MPC8306VMACDCA - PowerQUICC II Pro SoC 200MHz e300 | NXP
부품 번호: MPC8306VMACDCA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $19.26 | $19.26 |
| 10 | $17.34 | $173.40 |
| 100 | $15.41 | $1,541.00 |
| 500 | $13.49 | $6,745.00 |
| 1,000 | $11.56 | $11,560.00 |
MPC8306VMACDCA 개요
A PowerQUICC II Pro SoC is a system-on-chip that combines a PowerPC host processor with multiple specialized communications peripherals (Ethernet, HDLC, ATM, TDM, USB, CAN) on a single die, allowing one device to replace what would otherwise require a CPU plus separate PHY/controller ICs. The PowerQUICC II Pro family sits within NXP's Power Architecture portfolio, above simple 8/16-bit microcontrollers and below higher-end QorIQ multicore processors, serving the cost-sensitive edge of the communications infrastructure.
Key features of the MPC8306VMACDCA include the e300c3 32-bit core at 200 MHz, on-chip DDR1/DDR2 SDRAM controller with 16-bit data width, dual 10/100 Ethernet MACs (one RGMII + one MII/RMII), USB 2.0 Full-Speed host/device, two CAN 2.0 controllers, four HDLC/TDM channels, and a 32-bit PCI interface. Security is provided by a SEC 2.2 accelerator (AES, DES, 3DES, MD5/SHA-1) on the higher-tier MPC8306S variant.
The device uses a 32-bit PowerPC Book E instruction set with MMU and 16 KB instruction / 16 KB data L1 caches, while the integrated system interface unit (SIU) handles the 60x-compatible external bus plus PCMCIA/CompactFlash support. This balance of compute, memory bandwidth, and integrated peripherals makes it well suited for low-end routers, industrial controllers, and printed-circuit media gateways that need determinism without multicore complexity.
Typical applications include low-cost SOHO routers, integrated access devices (IAD), industrial Ethernet gateways, CAN-based building automation nodes, and serial-protocol protocol converters. The wide peripheral integration reduces external component count, and the 0 to 105C operating range suits outdoor enclosures and industrial cabinets.
When designing with the MPC8306VMACDCA, allocate sufficient PCB area to the 369-ball PBGA (19x19 mm, 1 mm pitch) - four to six layers with a continuous ground plane are recommended to keep DDR2 signal integrity intact. Decouple VDD_CORE and VDD_IO rails with 100 nF plus 10 µF ceramic capacitors placed as close to the balls as possible.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: MPC8306VMACDCA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8306VMACDCA (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Operating Temperature, Package, RoHS Status, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8306SVMACDCA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8306VMAGDCA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8306VMACFCA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8306SVMABDCA
✅ 드롭인✓ 재고 있음
$17 / 개
데이터시트 보기 →MPC8275CVRMIBA
✅ 드롭인✓ 재고 있음
$140.2 / 개
데이터시트 보기 →MPC8306VMACDCA 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e300c3 (32-bit) |
| Core Frequency | 200 MHz |
| Instruction Set | Power Architecture, Book E |
| L1 Cache | 16 KB instruction / 16 KB data |
| Memory Controller | DDR1/DDR2 SDRAM, 16-bit data |
| Ethernet | 2x 10/100 MAC (RGMII + MII/RMII) |
| USB | USB 2.0 Full-Speed host/device |
| CAN | 2x CAN 2.0 |
| HDLC/TDM | 4 channels |
| PCI | 32-bit PCI 2.2 |
| 패키지 | 369-PBGA (19x19 mm, 1.0 mm pitch) |
| 동작 온도 | 0 C to +105 C |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
MPC8306VMACDCA 369-pbga (19x19 mm, 1.0 mm pitch) 핀 구성 가이드
MPC8306VMACDCA(369-pbga (19x19 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8306VMACDCA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8306VMACDCA 적합 용도: 7 애플리케이션s: SOHO Router and Integrated Access Device, Industrial Ethernet Gateway and Protocol Converter, Building Automation and HVAC Controller, Wireless Backhaul and Small Cell Base Station, CAN-Based Automotive Telematics and Fleet Gateway, Print Server and Networked Imaging MFP Controller, Point-of-Sale and Embedded Payment Controller.
SOHO Router and Integrated Access Device
The MPC8306VMACDCA fits SOHO router designs because its dual 10/100 Ethernet MACs (one RGMII, one MII/RMII), USB 2.0 host port, and 200 MHz e300c3 core deliver enough compute for NAT, firewall, and packet forwarding at typical 50-100 Mbps WAN speeds. The on-chip DDR2 controller removes the need for an external memory bridge, and the PCI 2.2 bus lets designers add a Wi-Fi mini-PCI card. Unlike higher-end multicore QorIQ devices, the single-core 200 MHz MPC8306 keeps power dissipation at roughly 1 W typical, allowing fanless plastic enclosures. Place the device with short controlled-impedance traces to the RJ45 magnetics and use the NXP AN3667 layout guide for DDR2 trace length matching.
추천
Industrial Ethernet Gateway and Protocol Converter
For industrial protocol bridging, the MPC8306VMACDCA integrates CAN 2.0, HDLC/TDM, Ethernet, and USB, allowing a single chip to bridge between CANopen or Profibus-derived serial streams and TCP/IP Ethernet. The HDLC/TDM controller can drive 4 synchronous channels, useful for legacy serial-to-Ethernet protocol converters used in substation automation. With the 0-105 C operating range and the rugged 369-PBGA package, the MPC8306 fits DIN-rail-mounted industrial gateways. Designers can pair the SoC with a PHY like the NXP TJA1100 for automotive Ethernet PHY variants or use a standard copper Ethernet PHY for industrial-grade links.
추천
Building Automation and HVAC Controller
The MPC8306VMACDCA fits building automation hub designs thanks to its dual CAN 2.0 controllers for BACnet/IP and CAN-based HVAC sensor networks, plus USB host for Zigbee or sub-GHz wireless dongles. The 200 MHz e300c3 core handles scheduling logic for dozens of zones, and the 32-bit PCI bus supports an optional touchscreen controller. With 16 KB instruction and 16 KB data L1 caches, the device can run a small embedded Linux with BACnet stack under 20 MB of DDR2 memory, keeping the BOM below $30 in volume. Industrial 0-105 C operation accommodates mechanical room installations.
추천
Wireless Backhaul and Small Cell Base Station
For small-cell and wireless backhaul equipment, the MPC8306VMACDCA delivers four HDLC/TDM channels for E1/T1 framer interfacing, dual Ethernet MACs for backhaul uplink, and a PCI bus for an optional baseband accelerator card. The 200 MHz core provides sufficient MIPS for Layer 2/Layer 3 forwarding and lightweight IPSec when using the MPC8306S variant. The 32-bit DDR2 controller with 16-bit width supports up to 333 MHz DDR2, providing enough bandwidth for aggregated backhaul traffic up to 200 Mbps. NXP's Linux SDK for PowerQUICC II Pro includes reference drivers for HDLC, TDM, and the Ethernet FEC block, accelerating firmware development.
추천
CAN-Based Automotive Telematics and Fleet Gateway
In non-safety-critical telematics, the MPC8306VMACDCA's dual CAN 2.0 controllers can read vehicle OBD-II diagnostics while the Ethernet MAC provides a backhaul link to a fleet management server. The USB host port supports a GPS receiver or cellular modem dongle, and the 0-105 C operating range covers most in-cabin and trunk-mounted enclosures. Note: this part is NOT AEC-Q100 qualified; for safety-critical ADAS or ECU functions, designers should select an AEC-Q100-qualified automotive MCU instead. The MPC8306 serves the telematics black-box and fleet management layer where automotive certification is not required.
추천
Print Server and Networked Imaging MFP Controller
The MPC8306VMACDCA can act as the main controller in a networked multifunction printer, with USB 2.0 host for scanner/print engine interfacing, Ethernet for network connection, and PCI for the image-processing engine add-in card. The 200 MHz e300c3 core and DDR2 controller handle 600 dpi raster image data at speeds compatible with small-office MFPs. Unlike general-purpose microcontrollers, the integrated HDLC/TDM and PCI bus give designers a single chip that drives both the network and the imaging pipeline, reducing bill of materials. The same package is shared across the MPC8306 family for cost-down flexibility.
추천
Point-of-Sale and Embedded Payment Controller
For payment terminals and POS systems, the MPC8306VMACDCA integrates Ethernet for IP-based payment processing, USB for peripherals (NFC dongles, receipt printers), and CAN for legacy cash-drawer interfacing. The MPC8306S variant adds SEC 2.0 hardware encryption for PCI-PTS compliant secure PIN handling. The 369-PBGA package allows compact board designs under 50 mm x 50 mm. Industrial 0-105 C operation covers retail back-office installations. Note: for PCI-PTS certified payment systems, the SEC 2.0 block must be evaluated against the latest PCI hardware requirements - consult NXP's secure payment documentation before designing in.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8306VMACDCA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8306SVMACDCA | MPC8306VMAGDCA | MPC8306VMACFCA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 369-PBGA (19x19 mm) | 369-PBGA (19x19 mm) | 369-PBGA (19x19 mm) | 369-PBGA (19x19 mm) |
| Core | e300c3 200 MHz | e300c3 200 MHz | e300c3 200 MHz | e300c3 200 MHz |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +125 C | 0 C to +105 C (alt grade) |
| SEC 2.0 Hardware Crypto | No | Yes (AES/DES/SHA) | No | No |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| DDR2 Controller | Yes (16-bit) | Yes (16-bit) | Yes (16-bit) | Yes (16-bit) |
| HDLC/TDM Channels | 4 | 4 | 4 | 4 |
주요 차별점
- Wide peripheral integration in single die (vs MPC8349E)
- Drop-in upgrade path to SEC 2.0 crypto (vs MPC8306SVMACDCA)
- Industrial-extended 0 to 105 C operating range (vs MPC8306VMAGDCA)
- DDR2 controller with 16-bit interface (vs MPC8308)
- Cost-effective PowerQUICC II Pro entry (vs MPC857)
설계 노트
Estimated: at typical 1.0 W core power dissipation with 0-105 C operation, the 369-PBGA junction-to-ambient thermal resistance is around 18 C/W on a 4-layer 1oz copper PCB. Designers should provide a thermal via array under the center BGA balls and consider 2 oz copper on inner layers for designs targeting the upper 105 C limit. Adequate airflow (1 m/s minimum) is recommended for fanless sealed enclosures.
Follow NXP application note AN3667 for DDR2 layout - match trace lengths within 50 mils (1.27 mm) for the DDR2 byte lane, place VTT termination resistors within 200 mils of the memory, and route address/command on inner layers with reference to a solid ground plane. Use 100 nF plus 10 µF ceramic decoupling on each VDD_CORE and VDD_IO ball, placed as close as possible. Four to six PCB layers with continuous ground are required for reliable DDR2 operation above 133 MHz.
Keep Ethernet MDI traces 50 ohm differential controlled impedance with 100 ohm differential pair spacing, and place the RJ45 magnetics within 25 mm of the PHY pins. For USB 2.0, route D+/D- as 90 ohm differential with no stubs. The PCI bus signals should be length-matched to within 500 mils across all 32-bit data lanes to avoid setup/hold violations at 66 MHz.
Do not confuse the MPC8306 (no SEC crypto) with the MPC8306S (with SEC 2.2 crypto) when ordering - the S suffix is mandatory for IPsec/TLS hardware acceleration. Verify the BGA balls are inspected for voiding on a 0.15 mm pitch; X-ray inspection is recommended for prototypes. Ensure the JTAG TCK frequency does not exceed 25 MHz to maintain boundary scan reliability.
Estimated: the e300c3 200 MHz core generates a 200 MHz fundamental clock with significant 3rd and 5th harmonic content. Place a spread-spectrum clock generator upstream if EMC Class B is required. Use series termination resistors (33 ohm) on the DDR2 clock and address/command lines if the trace length exceeds 50 mm, and verify with signal integrity simulation before finalizing layout.
규정 준수 정보
RoHS compliant per NXP product page. Not AEC-Q100 qualified - do not use in automotive safety-critical applications. For automotive designs, select an AEC-Q100-qualified MCU such as NXP S32K or MPC57xx family.
