MPC755BRX350TE - 350MHz PowerPC 32-Bit MPU | NXP
부품 번호: MPC755BRX350TE ✗ 단종MPC755BRX350TE 개요
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions from external memory. Within the system hierarchy, the MPC755BRX350TE sits as an embedded-class PowerPC MPU -> RISC microprocessor -> CPU -> semiconductor device, commonly used in networking, telecom, industrial control, and aerospace designs where the PowerPC ISA and long-life-cycle parts are mandated. The device is specified at 2 V core supply and supports a 350 MHz internal clock, delivering roughly 700 MIPS of integer throughput in typical workloads.
Key features of the MPC755BRX350TE include the 32-bit PowerPC architecture, 1-core single-issue/superscalar pipeline, FCCBGA-360 (25x25 mm) package for high-density board mounting, and BGA (bottom-terminated) interconnection suitable for high-speed signal integrity. The part uses a tray packaging format per NXP's cataloging convention, and historical catalog data indicates it is a reduced-instruction-set variant of the PowerPC line originally introduced by the AIM alliance.
Architecturally, the MPC755BRX350TE shares its silicon and reference documentation with the MPC745 family (the part datasheet applies to both unless noted). It implements the PowerPC instruction set and integrates on-chip L1 caches plus memory-management hardware, allowing it to be paired with external SDRAM and a system controller chipset. The wide external bus interfaces cleanly to industry-standard PowerPC companion chips such as the MPC107/MPC8240-class northbridges.
Typical applications include high-end networking line cards, telecom switching fabrics, industrial automation controllers, military/aerospace embedded subsystems, and legacy upgrade replacements for MPC745/MPC750-based designs. The 360-CBGA footprint supports multilayer PCB stackups with controlled-impedance routing for the processor bus.
When designing with the MPC755BRX350TE, ensure the motherboard footprint matches the 360-ball 25x25 mm CBGA pattern and that the 2 V core rail is supplied by a compatible VRM. Because this is an EOL/orphan part on modern distributor stock, designers should verify long-term availability or evaluate MPC83xx/MPC86xx successors from NXP for new designs.
This page synthesizes distributor pricing, lifecycle signals, drop-in compatible MPC7xx alternatives, and practical design notes that complement, rather than duplicate, the manufacturer datasheet.
드롭인 대체품: MPC755BRX350TE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MPC755BRX400TE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC755BRX300TE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC755BRX466TE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC745BVRX350PE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC755BRX350TE 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | MPC7xx |
| Core Processor | PowerPC |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Clock Speed | 350 MHz |
| Core Voltage | 2 V |
| Co-Processors / DSP | None |
| RAM Controllers | External (SDRAM via chipset) |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| 패키지 / 케이스 | 360-BCBGA, FCCBGA (25x25 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 상태 | Non-Compliant (historical) |
MPC755BRX350TE 360-bcbga, fccbga (25x25 mm) 핀 구성 가이드
MPC755BRX350TE(360-bcbga, fccbga (25x25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC755BRX350TE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC755BRX350TE 적합 용도: 6 애플리케이션s: Telecom Switching Fabric Controller, Industrial Automation PLC Backplane, Military / Aerospace Embedded Computer, Networking Line Card Processor, Legacy SBC Replacement / Longevity Supply, High-Reliability Storage Controller.
Telecom Switching Fabric Controller
The MPC755BRX350TE's 350 MHz PowerPC core and 32-bit bus make it a strong fit for telecom switching fabric controller cards where deterministic instruction throughput and PowerPC ISA binary compatibility are required. Paired with the MPC107 northbridge and SDRAM, it executes switching-plane control code and per-port state machines at wire rate. The 360-FCCBGA (25x25 mm) package supports multilayer PCBs with controlled-impedance routing needed for the external processor bus, while the 2 V core rail keeps power dissipation modest in densely populated line cards. The 32-bit address space is sufficient for legacy telecom control software, and the device is supported by long-life NXP/Rochester channel programs that keep telecom infrastructure deployments in service.
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Industrial Automation PLC Backplane
In industrial PLC and motion-controller backplane slots, the MPC755BRX350TE supplies 32-bit PowerPC execution of ladder-logic runtimes and deterministic scan loops. The device's external SDRAM interface (via a chipset) accommodates large process-image memories, while the 360-CBGA footprint anchors a vibration-resistant surface mount that suits factory-floor environments. Designers benefit from the PowerPC ISA's long track record in industrial control and from Rochester Electronics' sustained channel for legacy NXP silicon. At 350 MHz the part handles real-time Ethernet stacks and IEC 61131-3 runtime interpretation without breaking scan budgets, and the 2 V core voltage simplifies VRM design on the backplane.
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Military / Aerospace Embedded Computer
Defense and aerospace subsystems that require long-life-cycle, deterministic computing have used the MPC755BRX350TE and the close MPC745/MPC750 family on SBC (single-board computer) designs for decades. The 350 MHz PowerPC core supports legacy avionics, vehicle electronics, and ruggedized controller codebases, while the 360-BCBGA package withstands the thermal cycling and vibration profiles of MIL-STD-810 testing. The PowerPC architecture is approved for many legacy DO-178/254 and MIL-spec programs, easing the path to recertification when parts are sourced from traceable Rochester Electronics inventory. At 2 V core the device's power profile fits the constrained thermal envelopes of sealed conduction-cooled enclosures.
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Networking Line Card Processor
Network line cards for routers and switches leverage the MPC755BRX350TE as a control-plane and packet-classification processor, where its 32-bit PowerPC core runs routing daemons, ACL evaluation, and QoS scheduling. The 360-CBGA package routes cleanly into high-density line-card layouts with matched-length bus traces to TCAM and lookup ASICs. With 350 MHz of compute the part can service ACL lookups at line-rate for typical 1G/10G port densities when paired with a fast TCAM. Legacy PowerPC software stacks (VxWorks, Linux) port natively to the part, accelerating time-to-market for derivative line-card designs.
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Legacy SBC Replacement / Longevity Supply
Existing single-board computer designs based on the MPC745/MPC750/MPC755 PowerPC footprint can be re-populated with the MPC755BRX350TE as a like-for-like replacement or a speed upgrade (when the board supports 350 MHz operation). The 360-FCCBGA footprint is identical across the family, so board rework is unnecessary, and the PowerPC ISA ensures that legacy firmware and OS images boot unchanged. Rochester Electronics is a primary authorized channel for longevity-of-supply on this part family, and XAIPART consolidates inventory and cross-reference data to simplify sourcing for sustaining-engineering programs.
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High-Reliability Storage Controller
RAID and storage controller cards from the early-2000s PowerPC era use the MPC755BRX350TE to drive SCSI/Fibre Channel sequencers and metadata engines. The 32-bit PowerPC core and external SDRAM interface deliver the deterministic IO service required by storage stacks, while the FCCBGA-360 (25x25 mm) package supports the thermally constrained controller-card form factors. With 350 MHz compute, the part executes RAID parity calculations and command-queuing tasks within the latency budgets of legacy enterprise arrays, and Rochester-supported inventory enables long-term maintenance of installed-base storage systems.
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추천 제품 요약
엔지니어링 참조 데이터: MPC755BRX350TE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC755BRX400TE | MPC755BRX300TE | MPC755BRX466TE | MPC745BVRX350PE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-BCBGA, FCCBGA (25x25 mm) | 360-BCBGA, FCCBGA (25x25 mm) - same | 360-BCBGA, FCCBGA (25x25 mm) - same | 360-BCBGA, FCCBGA (25x25 mm) - same | 360-BCBGA, FCCBGA (25x25 mm) - same |
| Clock Speed | 350 MHz | 400 MHz | 300 MHz | 466 MHz | 350 MHz |
| Core Processor | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC |
| Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Number of Cores | 1 | 1 | 1 | 1 | 1 |
| Core Voltage | 2 V | 2 V | 2 V | 2 V | 2 V |
| Lifecycle Status | Obsolete | Obsolete (Rochester supported) | Obsolete (Rochester supported) | Obsolete (Rochester supported) | Obsolete (Rochester supported) |
주요 차별점
- Higher clock speed available within the same footprint (vs MPC755BRX400TE)
- Lower-speed grade for power-constrained designs (vs MPC755BRX300TE)
- MPC745 die variant at same speed/pinout (vs MPC745BVRX350PE)
설계 노트
Estimated: the 360-FCCBGA (25x25 mm) ball pitch of 1.27 mm typical for this package family requires a 4+ layer PCB stackup with matched-impedance routing for the 32-bit processor bus. Use NXP's reference ball-map and follow the application note for via-in-pad microvia design to maintain signal integrity to the external SDRAM and chipset companion (e.g., MPC107).
Estimated: the 2 V core rail must be supplied by a low-ripple VRM with bulk capacitance near the BGA balls to handle the load transient of the on-chip caches. Add a 2 V bulk cap within 25 mm of the BGA and a 10 uF ceramic decoupling network on each VDD ball pair; sequence the 2 V core rail after the 3.3 V I/O rail during power-up to avoid latch-up.
Estimated: at 350 MHz with the 2 V core rail, the MPC755BRX350TE dissipates roughly 5-7 W depending on workload, requiring either forced-air cooling or a heatsink on the BGA top side. Use NXP's junction-to-ambient thermal model for FCCBGA to size the heatsink, and verify junction temperature stays below 105 C in the target enclosure airflow profile.
Because the MPC755BRX350TE is obsolete and contains lead, do NOT specify it for new RoHS-compliant designs - pick an AEC/system-bill RoHS-clean part. For existing systems, source only from authorized channels (Rochester Electronics, authorized distributors) to avoid counterfeit risk; verify date code and traceability documentation before placing production orders.
규정 준수 정보
Per distributor catalog data: Lead Free Status = Contains Lead, RoHS Status non-compliant in original release. REACH, halogen-free, and conflict-minerals status not stated in the verified data; AEC-Q100 not applicable for this component class.
