDO powers the local 8-bit or 32-bit LIN slave MCU, and the wide supply input covers 12V battery transients. The 54-SOIC-EP footprint allows straightforward placement in space-constrained door-module and seat-module PCBs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCZ33905CD3EK — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCZ33903CD3EK | MCZ33904CD3EK | MCZ33905D3EK | MCZ33905CD3EKR2 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 54-SOIC-EP | 54-SOIC-EP | 54-SOIC-EP | 54-SOIC-EP | 54-SOIC-EP |
| Supply Voltage | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| On-board MCU LDO | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| CAN Channels | 1 x HS-CAN (ISO 11898-2/-5) | 1 x HS-CAN | 1 x HS-CAN | 1 x HS-CAN | 1 x HS-CAN |
| LIN Channels | 2 | 1 | 2 (variant dependent) | 2 | 2 |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
| Packing | Tube | Tube | Tube | Tube | Tape and Reel (R2) |
주요 차별점
- Dual LIN 2.x transceivers integrated alongside HS-CAN (vs MCZ33903CD3EK)
- Second-generation SBC family with enhanced diagnostics (vs MCZ33390EFR2)
- Wide 5.5V to 28V supply supports 24V truck networks (vs Discrete LDO + CAN + LIN implementations)
설계 노트
Solder the exposed pad of the 54-SOIC-EP to a continuous ground copper pour of at least 1 square inch. The exposed pad carries both the thermal dissipation path and the low-impedance ground return required during automotive load-dump and jump-start events. Without proper pad soldering the device may overheat or fail EMC.
Place a reverse-battery protection diode or P-MOSFET on the Vbat pin, and add a load-dump clamp (TVS or active suppressor) sized to the absolute maximum battery rating. The MCZ33905CD3EK accepts 5.5V to 28V on Vbat, but transients above this range during alternator load-dump can exceed the absolute maximum if not clamped externally.
Keep the HS-CAN bus pins (CANH, CANL) routed as a differential pair with 120 ohm characteristic impedance and 100 nF bus-splitting capacitors as recommended by ISO 11898-2. Place the LIN bus pins close to the connector with ESD protection diodes rated to at least 8 kV HBM to survive handling and field transients.
Do not assume the MCZ33905CD3EK can drive the MCU I/O directly - the integrated 3.3V LDO is intended for MCU core supply, not high-current peripheral rails. Always check the LDO current capability against the MCU plus peripherals worst case, and add an external regulator if total load is above the SBC rating.
규정 준수 정보
AEC-Q100 qualification is typical for the MC33903/4/5 SBC family per NXP automotive-grade marketing; halogen-free status not stated in verified web data and left as unknown.
