MK22FN256CAP12R - 120MHz Cortex-M4 256KB MCU | NXP
부품 번호: MK22FN256CAP12R ✓ 활성MK22FN256CAP12R 개요
A microcontroller is an integrated circuit containing a processor core, memory, and peripherals on one semiconductor die. The Kinetis K22 belongs to the 32-bit MCU, embedded processor, and semiconductor hierarchy. The ARM Cortex-M4 architecture supports efficient control processing, while the K22 peripheral set integrates digital interfaces, analog conversion, timing, and communication functions that would otherwise require separate components.
Key verified features include an ARM Cortex-M4 core, a maximum 120 MHz operating frequency, 256 KB flash, USB support, and a 3.3 V supply classification. DigiKey identifies the device as an ARM Cortex-M4 Kinetis K20-family microcontroller in an 80-WLCSP package. The small wafer-level chip-scale package supports compact layouts but requires careful PCB design, assembly process control, and inspection because its ball pitch and pad geometry are finer than those of conventional leaded packages.
Technical performance depends on the selected clock configuration, memory organization, peripheral settings, and operating conditions. The supplied search results contain conflicting references to a 48 MHz core frequency on one product-page snippet, while DigiKey and other distributor results identify the device as a 120 MHz part. The 120 MHz value is used here because it appears in the manufacturer-part-derived distributor listing, but engineers should confirm the complete device data sheet and orderable configuration before release.
Typical applications include USB-connected data acquisition, compact industrial controllers, consumer accessories, sensor-hub designs, and low-cost embedded control platforms. USB support is useful when a product needs a standard host interface, while the Cortex-M4 core provides enough performance for protocol handling and real-time control tasks.
Design considerations begin with PCB layout. An 80-ball WLCSP generally cannot be hand-soldered and should be assembled using an appropriate SMT process. Place decoupling close to supply balls, preserve the exposed-thermal-ball pattern recommended by NXP, and verify the land pattern against the official package drawing before fabrication.
This page consolidates verified distributor and manufacturer-part information, flags conflicting source data, and adds practical sourcing and assembly context that should be checked against the official NXP documentation before design release.
드롭인 대체품: MK22FN256CAP12R — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MK22FN256CAP12
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MK22FN256CAP12R 최대 정격 & 전기적 특성
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Series | Kinetis K22 |
| Processor Core | ARM Cortex-M4 |
| Maximum CPU Frequency | 120 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 bits |
| USB Support | Yes |
| Supply Voltage Classification | 3.3 V |
| 패키지 | 80-WLCSP |
| Package Dimensions | 4.13 mm x 3.56 mm |
| Terminal Count | 80 balls |
| Instruction Architecture | 32-bit RISC |
| 실장 유형 | Surface mount |
| Temperature Grade | Industrial |
| Order Packaging | Tape and reel |
MK22FN256CAP12R 4.13 mm x 3.56 mm 핀 구성 가이드
MK22FN256CAP12R(4.13 mm x 3.56 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MK22FN256CAP12R.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MK22FN256CAP12R 적합 용도: 6 애플리케이션s: USB Data-Acquisition Controller, Industrial Sensor Hub, USB-C Connected Accessory, Compact Control and Monitoring Unit, Low-Cost IoT Sensor Node, Prototype-to-Production Embedded Platform.
USB Data-Acquisition Controller
The MK22FN256CAP12R fits compact USB data-acquisition systems because it combines a 32-bit ARM Cortex-M4 core, verified USB support, and 256 KB of flash in one controller. The MCU can coordinate sensor sampling, perform scaling and filtering, format data for a USB host, and supervise configurable front-end signals without a separate USB interface device. Its 4.13 mm by 3.56 mm 80-WLCSP package also reduces board footprint, which is useful beside compact sensor arrays. The principal tradeoff is assembly complexity: the fine-pitch WLCSP requires qualified land patterns, controlled solder paste deposition, and careful X-ray or visual process validation.
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Industrial Sensor Hub
The MK22FN256CAP12R is suitable for an industrial sensor hub that gathers multiple low- or medium-speed sensor channels and presents processed data through USB. Its 32-bit RISC architecture supports efficient digital filtering, device management, and protocol handling, while the verified 256 KB flash store is suitable for firmware and configuration data. The 80-WLCSP footprint helps reduce controller-board size when sensors and connectors are densely packed. Engineers should verify the exact analog and digital peripheral assignments, operating-temperature requirements, and industrial-grade status in the complete NXP documentation before production use.
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USB-C Connected Accessory
The MK22FN256CAP12R can serve as the control MCU in a compact USB-connected consumer accessory requiring local logic and firmware rather than a host computer for basic operation. USB support, a 120 MHz-class Cortex-M4 core, and 256 KB flash provide a practical combination for status control, configuration, diagnostics, and firmware updates. The small WLCSP package helps keep the enclosure unobtrusive. Designers should route USB D+ and D- as a controlled impedance pair, provide the required series resistors and protection, and validate the complete interface against the intended USB standard and connector implementation.
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Compact Control and Monitoring Unit
The MK22FN256CAP12R can act as the central controller in a compact monitoring unit for pumps, fans, relays, or instrumentation. The 32-bit processor provides deterministic control capabilities, while USB offers a service interface for configuration, logs, firmware updates, and host communication. Its 256 KB flash footprint can hold moderate application firmware when external storage is unnecessary. Because the supplied data does not enumerate every peripheral or pin, designers must confirm timer, communications, analog, and interrupt resources in the official data sheet before assigning external circuitry.
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Low-Cost IoT Sensor Node
The MK22FN256CAP12R is appropriate for a low-cost IoT sensor node when local processing, USB service connectivity, and a compact board are priorities. It can sample sensors, debounce inputs, manage low-power states, and expose configuration data through USB. The Cortex-M4 core provides more general processing headroom than a simple state machine, while 256 KB flash can accommodate moderate firmware. Low-power behavior, retention modes, and analog performance must be evaluated from the complete NXP documentation; the verified snippets do not provide current-consumption figures or a detailed power table.
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Prototype-to-Production Embedded Platform
The MK22FN256CAP12R can support an embedded control platform that begins as a proof of concept and moves toward compact production hardware. Its ARM Cortex-M4 architecture supports a modern toolchain, the verified 256 KB flash provides a defined firmware budget, and USB simplifies commissioning. The 80-WLCSP package is not well suited to hand assembly, so prototype boards may need fine-pitch SMT capability from the first build. A staged hardware strategy can use the same firmware architecture on a temporary development platform, then transfer only after pin multiplexing, power, clock, and USB behavior are verified on the target package.
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추천 제품 요약
엔지니어링 참조 데이터: MK22FN256CAP12R — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MK22FN256CAP12 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 80-WLCSP | 80-WLCSP family configuration |
| Processor Core | ARM Cortex-M4 | ARM Cortex-M4 |
| Maximum CPU Frequency | 120 MHz | 48 MHz in one retrieved NXP snippet; conflict requires verification |
| Flash Memory | 256 KB | 256 KB |
| USB Support | Yes | Yes |
| Order Suffix | R | No R suffix in the retrieved product-page identifier |
주요 차별점
- Single-device integration of control and USB connectivity (vs MK22FN512CAP12)
- Defined 256 KB flash budget (vs MK22FN512CAP12)
- Compact 80-WLCSP footprint (vs MK40DN512VLK10)
- 120 MHz-class distributor-listed performance (vs MK22FN256CAP12 product-page snippet)
설계 노트
Use the exact NXP 80-WLCSP land pattern and ball map before PCB release. The verified package is approximately 4.13 mm by 3.56 mm, so small placement or land-pattern errors can cause solder bridges, opens, or inspection ambiguity. Keep high-speed routes short, preserve any exposed-ball thermal and grounding requirements, and validate the design with the package drawing and assembly guidelines rather than a generic BGA footprint.
Confirm the complete operating-voltage range, decoupling requirements, and power-source current limits from the official NXP data sheet before assigning regulators or bulk capacitance. The search snippets classify this part as a 3.3 V device but do not expose individual I/O or core voltage domains. Place the required supply and ground decoupling balls close to their associated pins, maintain a quiet return path, and avoid routing noisy switching nodes beneath sensitive MCU connections.
Treat USB routing as a controlled-impedance interface rather than an ordinary low-speed signal. Match D+ and D- trace geometry, minimize stubs and vias, provide the specified series resistance, and connect the external protection network only after checking NXP application guidance. Also separate clocks, analog inputs, and sensitive sensing routes from switching-node copper where practical; the retrieved snippets do not provide the complete pin-multiplexing table needed for final routing.
Do not infer a pinout, peripheral assignment, or lifecycle promise from distributor title strings. The source set contains inconsistent descriptions, including 48 MHz versus 120 MHz and references to K22F or K20 families. Download the official NXP document for MK22FN256CAP12, verify the exact orderable suffix and revision, then recheck flash size, clock, USB, pin multiplexing, temperature grade, and compliance before schematic release.
Validate junction temperature and PCB thermal performance at the actual ambient temperature and operating clock. The supplied data does not provide theta-JA, theta-JC, maximum power dissipation, or exposed-pad geometry, so a reliable heatsink or copper-area recommendation cannot be stated numerically. Estimate total power from the selected clock, I/O load, analog activity, and supply rails, then compare the resulting temperature rise with the official NXP thermal limits.
규정 준수 정보
The supplied verified snippets do not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Industrial temperature grade is reported by Partstack, but it must not be interpreted as AEC-Q100 automotive qualification. Obtain current declarations and the manufacturer document for production release.
