MPC8248ZQMIBA - PowerQUICC II 266MHz MPU | NXP 516-PBGA
부품 번호: MPC8248ZQMIBA ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.9 | $429.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $30.2 | $15,100.00 |
| 1,000 | $25.85 | $25,850.00 |
MPC8248ZQMIBA 개요
An MPU (Microprocessor Unit) is a processor IC that contains a full CPU core plus on-die peripherals, MMU/FPU support, and memory controllers. The MPC8248 belongs to the broader hierarchy: MPU -> microprocessor -> processor -> integrated circuit -> semiconductor. PowerQUICC II parts were purpose-built for routers, DSLAM line cards, and industrial control, combining general-purpose PowerPC processing with on-chip communications engines.
Key features include a 266 MHz maximum CPU clock, 32-bit data bus, dual I2C and dual UART interfaces, DMA, timers, memory controller, and PCI bridge. The part supports 3.3V I/O operation and offers industrial temperature grade capability. Per NXP, the device integrates a 603e core with hardware MMU and a high-bandwidth internal bus for system memory and peripheral traffic.
The architecture pairs the 603e core with a CPM (Communications Processor Module) that offloads serial protocols from the CPU, making the part effective for routing/bridging, IDE/ATA, Fast Ethernet MACs, and HDLC/PPP termination. The 516-PBGA footprint and 0.13 µm process deliver a balanced cost/performance point for high-integration embedded designs.
Typical applications include wired communications line cards, enterprise router/switch control planes, IDE/storage controllers, and industrial automation. The integrated CPM reduces external glue logic and BOM cost in multi-protocol systems.
When designing, plan PCB layout for the 1.27 mm-pitch BGA with matched-length high-speed traces, respect power-up sequencing of the 3.3V rails, and follow NXP application notes for the on-chip DDR/SDRAM controller. Per NXP, this part is approaching end-of-life, so consider NXP's recommended replacements for new designs.
드롭인 대체품: MPC8248ZQMIBA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8248ZQMIBA (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Data Bus Width, Operating Temperature, Process Technology, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8248VRMIBA
✅ 드롭인✓ 재고 있음
$49.95 / 개
데이터시트 보기 →MPC8247CZQMIBA
✅ 드롭인✓ 재고 있음
$21.45 / 개
데이터시트 보기 →MPC8270CZQMIBA
✅ 드롭인✓ 재고 있음
$52.85 / 개
데이터시트 보기 →MPC8248ZQMIBA 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Processor Series | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2_LE (603e-class) |
| 데이터 버스 폭 | 32 bit |
| 최대 클록 주파수 | 266 MHz |
| Number of Cores | 1 |
| Process Technology | 0.13 µm (HiP7) CMOS |
| 공급 전압 | 3.3 V |
| Package Type | 516-PBGA (TEBGA) |
| Package Dimensions | 27 x 27 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | No (non-RoHS legacy product) |
| On-chip Features | Memory controller, PCI bridge, DMA, dual I2C, dual UART, timers, CPM communications module |
| Instruction Set | Power Architecture 32-bit |
MPC8248ZQMIBA 27 x 27 mm 핀 구성 가이드
MPC8248ZQMIBA(27 x 27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8248ZQMIBA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8248ZQMIBA 적합 용도: 6 애플리케이션s: Enterprise Router and Switch Control Plane, DSLAM Line Card Processor, Industrial Automation Controller, IDE / Storage Controller, Embedded Communications Appliance, Embedded Data Acquisition Backplane.
Enterprise Router and Switch Control Plane
The MPC8248ZQMIBA is well-suited to control-plane processing in enterprise routers and access switches because its integrated CPM offloads HDLC, PPP, ATM, and Ethernet MAC tasks from the 603e core, freeing CPU cycles for routing-table maintenance. The 266 MHz core, 32-bit Power Architecture, and on-chip PCI bridge let designers attach upstream network processors or switch fabrics directly without an external bridge. Per NXP PowerQUICC II documentation, this combination delivers deterministic protocol throughput while keeping BOM cost low. Place BGA bypass within 5 mm of each supply ball and observe 50 Ω controlled impedance on the address and data buses to the SDRAM interface.
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DSLAM Line Card Processor
In DSLAM line cards, the MPC8248ZQMIBA combines an integrated 603e core, memory controller, DMA engine, and CPM to aggregate multiple DSL channels with low latency and high reliability. The 32-bit core executes per-line ATM and PPP stacks, while the CPM handles the time-critical layer-1 framing. NXP's reference designs leverage the integrated PCI bridge to connect to line-interface cards. Because the part is built on a 0.13 µm HiP7 process, power dissipation stays manageable in dense line-card slots; use NXP's thermal design guide to size copper pours for the 27×27 BGA footprint.
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Industrial Automation Controller
The MPC8248ZQMIBA supports industrial automation by combining a real-time capable 603e core with on-chip UART, I2C, DMA, and timer peripherals, eliminating extra bridge chips in PLC and motor-controller designs. The integrated memory controller simplifies SDRAM/DDR attachment for deterministic data logging, while the PCI bridge links to FPGA co-processors. The BGA package supports vibration-prone industrial environments better than leaded packages when board-attach is correctly done. Engineers should review the NXP errata documents and apply recommended reset sequencing during boot to ensure stable operation in factory-floor EMC conditions.
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IDE / Storage Controller
The integrated DMA engine, PCI bridge, and CPM channels of the MPC8248ZQMIBA make it a strong fit for IDE / ATA / SATA controller cards in storage appliances. The 266 MHz 603e core executes filesystem and RAID logic while the CPM moves data between storage interfaces and host memory. Per NXP PowerQUICC II reference designs, the part's 32-bit memory controller pairs with SDRAM for high-throughput DMA. Use matched-length PCI traces and follow NXP's layout checklist; ensure the BGA thermal pad has a continuous copper pour to keep the die within operating temperature.
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Embedded Communications Appliance
For serial-intensive appliances such as protocol converters and remote-access gateways, the MPC8248ZQMIBA's CPM delivers multiple SCCs and FCCs without external serial glue logic, reducing part count and BOM cost in embedded comms designs. The 32-bit core runs a standard Linux or VxWorks stack, while the CPM handles async and synchronous serial channels. Per NXP, the integrated memory controller and DMA paths allow wire-speed bridging between Ethernet and legacy serial ports. Plan for a 6-8 layer PCB with a flooded GND plane adjacent to the BGA to preserve signal integrity at 66 MHz PCI.
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Embedded Data Acquisition Backplane
The MPC8248ZQMIBA serves as a backplane manager in compactPCI/VME data-acquisition chassis, leveraging its 32-bit core, PCI bridge, and on-chip peripherals to aggregate multiple data streams from analog front ends. The integrated memory controller and DMA engine buffer high-rate sample streams to local SDRAM before forwarding via Ethernet. NXP's hardware manuals detail the bus arbiter setup required for stable multi-master operation. Because the part is approaching EOL, designers should evaluate NXP's QorIQ Layerscape recommendations; the MPC8248ZQMIBA is, however, a known-quantity for legacy mil/aero programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8248ZQMIBA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8248VRMIBA | MPC8247CZQMIBA | MPC8270CZQMIBA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same |
| Processor Family | PowerQUICC II (MPC8248) | PowerQUICC II (MPC8248) | PowerQUICC II (MPC8247) | PowerQUICC II (MPC8270) |
| Core Architecture | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) |
| Data Bus Width | 32 bit | 32 bit | 32 bit | 32 bit |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 |
| RoHS Status | Non-RoHS (legacy SnPb) | Non-RoHS (legacy) | Non-RoHS (legacy) | Non-RoHS (legacy) |
| Lifecycle Status | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL |
주요 차별점
- Integrated CPM offloads serial protocols from the 603e core (vs MPC8247CZQMIBA)
- Pin-compatible same-family upgrade path (vs MPC8270CZQMIBA)
- Established PowerQUICC II software ecosystem (vs MPC8248VRMIBA)
설계 노트
The 516-PBGA 27x27 mm BGA at 1.27 mm pitch demands a 6-8 layer PCB stack-up with matched 50 Ω controlled impedance on the address and data buses. Place all decoupling capacitors within 5 mm of their respective supply balls and use a flooded ground plane adjacent to the BGA to minimize return-path inductance. For boards exceeding 200 mm length, apply via-in-pad for the thermal balls to keep the die below the recommended operating range.
The MPC8248ZQMIBA requires carefully sequenced power rails during start-up. Per NXP hardware documentation, the core voltage must ramp before or simultaneously with the I/O voltage to prevent latch-up. Bulk decoupling of at least 22 µF tantalum plus 0.1 µF ceramic on every power pin is recommended. Reference the datasheet's power section before prototype builds, especially for systems that share supply rails with PCI devices.
MPC82xx pin-assignments are NOT interchangeable across the PowerQUICC II family. A design targeting MPC8248ZQMIBA cannot accept MPC8270 or MPC8280 firmware without verification, even when the BGA package is identical. Always cross-check the NXP PCN database and the relevant datasheet's ordering table before substituting, and keep a 'golden-board' validation step in the manufacturing test plan to catch miss-detected pin variants.
규정 준수 정보
Per DigiKey RoHS marking this part is non-RoHS (SnPb ball finish). AEC-Q100 not applicable for industrial/networking MPU. REACH, halogen, and conflict-minerals status not explicitly stated in the verified web data.
