NXP Semiconductors

MK51DN256ZCMD10 - 100MHz Cortex-M4 MCU | NXP

부품 번호: MK51DN256ZCMD10 ✗ 단종
1.71 V to 3.6 V Vdss 144-MAPBGA, 13 x 13 mm Package 100 MHz Speed 256 KB Memory
MOQ: 1 |

MK51DN256ZCMD10 개요

NXP Semiconductors MK51DN256ZCMD10 is a 32-bit Kinetis K51 measurement microcontroller built on the Arm Cortex-M4 core, operating at up to 100 MHz. It integrates 256 KB of Flash memory, 64 KB of SRAM, USB, a segment LCD interface, and advanced serial communications in a 144-MAPBGA package measuring 13 x 13 mm. The device is identified as NRND by NXP, so new designs should verify roadmap and sourcing implications before committing.

A microcontroller is a programmable control component that combines a processor core, memory, and peripherals on one integrated circuit. In the hierarchy, this device is an MCU, a semiconductor, and a member of the Kinetis K51 measurement family. Its Cortex-M4 architecture supports real-time control and signal-processing workloads, while USB, LCD, ADC, DAC, and communications resources reduce the number of external devices required in measurement instruments.

Verified listings identify 100 MHz operation, 256 KB Flash, 64 KB SRAM, USB, and a segment LCD interface. Additional source material describes dual 16-bit ADCs and dual 12-bit DACs, but those details should be checked against the official device documentation before design release. The 144-MAPBGA package is compact but requires careful PCB escape routing and assembly capability.

Typical uses include industrial measurement, data acquisition, portable instrumentation, USB-connected test equipment, and control panels with segment displays. The 100 MHz core and integrated analog resources are useful when a design needs deterministic sampling, communication, and local control in one device. Software support and peripheral configuration remain critical engineering considerations.

For layout, provide short, well-decoupled power connections, controlled-return clocks, and accessible test points. Validate analog and digital return paths to preserve measurement accuracy. This page consolidates verified source information, lifecycle status, commercial data, and design cautions; it does not infer missing electrical details or unverified pin assignments.

드롭인 대체품: MK51DN256ZCMD10 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 제품에는 사용 가능한 드롭인 대체품이 없습니다.

대체품 요청

MK51DN256ZCMD10 최대 정격 & 전기적 특성

Core Arm Cortex-M4
Architecture 32-bit
최대 클록 주파수 100 MHz
Flash Memory 256 KB
SRAM 64 KB
공급 전압 1.71 V to 3.6 V
I/O Ports 91
USB USB 2.0 full-speed device
Display Interface Segment LCD
ADC Dual 16-bit ADC
DAC Dual 12-bit DAC
패키지 144-MAPBGA, 13 x 13 mm
실장 유형 Surface Mount
수명 주기 상태 NRND
Family Kinetis K51 measurement MCU
Operating Range Industrial

MK51DN256ZCMD10 144-mapbga, 13 x 13 mm 핀 구성 가이드

MK51DN256ZCMD10(144-mapbga, 13 x 13 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MK51DN256ZCMD10의 144-mapbga, 13 x 13 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MK51DN256ZCMD10.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MK51DN256ZCMD10 적합 용도: 6 애플리케이션s: Industrial Data Acquisition, USB Connected Test Equipment, Portable Measurement Instruments, Industrial Control Panel, Sensor Signal Conditioning Node, Embedded Communications Controller.

🏭

Industrial Data Acquisition

The MK51DN256ZCMD10 fits industrial data-acquisition equipment that needs local control, sampling, and host connectivity in one device. Its verified 100 MHz Arm Cortex-M4 core provides timing headroom for signal-processing and supervisory tasks, while 256 KB Flash supports firmware, calibration tables, and protocol handlers. The 64 KB SRAM can hold working buffers without requiring an external memory bus in suitable designs. USB connectivity can simplify host communication, and the measurement-oriented peripherals are useful when the analog front end is designed alongside the MCU. Because the part is NRND and uses 144-MAPBGA, production planning should include lifecycle review, assembly capability, and long-term sourcing confirmation.

🖥️

USB Connected Test Equipment

The MK51DN256ZCMD10 is appropriate for USB-connected test equipment where a compact controller must manage acquisition, control, and data transfer. The 32-bit Cortex-M4 core can execute protocol software and supervisory logic at up to 100 MHz, while the 256 KB Flash and 64 KB SRAM provide useful embedded storage for firmware and working data. USB 2.0 full-speed device support can reduce the number of external interface components. The final USB design must still verify signal routing, power requirements, firmware support, and enumeration behavior against the official documentation. The 13 x 13 mm MAPBGA package also requires an assembly process capable of handling fine-pitch BGA interconnects.

📱

Portable Measurement Instruments

The MK51DN256ZCMD10 can serve as the control core in a portable measurement instrument where a segment LCD, USB communication, and compact board area are valuable. The 100 MHz Cortex-M4 core supports responsive user-interface and measurement-control tasks, and the 256 KB Flash accommodates application firmware, menus, and calibration constants. A segment LCD interface can reduce display-driver complexity when the display architecture matches the device requirements. Designers should verify low-power requirements, analog accuracy, and display timing from the official data sheet because those details are not fully supplied here. Battery-powered products should also review regulator efficiency and thermal performance rather than assuming the MCU specification alone determines system power.

🔧

Industrial Control Panel

The MK51DN256ZCMD10 is suitable for a compact industrial control panel that combines a segment LCD, USB service communication, and embedded control logic. The 91 reported I/O ports provide a substantial interface budget for buttons, indicators, relays, sensors, and digital control signals, while the 100 MHz core can manage multiple tasks and communications. The 256 KB Flash is useful for storing application logic and field-upgrade support, subject to the device’s official memory and boot requirements. Pin multiplexing and voltage constraints must be checked carefully in the 144-MAPBGA footprint. Industrial temperature, EMC, isolation, and regulatory requirements should be evaluated at the system level rather than inferred from the microcontroller family name.

🧩

Sensor Signal Conditioning Node

The MK51DN256ZCMD10 can be used in a sensor signal-conditioning node when the controller must acquire measurements, process results, and expose data through USB or a display. The verified 100 MHz Cortex-M4 performance is appropriate for supervisory digital processing, while the source material identifies dual 16-bit ADCs and dual 12-bit DACs as integrated resources. Actual signal-chain performance depends on reference voltage, sampling architecture, analog front end, calibration, and PCB layout, none of which are fully specified in the supplied data. Engineers should verify the exact ADC/DAC electrical characteristics and pin assignments in the official NXP data sheet before defining gain, bandwidth, or accuracy targets.

🌐

Embedded Communications Controller

The MK51DN256ZCMD10 can support an embedded communications controller when USB is the principal host interface and the application needs more processing capacity than a small 8-bit or low-memory MCU. The 32-bit Cortex-M4 architecture, 100 MHz maximum clock, 256 KB Flash, and 64 KB SRAM provide resources for protocol stacks, buffering, diagnostics, and supervisory logic. USB full-speed operation can simplify connection to a host computer or service interface. The design must validate transceiver or connector requirements, power-budget limits, firmware support, and enumeration timing. Because no verified drop-in substitute was found, firmware and board compatibility should be controlled as part of the product maintenance plan.

What is the NXP Semiconductors MK51DN256ZCMD10?
The NXP Semiconductors MK51DN256ZCMD10 is a 32-bit Kinetis K51 measurement microcontroller based on the Arm Cortex-M4 core. Verified distributor and manufacturer information identifies up to 100 MHz operation, 256 KB Flash, 64 KB SRAM, USB, and a segment LCD interface in a 144-MAPBGA package. NXP lists the device as NRND, so availability and lifecycle suitability should be checked before new design approval.
What are the key specifications of MK51DN256ZCMD10 that engineers should know?
The key specifications are a 32-bit Arm Cortex-M4 core, up to 100 MHz clocking, 256 KB Flash memory, 64 KB SRAM, a 1.71 V to 3.6 V supply range, and 91 I/O ports. The package is 144-MAPBGA measuring 13 x 13 mm. Verified source listings also identify USB and segment LCD support, making the device suitable for measurement systems that combine control, communication, and local display functions.
Is MK51DN256ZCMD10 in stock?
Stock status is not conclusively established by the provided data. DigiKey’s listing states “Order today, ships today,” while NXP marks the part NRND. XAIPART should confirm current inventory and delivery before purchase. Because lifecycle status and distributor inventory can change, request a written stock confirmation and lot-planning information for production quantities.
Where can I buy MK51DN256ZCMD10 online?
MK51DN256ZCMD10 can be investigated through the listed Mouser, DigiKey, NXP, and Verified Electronics channels. The provided Verified Electronics result shows a price of $9.75 per piece and mentions sample availability; DigiKey identifies the component as orderable and ships today. Contact the distributor or XAIPART for a current quote because the part is NRND and pricing may change.
What is the price of MK51DN256ZCMD10?
The provided commercial data lists MK51DN256ZCMD10 at $9.75 per piece from Verified Electronics as of 2026-10-21. That price is a single-source listing, not a universal market quote. Volume pricing, stock, delivery terms, and distributor authorization should be confirmed with the supplier before using it in a production budget.
What is the lead time for MK51DN256ZCMD10?
The lead time is not stated in the provided data. DigiKey’s “ships today” wording indicates that the listing was presented as immediately orderable, but it does not establish a guaranteed lead time for every quantity or every package format. Request a quantity-specific delivery commitment, especially for production builds, because NXP identifies the device as NRND.
Where can I download the MK51DN256ZCMD10 datasheet PDF?
The official starting point for the MK51DN256ZCMD10 datasheet is the NXP product page, which provides the Data Sheet document through its documentation resources. Distributor and third-party pages also provide product links, but NXP’s official page is the preferred source for revisions and device documentation. Verify the exact package suffix and pin assignments against the official data sheet before layout release.
Where can I find the MK51DN256ZCMD10 pinout?
The MK51DN256ZCMD10 pinout is not reproduced in the provided search results, so the official NXP data sheet and package drawing are required. The device is identified as 144-MAPBGA, making the exposed-ball layout and ball assignments especially important for PCB design. Do not infer a pinout from a similarly named Kinetis device; verify all 144 balls, power rails, grounds, and exposed-pad requirements against the official documentation.
Can MK51DN256ZCMD10 be used for USB measurement equipment?
The MK51DN256ZCMD10 is suitable as the basis for USB measurement equipment when the required peripherals and firmware are confirmed in the official documentation. Verified information identifies a 100 MHz Cortex-M4 core, 256 KB Flash, 64 KB SRAM, USB, and measurement-oriented analog resources. The MCU can manage control logic and USB connectivity, while the actual measurement accuracy depends on the selected ADC path, analog front end, calibration, and signal-conditioning design.
When should I choose MK51DN256ZCMD10 over another microcontroller?
Choose MK51DN256ZCMD10 when an existing design needs a 100 MHz Arm Cortex-M4 MCU with 256 KB Flash, 64 KB SRAM, USB, segment LCD support, and measurement-focused integration. It is also relevant when a 144-MAPBGA assembly process and an NRND sourcing plan are acceptable. For a new high-volume design, compare current active devices instead of assuming this NRND part is the lowest-risk choice.
What is the difference between MK51DN256ZCMD10 and MK53DX256CMD10?
MK53DX256CMD10 is a different Kinetis-family part, but the provided comparison result does not publish enough verified electrical or pin-compatibility data to call it a drop-in replacement. A family or feature comparison is not sufficient for PCB interchange because memory, peripherals, voltage, ball assignments, and software support must match. Treat MK53DX256CMD10 as a redesign candidate until the manufacturer data sheets and a detailed cross-reference verify every requirement.
Is MK51DN256ZCMD10 the same as MK53DX256CMD10?
No exact equivalence can be established from the provided information. The two MPNs appear in a comparison tool, but the data does not demonstrate identical pinout, package ball mapping, memory map, peripheral set, electrical limits, or firmware compatibility. Engineers should not substitute one for the other solely because both are Kinetis devices. Obtain both official data sheets and validate the replacement through hardware review.
What can replace MK51DN256ZCMD10?
No verified pin-to-pin drop-in replacement is established by the supplied cross-reference data. Search results provide tools and comparison pages, but they do not document a same-package, pin-compatible substitute with confirmed electrical and peripheral equivalence. Because MK51DN256ZCMD10 uses a 144-MAPBGA package and has a complex mixed-signal peripheral set, any replacement should be treated as a redesign unless an authorized source confirms exact compatibility.
Is there an NXP drop-in replacement for MK51DN256ZCMD10?
The provided search results do not identify a verified NXP drop-in replacement for MK51DN256ZCMD10. NXP’s own cross-reference service is available, but a suitable candidate must be confirmed against the official package drawing, electrical specifications, pin multiplexing, memory, and peripheral requirements. Do not use a generic Kinetis part or another 144-MAPBGA MCU as a substitute without a manufacturer-supported comparison and board-level validation.
How should MK51DN256ZCMD10 be designed into a PCB?
Design the 144-MAPBGA layout from the official NXP package drawing and pin-assignment documentation. Keep power and ground connections short, provide local decoupling according to the data sheet, route clocks with controlled impedance, and preserve analog and digital return-path separation for measurement accuracy. The BGA process requires appropriate via, solder-mask, paste, inspection, and assembly capabilities. Complete a DRC, thermal review, and prototype measurement before production.
Does MK51DN256ZCMD10 support RoHS and REACH compliance?
The supplied data does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Those fields must therefore remain unknown rather than being inferred from the manufacturer or package type. Review the current NXP product documentation and quality declarations for the exact orderable MPN. Compliance requirements also depend on the customer, region, and finished-product context.

엔지니어링 참조 데이터: MK51DN256ZCMD10 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Select MK51DN256ZCMD10 when an existing Kinetis K51 design needs a 100 MHz Cortex-M4 core, 256 KB Flash, 64 KB SRAM, USB, and segment LCD functionality in a 144-MAPBGA package. It is especially relevant for measurement instruments and embedded data-acquisition products where local control and USB connectivity are useful. Because the device is NRND and no verified drop-in alternative was identified, engineers should not substitute it without a complete package, electrical, peripheral, and firmware review. For new high-volume products, compare current active NXP or competing devices before committing to this lifecycle status. For legacy maintenance, confirm remaining supply, storage conditions, and long-term procurement plans with an authorized source.

대체품과의 비교

파라미터 이 제품
Package 144-MAPBGA (13 x 13 mm)
Brand NXP Semiconductors
Core Arm Cortex-M4
Maximum Clock Frequency 100 MHz
Flash Memory 256 KB
SRAM 64 KB
Supply Voltage 1.71 V to 3.6 V
USB USB 2.0 full-speed device
Display Interface Segment LCD
I/O Ports 91
ADC Dual 16-bit ADC
DAC Dual 12-bit DAC
Lifecycle Status NRND
Unit Price $9.75 as of 2026-10-21

주요 차별점

  • Measurement-oriented integration (vs MK53DX256CMD10)
  • Processing and memory balance (vs MCF51JE256CMB)
  • USB and display integration (vs MK50DX256CLK10)

설계 노트

Treat the 144-MAPBGA footprint as a controlled-layout item. Obtain the official NXP package drawing and pin-assignment file before placing escape vias or defining the land pattern. Keep power and ground connections short, provide local decoupling at the relevant supply pins, and route sensitive analog inputs away from high-current switching nodes. A completed assembly drawing should include the exact ball map, exposed thermal or ground requirements, paste volume, and inspection requirements.

For measurement and USB-connected designs, preserve return-current continuity and separate noisy digital switching paths from analog inputs. Use a continuous ground reference where possible, avoid long splits beneath high-speed or USB routing, and validate the PCB stack-up with controlled-impedance calculations. The supplied data confirms USB and measurement features but does not provide pin-level routing guidance, so the official NXP documentation must control the final layout.

Do not treat a Kinetis-family comparison as proof of drop-in compatibility. MK51DN256ZCMD10 uses a 144-MAPBGA package and has a complex peripheral pin mux, so a candidate must match the package ball map, supply limits, memory organization, peripheral functions, and software support. The lifecycle status is NRND; record the exact ordering code, obtain a current availability commitment, and validate any replacement through schematic, PCB, firmware, and hardware regression testing.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

The supplied search results do not explicitly state compliance declarations for this exact MPN. Review current NXP environmental and quality documentation before release.

데이터 검증일: 2026-10-21 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MK51DN256ZCMD10 MK51DN256ZCMD10 datasheet NXP MK51DN256ZCMD10 MK51DN256ZCMD10 100MHz Cortex-M4 MK51DN256ZCMD10 256KB Flash 64KB SRAM 144-MAPBGA Kinetis K51 microcontroller MK51DN256ZCMD10 USB measurement MCU MK51DN256ZCMD10 price MK51DN256ZCMD10 vs MK53DX256CMD10 MK51DN256ZCMD10 pinout MK51DN256ZCMD10 drop-in replacement Kinetis K51 segment LCD microcontroller

관련 부품 & 용어

NXP Semiconductors MK51DN256ZCMD10 Kinetis K51 Arm Cortex-M4 microcontroller MCU 32-bit microcontroller semiconductor embedded control measurement system USB 2.0 full-speed segment LCD 256 KB Flash 64 KB SRAM 144-MAPBGA 13 x 13 mm package ADC DAC NRND industrial data acquisition USB communications signal conditioning PCB layout pin compatibility Kinetis cross reference
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