MPC561MVR56 - 56MHz PowerPC Qorivva MCU, ROMless 388-PBGA | NXP
부품 번호: MPC561MVR56 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $62.72 | $62.72 |
| 10 | $58.4 | $584.00 |
| 100 | $54.1 | $5,410.00 |
| 500 | $49.85 | $24,925.00 |
| 1,000 | $45.2 | $45,200.00 |
MPC561MVR56 개요
An automotive microcontroller (MCU) is a microprocessor unit engineered for the harsh electrical, thermal, and vibration environments of vehicle electronics. Within the broader taxonomy, an MCU is a subset of microprocessors -> embedded processors -> semiconductors. The Qorivva family sits under NXP's automotive 32-bit MCU lineup and inherits Power Architecture instruction set compatibility from the PowerPC lineage, providing deterministic interrupt response and strong bit-manipulation performance that real-time control loops require.
Key features include a 32-bit PowerPC core, 32 analog-to-digital input channels for sensor interfacing, ROMless program memory architecture for maximum firmware flexibility, and a 56 MHz maximum clock frequency. The 388-PBGA package provides extensive I/O with 388 balls, suitable for high-pin-count automotive body, chassis, and powertrain applications. Per the NXP/Freescale datasheet summary, the device integrates powerful peripheral subsystems combining high-performance data manipulation capabilities.
Typical applications include engine management units, transmission control modules, body controllers, chassis electronics, and industrial real-time control systems. Its automotive qualification and rich peripheral set make it well suited to safety-relevant control loops where deterministic execution matters more than raw clock speed.
When designing with this part, allocate sufficient PCB area for the 27x27 mm BGA footprint and plan external program memory (NOR flash or similar) since the part is ROMless. Validate thermal design for the -40C to +125C operating envelope and review the BGA ballout before committing to a layout revision.
This page synthesizes distributor stock, drop-in same-package alternatives, parametric comparisons, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: MPC561MVR56 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC561MVR56 (동일 폼 팩터 및 풋프린트) — 차이점: Program Memory Type, RoHS Status, Mounting Type, Package, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC563MVR56
✅ 드롭인✓ 재고 있음
$64.1 / 개
데이터시트 보기 →MPC565MVR56
✅ 드롭인✓ 재고 있음
$27.1 / 개
데이터시트 보기 →MPC561MVR56R2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC561MVR56 최대 정격 & 전기적 특성
| Core Architecture | PowerPC MPC5xx (Qorivva) |
| Core Width | 32-bit |
| 최대 클록 주파수 | 56 MHz |
| Program Memory Type | ROMless (external memory required) |
| A/D Channels | 32 |
| 데이터 버스 폭 | 32-bit |
| 패키지 | 388-PBGA (27x27 mm) |
| Package Height | 1.95 mm |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 범위 | -40C to +125C (Automotive Grade) |
| Processor Series | MPC500 / Qorivva |
| Terminal Form | Ball |
| Number of Terminals | 388 |
| Package Code / Shape | BGA / Square |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
MPC561MVR56 bga / square 핀 구성 가이드
MPC561MVR56(bga / square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC561MVR56.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC561MVR56 적합 용도: 6 애플리케이션s: Engine Management Unit (ECU), Transmission Control Module, Body Control Module, Chassis Electronics (ABS/ESC), Industrial Real-Time Control, Automotive Gateway / Network Node.
Engine Management Unit (ECU)
The MPC561MVR56's 32-bit PowerPC core at 56 MHz and 32 A/D channels suit it to engine management ECUs where multiple crank, cam, oxygen, and pressure sensors must be sampled each control loop. The ROMless architecture lets OEMs pair the MCU with automotive-qualified NOR flash sized to their calibration strategy. Deterministic interrupt latency from the Power Architecture supports the real-time fuel-injection and ignition-timing loops that engine management demands. Automotive-grade temperature rating (-40C to +125C) and the 388-PBGA's high I/O count accommodate the underhood wiring harness without derating.
추천
Transmission Control Module
Transmission control modules require deterministic real-time response for shift scheduling, torque management, and solenoid drive. The MPC561MVR56's PowerPC core delivers predictable interrupt latency, while the 32 A/D inputs accept multiple speed, pressure, and temperature sensor channels. The 388-PBGA package supports the large pin count needed for multi-speed transmission solenoids and CAN/LIN communication to the rest of the powertrain. ROMless boot lets OEMs encrypt calibration data in external flash for anti-tamper protection.
추천
Body Control Module
Body control modules aggregate lighting, door, seat, mirror, and HVAC functions across many LIN/CAN nodes. The MPC561MVR56's 388 I/O balls accept the many PWM and digital outputs required for lighting drivers and actuator control, while the 56 MHz core executes body-network stacks comfortably. ROMless architecture lets the OEM load a single calibration across vehicle variants by switching external flash contents. The automotive -40C to +125C rating covers cabin and underhood mounting positions.
추천
Chassis Electronics (ABS/ESC)
ABS and electronic stability control loops run at sub-millisecond cadence with strict determinism. The MPC561MVR56's PowerPC core and fast interrupt response meet this requirement, while its 32 A/D inputs handle wheel-speed, steering-angle, yaw-rate, and pressure sensors. The 388-PBGA exposes enough I/O for the multiple PWM channels driving hydraulic modulators. ROMless boot supports OEM-specific safety libraries loaded from certified external flash.
추천
Industrial Real-Time Control
Outside automotive, the MPC561MVR56 suits industrial drives, robotics, and process control where deterministic response, abundant A/D channels, and the 388-BGA I/O are valued. The PowerPC core executes PID loops and fieldbus stacks at 56 MHz with low jitter. Industrial-grade PCB design and external memory selection allow the part to operate in factory automation environments. The wide -40C to +125C range covers most industrial cabinet and outdoor installations.
추천
Automotive Gateway / Network Node
CAN, LIN, and FlexRay gateway nodes benefit from the MPC561MVR56's rich peripheral set and 388-BGA I/O for multiple bus interfaces. The PowerPC core runs AUTOSAR stacks and network management at 56 MHz with predictable latency. ROMless boot lets OEMs secure gateway firmware in tamper-resistant external flash. The automotive temperature range and NXP's long-term silicon support make it a fit for production gateway ECUs that must operate for 15+ years in the field.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC561MVR56 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC563MVR56 | MPC565MVR56 | MPC561MVR56R2 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27 mm) | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same |
| Core Architecture | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) + FPU | PowerPC MPC5xx (32-bit) |
| Maximum Clock Frequency | 56 MHz | 56 MHz | 56 MHz | 56 MHz |
| Program Memory | ROMless (external) | Integrated flash | 1 MB integrated flash | ROMless (external) |
| A/D Channels | 32 | 32 | 32 | 32 |
| FPU | No | No | Yes | No |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
주요 차별점
- ROMless architecture for maximum firmware flexibility (vs MPC565MVR56)
- Lower BOM cost for memory-scalable programs (vs MPC563MVR56)
- Same-family silicon with predictable toolchain (vs Cross-brand automotive MCU)
설계 노트
The 388-ball PBGA at 27x27 mm requires a 4+ layer PCB with matched-length routing for the external memory bus. Use 0.8 mm or 1.0 mm pitch escape routing and follow NXP's recommended BGA land pattern. Power planes should be placed adjacent to the ground plane to supply the transient current demands of the core without IR drop.
Because the MPC561MVR56 is ROMless, code cannot execute from internal memory on reset. Designers must boot from a pre-configured external flash device selected via reset configuration pins - omitting these pull resistors or mis-wiring the boot mode is a common bring-up failure. Validate the boot mode against the external memory datasheet before first power-up.
At 56 MHz the MPC561MVR56 dissipates meaningful power through the BGA balls; the 1.95 mm seated height limits the thermal path to PCB copper. Place thermal vias in the BGA land pattern and connect the inner power/ground planes directly under the package. For continuous -40C to +125C operation, derate clock frequency if junction temperature approaches the silicon limit.
규정 준수 정보
RoHS, REACH, and conflict-minerals status were not explicitly listed in the verified distributor data and should be confirmed with NXP or the distributor of record. AEC-Q100 grade not specified in the verified web data.
