MPC5123VY400B - 400MHz e300 Telematics MCU | NXP Semiconductors
부품 번호: MPC5123VY400B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.9 | $299.00 |
| 100 | $26.8 | $2,680.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $21.6 | $21,600.00 |
MPC5123VY400B 개요
A microcontroller of this class is a system-on-chip that combines a processor core, memory controllers, and a broad set of peripherals on a single die, occupying the upper tier of the embedded processor hierarchy between microcontrollers and full application processors. The MPC5123 family descends from Freescale/NXP mobileGT (MPC5121e/MPC5123) platform, which provides an excellent computing platform for OEM, aftermarket, commercial telematics, and consumer applications, including embedded solutions requiring network connectivity, graphics and a graphical user interface.
Key features include the e300 RISC core executing Power Architecture instructions at 400 MHz, ROMless boot architecture allowing full firmware flexibility from external NOR/NAND flash, and the mobileGT MPC512x peripheral complex covering communication, display, and system-control functions. The MPC5123VY400B is the variant without the MBX graphics accelerator, trading graphics capability for cost and power; designs needing 2D/3D graphics should consider MPC5121e variants instead.
Technical depth: the e300 core implements the PowerPC Book E-derived architecture with separate instruction and data caches, delivering deterministic real-time behavior well suited to automotive-grade telematics workloads. Device documentation was published by Freescale Semiconductor (now NXP) as the MPC5121e/MPC5123 data sheet, including an 86-page hardware specification and a 2012-revision datasheet.
Typical applications include vehicle telematics control units, fleet-management gateways, aftermarket navigation and infotainment head units, and industrial HMI controllers requiring network connectivity and a GUI.
Design consideration: because the device is ROMless, boot-time external flash selection and bus loading must be verified early; power-supply sequencing of the 3.3V domain should follow the manufacturer datasheet guidance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet. Pricing referenced as of 2026-10-18.
드롭인 대체품: MPC5123VY400B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC5123VY400B (동일 폼 팩터 및 풋프린트) — 차이점: Core Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC5123YVY400B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC5121YVY400B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5121YVY400B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC5123VY400B 최대 정격 & 전기적 특성
| Core Processor | e300 (Power Architecture) |
| Core Size | 32-Bit |
| Speed | 400 MHz |
| Program Memory Type | ROMless |
| 공급 전압 | 3.3 V |
| 패키지 | 516-FPBGA (27x27 mm) |
| 실장 유형 | Surface Mount |
| Family | MPC512x (mobileGT MPC51xx) |
| Product Type | Telematics Processor |
| Graphics Accelerator | No (without MBX graphics) |
| Applications | OEM, aftermarket, commercial telematics, consumer embedded |
| Connectivity Features | Network connectivity peripheral set |
| Data File Size | 691 Kbytes (datasheet PDF, 86 pages) |
| 수명 주기 상태 | Not recommended for new designs (EOL per distributor listings) |
MPC5123VY400B 516-fpbga (27x27 mm) 핀 구성 가이드
MPC5123VY400B(516-fpbga (27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC5123VY400B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC5123VY400B 적합 용도: 6 애플리케이션s: Vehicle Telematics Control Unit, Fleet Management Gateway, Aftermarket Navigation Head Unit, Industrial HMI Controller, Commercial Fleet ELD / Compliance Recorder, Networked Embedded Consumer Devices.
Vehicle Telematics Control Unit
The MPC5123VY400B was purpose-built as a telematics processor: its 400 MHz e300 Power Architecture core delivers the deterministic real-time throughput needed to aggregate CAN, GPS, and cellular-modem data streams in a vehicle TCU. Because the device is ROMless, firmware is held in external NOR/NAND flash, allowing fleet operators to field-update telematics software without touching silicon. Designs lacking MBX graphics requirements save cost versus MPC5121e variants while retaining the full mobileGT communication peripheral set. Place the 516-FPBGA on a 6-8 layer board with a solid 3.3V power plane and follow the Freescale datasheet boot-bus layout rules for the external memory controller.
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Fleet Management Gateway
Commercial telematics gateways must run protocol stacks, data logging, and wireless modem management concurrently. The MPC5123VY400B's 400 MHz RISC core with separate instruction and data caches sustains multi-task Linux or RTOS workloads, while its network-connectivity peripheral complex (per the manufacturer datasheet) interfaces Ethernet, USB, and serial links. The 3.3V single-rail family simplifies power-tree design in vehicle 12V/24V systems fed from a DC-DC front end. Because the part is EOL, design teams sustaining gateway lines should implement last-time-buy inventory with XAIPART and plan a migration path toward NXP i.MX processors.
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Aftermarket Navigation Head Unit
Aftermarket navigation units need a computing platform with display output and a graphical user interface; the MPC5121e/MPC5123 mobileGT platform was explicitly marketed for such consumer and aftermarket applications. The MPC5123VY400B handles navigation computation and modem connectivity, and where hardware 2D/3D acceleration is needed the pin-compatible MPC5121YVY400B substitutes without PCB rework thanks to the shared 516-FPBGA (27x27 mm) footprint. ROMless boot from external NAND flash enables map-data and firmware updates. Verify display-interface pin multiplexing in the MPC512x reference manual before layout.
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Industrial HMI Controller
Industrial human-machine-interface panels benefit from the MPC5123VY400B's balance of raw compute (400 MHz e300 core) and I/O breadth within one 3.3V device. Its Power Architecture heritage gives deterministic interrupt latency for machine-control loops while the peripheral complex drives touch controllers, Ethernet backhaul, and serial fieldbus bridges. The ROMless architecture means application firmware lives in industrial-temperature NOR flash, simplifying certification of field-updated code. Designers should budget for the 27x27 mm BGA footprint and X-ray inspection capability in production, and observe the manufacturer's power-sequencing guidance during cold start.
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Commercial Fleet ELD / Compliance Recorder
Electronic logging devices and compliance recorders demand reliable data capture with tamper-resistant timestamping. The MPC5123VY400B sustains continuous CAN and GPS acquisition at 400 MHz while executing encryption and storage tasks on the same core, avoiding a second MCU. Its commercial telematics pedigree (per the Freescale/NXP datasheet) covers exactly this OEM and aftermarket segment. The external-flash boot model lets integrators lock firmware versions for audit trails. When qualifying vehicle programs, the SPC5121YVY400B automotive-qualified sibling in the identical BGA-516 package allows the same PCB design to move into certified production.
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Networked Embedded Consumer Devices
Beyond vehicles, the MPC5121e/MPC5123 datasheet positions the family for consumer embedded solutions requiring network connectivity and a GUI - networked appliances, kiosks, and smart displays. The 400 MHz e300 core runs embedded Linux competently, and the 3.3V 516-FPBGA device integrates the communication peripherals that would otherwise need discrete controllers, cutting BOM count. For EOL-risk-aware consumer designs, the same-package MPC5121YVY400B offers graphics acceleration as an upgrade path within the existing footprint. Prototype with XAIPART-sourced MPC5123VY400B stock, then finalize volume ordering before allocated inventory is exhausted.
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추천 제품 요약
엔지니어링 참조 데이터: MPC5123VY400B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC5123YVY400B | MPC5121YVY400B | SPC5121YVY400B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-FPBGA (27x27 mm) | 516-FPBGA (27x27 mm) - same | BGA-516 - same | BGA-516 - same |
| Core / Speed | e300, 400 MHz | e300, 400 MHz | e300, 400 MHz | e300, 400 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless |
| MBX Graphics Core | No | No | Yes (MBX) | Yes (MBX) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Qualification Grade | Standard | Standard | Standard | Automotive (SPC prefix) |
| Family Platform | MPC5123 (mobileGT MPC51xx) | MPC5123 | MPC5121e | SPC5121e |
주요 차별점
- Cost-optimized telematics compute without graphics silicon (vs MPC5121YVY400B)
- Same-die sourcing redundancy (vs MPC5123YVY400B)
- Automotive upgrade path without PCB rework (vs SPC5121YVY400B)
설계 노트
The MPC5123VY400B is ROMless: all boot and application code comes from external flash. A common bring-up failure is boot-bus overloading - long traces or excessive loading on the NOR/NAND bus can violate timing at 400 MHz core operation. Verify the boot device against the memory-controller timing tables in the manufacturer data sheet and keep boot-flash stub traces under the length limits given in the hardware design guide. Also confirm power-sequencing of the 3.3V domain per datasheet recommendations before first power-on.
The 516-ball FPBGA (27x27 mm, 0.8 mm-class ball pitch class for this family) requires a dedicated BGA escape strategy - typically via-in-pad or dog-bone fanout on at least six signal layers with dedicated power and ground planes. Plan X-ray inspection in production to verify reflow quality under the die. Decouple each VDD ball per the manufacturer's decoupling network recommendation in the MPC512x hardware specification; do not consolidate decoupling capacitors, as core-core and I-O domains must be bypassed independently.
Estimated: the device family operates from a 3.3V supply; actual core and I-O current draw depends on the MPC5123 power-mode table in the manufacturer data sheet. Budget the power tree for both full-run and low-power idle modes, and size the upstream DC-DC converter for worst-case active current plus margin for external flash read bursts during boot. Because the part is EOL, frozen-power designs should be validated on remaining date-code stock to catch any process-corner variation.
High-speed peripheral buses (memory controller, PCI/USB class interfaces in the MPC512x complex) need impedance-controlled routing and length matching per the reference manual's layout guidelines. Maintain solid reference planes under memory bus traces, avoid crossing plane splits, and series-terminate clock lines. The 27x27 mm BGA concentrates many simultaneously switching outputs - review ground return paths to minimize simultaneous-switching noise on the shared 3.3V I-O rail.
규정 준수 정보
Compliance status not stated in the provided web data; verify against the NXP product compliance portal. The SPC5121YVY400B sibling is the automotive-qualified family variant.
