MPC8308CVMAGD - PowerQUICC II Pro 400MHz e300 MPU | NXP
부품 번호: MPC8308CVMAGD ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.75 | $3,175.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.9 | $25,900.00 |
MPC8308CVMAGD 개요
A PowerQUICC II Pro processor is a highly integrated system-on-chip (SoC) built around the Power Architecture (PowerPC/e300) CPU family, designed for communications, networking, and industrial control applications where deterministic behaviour, low power consumption, and rich connectivity matter more than raw GHz performance. The MPC8308CVMAGD extends the PowerQUICC lineage by adding a faster e300c3 core, more advanced peripheral interfaces, and lower power compared to earlier PowerQUICC II parts while keeping software compatibility with the broader PowerQUICC ecosystem.
Key features include a 32-bit e300c3 single-issue core with 8KB instruction and 8KB data caches, a 16-bit DDR2 memory controller, two 10/100/1000 Mbps Ethernet controllers (one RGMII, one SGMII), a USB 2.0 Full-Speed host/device controller, an integrated security engine, and a complete set of communications peripherals such as UART, SPI, I2C, and timers. The device integrates a QUICC Engine UCC supporting HDLC/TDM, SUART, BISYNC, and Transparent modes for legacy telecom interworking alongside a 16-bit local bus and PCI Express endpoint (x1).
Architecture-wise, the MPC8308CVMAGD is implemented in a 90nm CMOS process, delivering sub-1W typical power consumption at 400MHz with full peripheral operation, and a typical core supply (Vdd) of 1.0V plus I/O supply of 1.8V/2.5V/3.3V. The on-chip DDR2 controller supports up to 256MB of addressable memory, the integrated security engine performs DES/3DES/AES/SHA-1/MD5/RNG, and the QUICC Engine permits protocol-aware TDM/framer interfacing without burdening the CPU.
Typical applications include smart-grid home energy gateways, data concentrators, wireless LAN access points, wireless femto base stations, industrial control and factory automation nodes, and consumer printing products. In each, the combination of the e300c3 core with hardware encryption and deterministic TDM peripherals lets the BOM shrink to a single SoC plus memory and PHYs.
Design consideration: the 473-MAPBGA at 0.8mm pitch requires 4-layer PCB with microvia or laser-drilled stack-up; XAIPART recommends at least eight thermal vias under the exposed die-pad area, and to keep DDR2 trace lengths matched to within 25 mils and 90-ohm differential-impedance-controlled for RGMII/SGMII.
This page synthesizes distributor pricing, drop-in same-family alternatives (MPC8308CVMAGDA, MPC8308VMAGDA, MPC8308CVMAJD) and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: MPC8308CVMAGD — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8308CVMAGD (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, PCI Express, RoHS Status, Security Engine.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8308CVMAGDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8308VMAGDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8308CVMAJD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8308CVMAGD
✅ 드롭인✓ 재고 있음
$25.9 / 개
데이터시트 보기 →MPC8308CZAGD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8308CVMAGD 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e300c3 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 400 MHz |
| Operating Temperature (TJ) | -40C to +105C |
| Package Type | MAPBGA-473 (19x19 mm, 0.8mm pitch) |
| 핀 수 | 473 |
| Lead Free | Yes |
| 실장 유형 | Surface Mount |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (Vdd) | 1.0 V (typical) |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | 16-bit DDR2 (up to 256 MB addressable) |
| Ethernet Interfaces | 1x RGMII + 1x SGMII (10/100/1000 Mbps) |
| USB Controller | USB 2.0 Full-Speed Host/Device |
| PCI Express | 1x PCIe Endpoint |
| Security Engine | DES/3DES/AES/SHA-1/MD5/RNG |
| Lifecycle Stage | ACTIVE |
| RoHS 상태 | Compliant |
MPC8308CVMAGD mapbga-473 (19x19 mm, 0.8mm pitch) 핀 구성 가이드
MPC8308CVMAGD(mapbga-473 (19x19 mm, 0.8mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8308CVMAGD.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8308CVMAGD 적합 용도: 6 애플리케이션s: Smart-Grid Home Energy Gateway, Data Concentrator, Wireless LAN Access Point Controller, Wireless Femto Base Station, Industrial Control & Factory Automation, Consumer Printing Products.
Smart-Grid Home Energy Gateway
The MPC8308CVMAGD's on-die encryption engine (DES/3DES/AES/SHA-1/RNG), 400 MHz e300c3 core and dual gigabit Ethernet (RGMII + SGMII) make it a natural host for smart-grid home energy gateways that aggregate PLC/RF meter data and forward it to utility backhaul. The hardware crypto offloads TLS/DTLS handshakes for DLMS/COSEM traffic while keeping the QUICC Engine free for legacy HDLC/TDM meter polling. Typical power at 1.0 V core / 3.3 V I/O is sub-1 W, allowing fanless DIN-rail enclosures. Pair with DDR2-533 memory and a PHY such as the KSZ9021 for a compact, RoHS-compliant gateway design.
추천
Data Concentrator
Data concentrators in distribution automation aggregate multiple serial sensor/PMU channels and forward them upstream over Ethernet. The MPC8308CVMAGD's QUICC Engine implements HDLC, TDM and transparent protocols that map directly onto legacy SCADA trunks, while the e300c3 core runs the IEC 61850 / DNP3 stack. The integrated 16-bit DDR2 controller supporting up to 256 MB and the SGMII link simplify BOM by eliminating an external Gigabit MAC, and the -40C to +105C junction range suits outdoor cabinets with convection cooling only.
추천
Wireless LAN Access Point Controller
Wireless access points use the MPC8308CVMAGD as the host CPU running the AP control-plane, captive portal, IPSec/VPN and management agent while a companion Wi-Fi SoC handles the 802.11 a/b/g/n PHY. The 400 MHz e300c3 core is more than fast enough for routing and IPSec at small-office throughput, and the integrated USB 2.0 Full-Speed controller allows printer/3G-dongle sharing. The MAPBGA-473 keeps the footprint compact enough for desktop/ceiling-mount AP enclosures.
추천
Wireless Femto Base Station
Femto base stations need a deterministic host processor for protocol conversion between the small-cell modem and the IP backhaul. The MPC8308CVMAGD's QUICC Engine TDM mode interfaces directly with the femto modem, while the SGMII Ethernet port connects to the residential gateway/DSL uplink. Hardware encryption secures Iuh/Iuh-over-IP traffic and the part's low thermal envelope supports PoE-powered deployments without active cooling.
추천
Industrial Control & Factory Automation
In industrial control and factory automation, the MPC8308CVMAGD's GPIO-rich peripheral set (UART, SPI, I2C, timers, USB) plus the QUICC Engine for serial multi-drop protocols let a single SoC replace a legacy MCU plus peripherals. The -40 to +105 C thermal envelope suits panel and cabinet mounting, the integrated DDR2 controller removes the need for an external memory bridge, and the on-die encryption engine secures Modbus/TCP and PROFINET update traffic. RoHS compliance and lead-free MAPBGA-473 packaging simplify global product certifications.
추천
Consumer Printing Products
Network-attached printers and multifunction devices use the MPC8308CVMAGD as a scanning/rasterising controller plus Ethernet/IP host. The 400 MHz e300c3 is fast enough to RIP at Letter/A4 speeds, while the DDR2 controller feeds the band/buffer memory needed for 1200 dpi. The USB 2.0 Full-Speed host port accepts thumb-drives and the integrated JPEG acceleration available through the QUICC Engine keeps the scanning pipeline tight.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8308CVMAGD — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8308CVMAGDA | MPC8308VMAGDA | MPC8308CVMAJD | MPC8308CZAGD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-473 (19x19 mm) | MAPBGA-473 (19x19 mm) - same | MAPBGA-473 (19x19 mm) - same | MAPBGA-473 (19x19 mm) - same | MAPBGA-473 (19x19 mm) - same |
| Core | e300c3 (400 MHz, 32-bit) | e300c3 (400 MHz, 32-bit) | e300c3 (533 MHz capable, 32-bit) | e300c3 (400 MHz, 32-bit) | e300c3 (266 MHz, 32-bit) |
| Memory Controller | 16-bit DDR2 (up to 256 MB) | 16-bit DDR2 (up to 256 MB) | 16-bit DDR2 (up to 256 MB) | 16-bit DDR2 (up to 256 MB) | 16-bit DDR2 (up to 256 MB) |
| Ethernet | 1x RGMII + 1x SGMII | 1x RGMII + 1x SGMII | 1x RGMII + 1x SGMII | 1x RGMII + 1x SGMII | 1x RGMII + 1x SGMII |
| USB | USB 2.0 Full-Speed Host/Device | USB 2.0 Full-Speed Host/Device | USB 2.0 Full-Speed Host/Device | USB 2.0 Full-Speed Host/Device | USB 2.0 Full-Speed Host/Device |
| Security Engine | DES/3DES/AES/SHA-1/MD5/RNG | DES/3DES/AES/SHA-1/MD5/RNG | DES/3DES/AES/SHA-1/MD5/RNG | DES/3DES/AES/SHA-1/MD5/RNG | DES/3DES/AES/SHA-1/MD5/RNG |
| Speed Grade Identifier | C (400 MHz) | C (400 MHz) | V (533 MHz capable) | C (400 MHz), extended-temperature | Z (266 MHz) |
| Operating Temperature | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | Extended sorting (per datasheet) | -40C to +105C (TJ) |
주요 차별점
- Silicon-revision drop-in reduces sourcing risk (vs MPC8308CVMAGDA)
- Speed-grade headroom on the same footprint (vs MPC8308VMAGDA)
- Thermal headroom via speed downgrade (vs MPC8308CZAGD)
설계 노트
The 473-MAPBGA at 0.8 mm pitch requires a 4-layer PCB with HDI microvia or laser-drilled stack-up; standard 0.1 mm-drill vias will not reach the inner pads. Route DDR2 traces as a matched-length group within +/- 25 mils and keep RGMII/SGMII pairs at 100-ohm +/-10% differential impedance. Place at least eight thermal vias in the centre array directly under the exposed die pad and stitch down to the inner ground plane. Without the microvia + thermal via discipline you'll see intermittent DDR2 read failures and thermal hot-spots at 400 MHz ambient above 70 C.
The MPC8308CVMAGD requires three independent rails - 1.0 V core (Vdd), 1.8/2.5/3.3 V I/O (GVDD), and DDR2 reference (VTT/VDD2). Sequence Vdd before GVDD per the NXP hardware specification to avoid I/O latch-up; an LTC3773 or TPS54331 supervisory controller enforces this. Estimated: at 400 MHz full peripheral load the 1.0 V core draws ~700 mA, so design the Vdd DC-DC for at least 1 A continuous with 150 mV pk-pk ripple.
Two common mistakes: (1) bringing up the board without enforcing JTAG reset before code load - the QUICC Engine initialises with random UCC loopback modes and can lock up the RGMII PHY until a POR reset is applied; (2) using a 25 MHz rather than 33 MHz crystal when the boot RCW (Reset Configuration Word) expects 33 MHz - the CPU will boot at the wrong bus ratio and appear as an 'unknown' device on JTAG. Always match the RCW table in the NXP datasheet to your oscillator choice.
At full 400 MHz CPU load with all peripherals active the MPC8308CVMAGD dissipation is approximately 0.8-1.0 W, well within the 19x19 mm MAPBGA-473 thermal envelope (typical theta_JA ~25 C/W on a JEDEC 4-layer board). Estimated: junction temperature at 70 C ambient + 1.0 W x 25 C/W = 95 C, under the 105 C TJ limit. For sealed IP65 enclosures derate by 15-20% and consider lowering CPU frequency to the 'Z' (266 MHz) speed bin via the MPC8308CZAGD family member.
규정 준수 정보
MAPBGA-473 is lead-free / RoHS-compliant per the Verified Web Data. AEC-Q100 is not applicable for an industrial-grade networking MPU; NXP has separate 'automotive' suffixes if AEC-Q100 is mandatory (those use different speed IDs).
