MPC8313CZQAFFC - PowerQUICC II Pro 333MHz SoC MPU | NXP
부품 번호: MPC8313CZQAFFC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.34 | $38.34 |
| 10 | $35.5 | $355.00 |
| 100 | $32.1 | $3,210.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.4 | $25,400.00 |
MPC8313CZQAFFC 개요
An MPU (Microprocessor Unit) is a system-on-chip that integrates a CPU core, memory controller, and a rich peripheral set into a single package. PowerQUICC II Pro is part of NXP's PowerQUICC family — a hierarchy that spans communications processors -> SoC -> microprocessor -> integrated circuit. The MPC8313 specifically targets cost-sensitive networking and industrial designs that require GbE and USB without the cost of a full PowerQUICC III device.
Key features include the e300c3 32-bit Power Architecture core with MMU and FPU, hardware acceleration for common networking tasks, dual 10/100/1000 Ethernet MACs (one RGMII/RTBI + one SGMII capable), USB 2.0 high-speed host/device, 32-bit PCI 2.3 bus interface, DDR1/DDR2 SDRAM controller up to 266 MHz, and four DMA channels. Operating temperature range is -40C to +105C (industrial), making the part suitable for harsh-environment deployments.
Architecture depth: the MPC8313 integrates the e300c3 core with a 16 KB I-cache and 16 KB D-cache, plus a unified 256 KB internal SRAM block used by the QUICC Engine for protocol acceleration. The QUICC Engine technology offloads frame processing from the core, allowing line-rate Gigabit Ethernet forwarding with minimal CPU loading. The device uses a 1 V core supply with 1.5 V/1.8 V DDR memory I/O.
Typical applications include integrated services routers, industrial gateways, networked printers, VoIP/ATA adapters, and factory automation controllers. The combination of GbE, USB, and PCI bridges a wide variety of embedded networking scenarios.
Design consideration: the 516-ball TE-PBGA II package requires careful PCB layout with controlled-impedance traces for DDR memory and RGMII Ethernet. Designers should follow NXP's reference design guidance for power sequencing and thermal management — the device can dissipate 3-5 W under full load and benefits from thermal vias under the exposed die pad.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, enabling engineers to evaluate fit, supply risk, and second-source options for the MPC8313CZQAFFC.
드롭인 대체품: MPC8313CZQAFFC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8313CZQAFFC (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Memory Controller, Mounting Type, PCI, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8313ECVRAFFC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313VRAFFC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CZQAFF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CZQAFFC-NXP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CZQAFFC 최대 정격 & 전기적 특성
| Core Architecture | Power Architecture e300c3 |
| 데이터 버스 폭 | 32-Bit |
| Maximum Core Frequency | 333 MHz |
| Supply Voltage (Core) | 1 V |
| Package Type | TE-PBGA II, 27 x 27 mm, 2.25 mm height, 1 mm pitch |
| 핀 수 | 516 |
| RoHS 상태 | Lead-Free (per datasheet header) |
| Memory Controller | DDR1/DDR2 SDRAM |
| Ethernet | 10/100/1000 Mbps (RGMII/RTBI + SGMII) |
| USB | USB 2.0 |
| PCI | PCI 2.3, 32-bit |
| 동작 온도 | -40C to +105C |
| Revision | Rev 3 |
| Series | PowerQUICC II Pro |
| 실장 유형 | Surface Mount (BGA) |
MPC8313CZQAFFC te-pbga ii, 27 x 27 mm, 2.25 mm height, 1 mm pitch 핀 구성 가이드
MPC8313CZQAFFC(te-pbga ii, 27 x 27 mm, 2.25 mm height, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8313CZQAFFC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8313CZQAFFC 적합 용도: 6 애플리케이션s: Integrated Services Router, Industrial Ethernet Gateway, Networked Printer Controller, VoIP / ATA Adapter, Factory Automation Controller, Set-Top Box / Media Gateway.
Integrated Services Router
The MPC8313CZQAFFC fits integrated services router designs because it integrates dual Gigabit Ethernet MACs (one RGMII + one SGMII), a PCI 2.3 bus for WAN modules, USB 2.0 for storage or 3G/4G modems, and the QUICC Engine for hardware-accelerated packet classification. At 333 MHz, the e300c3 core plus QUICC Engine sustains line-rate forwarding on a GbE WAN/LAN pair while running an embedded Linux control plane for routing, NAT, and firewall services. The 333 MHz core frequency and DDR1/DDR2 controller up to 266 MHz provide sufficient memory bandwidth for QoS queuing and IPSec acceleration when paired with an external crypto engine. The 516-TEPBGA II package and 3-5 W typical dissipation suit fanless SOHO/SMB router enclosures with adequate copper area for thermal dissipation.
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Industrial Ethernet Gateway
The MPC8313CZQAFFC is well suited for industrial Ethernet gateways bridging Modbus TCP, PROFINET, EtherNet/IP, and serial fieldbuses to enterprise networks. Its -40C to +105C industrial temperature rating (per NXP datasheet) enables deployment in factory-floor cabinets and outdoor enclosures without additional thermal management. The QUICC Engine offloads industrial protocol encapsulation, freeing the e300c3 core to handle application-layer translation. PCI 2.3 and USB 2.0 provide flexibility for adding Wi-Fi, cellular, or proprietary radio modules; DDR1/DDR2 controller supports up to 1 GB of memory for protocol buffers. The 333 MHz clock rate and 16 KB I-cache / 16 KB D-cache provide deterministic interrupt response critical for industrial control loops. Use conformal coating and TVS protection on GbE lines for harsh-environment reliability.
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Networked Printer Controller
The MPC8313CZQAFFC supports networked printer controllers by integrating a 333 MHz e300c3 core (sufficient for image rendering pipelines), DDR1/DDR2 memory controller (for large image buffers), USB 2.0 (for direct host printing), and GbE (for office network connectivity). The PCI 2.3 bus connects to scanner modules or finisher controllers, and the QUICC Engine handles protocol parsing for IPP, LPD, and SMB print services. Compared to discrete CPU-plus-ASIC designs, the integrated SoC reduces BOM cost and PCB area. The industrial temperature range supports office and light-industrial environments, while the 27 x 27 mm 516-ball BGA is compatible with the form factor of mid-to-large printer controller boards. Firmware updates via USB or network are supported by the integrated boot ROM and flash controller.
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VoIP / ATA Adapter
The MPC8313CZQAFFC fits VoIP and ATA (Analog Telephone Adapter) products because it combines DSP-friendly processing with integrated GbE for WAN, USB 2.0 for expansion, and PCI 2.3 for codec/SLIC daughter cards. The QUICC Engine accelerates RTP packetization, jitter buffer management, and QoS tagging for voice traffic. The 333 MHz e300c3 handles SIP signaling and DHCP/NAT services while keeping BOM low. DDR1/DDR2 memory controller supports buffer for multiple concurrent voice channels. Industrial temperature grade (-40C to +105C) supports carrier-grade CPE deployments and outdoor enclosures. Power dissipation of 3-5 W fits fanless plastic enclosures typical of residential ATA products.
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Factory Automation Controller
The MPC8313CZQAFFC is suitable for factory automation controllers coordinating PLCs, HMIs, and motion controllers. Its e300c3 32-bit core with MMU runs embedded Linux or VxWorks for SCADA and MES connectivity, while the integrated GbE ports provide deterministic industrial Ethernet (PROFINET, EtherCAT gateway via software). PCI 2.3 and USB 2.0 connect to I/O modules, HMI touch panels, and barcode scanners. The -40C to +105C industrial temperature range handles unheated factory floors and outdoor control cabinets. The 27 x 27 mm 516-ball BGA and 3-5 W dissipation allow integration into DIN-rail mounted controllers with proper thermal design. Deterministic interrupt latency from the e300c3 architecture benefits real-time control loops.
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Set-Top Box / Media Gateway
The MPC8313CZQAFFC supports set-top box and media gateway designs by combining GbE, USB 2.0, PCI, and a 333 MHz core sufficient for media protocol handling. The QUICC Engine accelerates IPTV multicast routing and IGMP snooping, while the e300c3 runs middleware for DLNA, UPnP, and conditional access. DDR1/DDR2 memory controller supports decoder buffer requirements for SD/HD streams. PCI 2.3 connects to tuner modules and HDMI bridges; USB 2.0 supports external storage and Wi-Fi dongles. Power dissipation fits compact fanless set-top enclosures. The industrial temperature range supports indoor and outdoor cabinet designs, and the lead-free 516-TEPBGA II package satisfies consumer RoHS requirements per the NXP datasheet header.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8313CZQAFFC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8313ECVRAFFC | MPC8313VRAFFC | MPC8313CZQAFF | MPC8313CZQAFFC-NXP |
|---|---|---|---|---|---|
| Package | 516-TEPBGA II (27x27) | 516-TEPBGA II (27x27) | 516-TEPBGA II (27x27) | 516-TEPBGA II (27x27) | 516-TEPBGA II (27x27) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 333 MHz | 333 MHz | 333 MHz | 333 MHz | 333 MHz |
| Core Architecture | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| DDR Memory Support | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Gigabit Ethernet | Yes (RGMII + SGMII) | Yes (RGMII + SGMII) | Yes (RGMII + SGMII) | Yes (RGMII + SGMII) | Yes (RGMII + SGMII) |
| Security Engine | Standard | Enhanced | Standard | Standard | Standard |
| Silicon Revision | Rev 3 | Rev 3 | Rev 3 | Earlier | Rev 3 |
주요 차별점
- Rev 3 silicon with latest errata fixes (vs MPC8313CZQAFF)
- Enhanced security engine variant available (vs MPC8313ECVRAFFC)
- Industrial temperature grade (vs Commercial-grade PowerQUICC variants)
설계 노트
The 516-ball TE-PBGA II package with 1 mm pitch requires PCB design rules for via-in-pad, microvia stacking, and ENIG or OSP surface finish per IPC-7095. Designers should follow NXP's reference design for layer stackup: at minimum a 6-layer board with dedicated ground and power planes under the BGA. The DDR memory traces must be length-matched to within 25 mils and routed on inner stripline layers with 50 ohm controlled impedance. Use thermal via arrays under the exposed die pad to dissipate the 3-5 W typical power; without thermal vias, junction temperature can exceed the 105C limit in sealed enclosures.
Power sequencing is critical for the MPC8313CZQAFFC: the 1 V core supply must ramp before or simultaneously with the 1.5 V/1.8 V DDR I/O supply, with no more than 200 mV of difference during ramp. Use NXP's recommended sequencing circuit with a common power-good signal and individual voltage supervisors. The integrated POR (Power-On Reset) supervises the 1 V rail but external sequencing is recommended for the I/O rails. Bulk decoupling requires at least 22 uF ceramic and 470 uF electrolytic on each main rail, with 100 nF X7R bypass caps placed within 5 mm of every BGA power pin.
RGMII and SGMII traces require careful impedance control: RGMII needs 50 ohm single-ended traces with length matching of +/- 50 mils between the data group and clock; SGMII needs 100 ohm differential routing with length matching of +/- 5 mils. The QUICC Engine reference clock must be a clean 66 MHz or 100 MHz source with jitter below 50 ps RMS to maintain GbE line-rate performance. For EMI compliance, place a common-mode choke on each GbE line near the RJ45 connector and follow IEEE 802.3 isolation requirements with 1500 VAC transformer coupling.
Estimated: at full CPU load with GbE line-rate forwarding, the MPC8313CZQAFFC dissipates approximately 3-5 W depending on I/O activity. With a properly designed 6-layer PCB and thermal vias, theta_JA is approximately 15-20 C/W, resulting in a junction temperature rise of 45-100 C above ambient. In sealed industrial enclosures with 60 C ambient, junction temperature could approach the 105 C maximum. Add a small heatsink or thermal pad if the enclosure ambient exceeds 50 C, or derate CPU frequency for continuous full-load operation. A JTAG header should be accessible for thermal validation using the on-chip thermal diode.
Common pitfalls when designing with the MPC8313CZQAFFC include: (1) forgetting to configure the DDR controller impedance calibration via the Serial Presence Detect (SPD) EEPROM at boot — this causes intermittent memory errors; (2) routing USB 2.0 differential pairs with mismatched lengths, causing signal-integrity failures at high-speed; (3) omitting the e300c3 reset configuration word in the boot flash, which locks up the part on power-up; (4) using a 1.8 V DDR2 part without setting the DDR controller voltage mode correctly, resulting in data corruption. Reference NXP application note AN3444 for the complete boot configuration checklist.
규정 준수 정보
Lead-free per datasheet header (LEAD FREE designation in package code). RoHS compliant. AEC-Q100 automotive qualification not stated in provided data - verify with NXP for automotive applications. REACH and halogen-free status not provided in the verified web data - set to unknown.
