MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP
부품 번호: MPC8313ZQADDC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.4 | $21,400.00 |
MPC8313ZQADDC 개요
A PowerQUICC (pronounced "power-quick") processor is a family of Power Architecture-based communications SoCs originally developed by Motorola and Freescale (now NXP). Positioned between the higher-end PowerQUICC III MPC85xx and the lower-cost ColdFire families, MPC83xx parts target SOHO routers, wired/wireless gateways, industrial Ethernet switches, and print/image platforms where deterministic I/O and low system cost outweigh peak CPU throughput.
Key specifications include a 32-bit PowerPC e300c3 core with 16 KB I-cache and 16 KB D-cache, an integrated 10/100/1000 Mbps Ethernet MAC, USB 2.0 high-speed host/device, two PCI controllers (one 32-bit/66 MHz, one mini-PCI capable), a 32-bit DDR1/DDR2 memory controller up to 266 MHz, and a security engine for AES, DES, and 3DES. Operating voltages of 1.8 V, 2.5 V, and 3.3 V feed core, DDR, and I/O rails respectively, while the industrial temperature grade of 0 to 105 C supports extended thermal envelopes. The MPC8313ZQADDC is fabricated in a 0.09 µm CMOS process for an optimal power/performance balance.
Typical applications include SOHO routers, integrated access devices, IP set-top boxes, industrial automation controllers, and point-of-sale terminals. The combination of GbE, PCI, USB, and DDR2 in a single BGA package simplifies board layout compared to multi-chip implementations.
When designing with the MPC8313ZQADDC, allocate the largest PCB layers for the DDR2 routing group (matched length within 50 mils) and follow NXP's reference manual for SERDES termination to avoid GbE link-up failures. Verify JTAG/BDM probe placement early to keep debug access available after enclosure integration.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet.
드롭인 대체품: MPC8313ZQADDC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8313ZQADDC (동일 폼 팩터 및 풋프린트) — 차이점: Security Engine, Core Architecture, Memory Controller, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8313CZQADDC
✅ 드롭인✓ 재고 있음
$18.4 / 개
데이터시트 보기 →MPC8313ECZQADDC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313VRAGDC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$32.4 / 개
데이터시트 보기 →MPC8313EZQADDC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8313ZQADDB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$24.5 / 개
데이터시트 보기 →MPC8313VRADDC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8313ZQADDC 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors / Freescale |
| Series | MPC83xx PowerQUICC II Pro |
| Core Architecture | PowerPC e300c3 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Max Core Frequency | 267 MHz |
| Process Technology | 0.09 µm CMOS |
| Operating Voltage (Core) | 1.8 V |
| Operating Voltage (DDR I/O) | 2.5 V / 1.8 V |
| Operating Voltage (Standard I/O) | 3.3 V |
| 동작 온도 | 0 °C to +105 °C |
| Package Type | 516-TEPBGA (27x27 mm) |
| Ball Count | 516 |
| Integrated Memory Controller | DDR1/DDR2 up to 266 MHz |
| Integrated Ethernet | 10/100/1000 Mbps (3x eTSEC) |
| USB Interface | USB 2.0 High-Speed (Host/Device) |
| PCI Interface | PCI 32-bit/66 MHz + mini-PCI |
| Security Engine | AES / DES / 3DES |
| 실장 유형 | Surface Mount (BGA) |
MPC8313ZQADDC 516-tepbga (27x27 mm) 핀 구성 가이드
MPC8313ZQADDC(516-tepbga (27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8313ZQADDC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8313ZQADDC 적합 용도: 7 애플리케이션s: SOHO Router / Integrated Access Device, Industrial Ethernet Gateway, Network-Attached Storage (NAS) Controller, Point-of-Sale (POS) Terminal, Wireless LAN / Wi-Fi Access Point Controller, Industrial Printer / Multi-Function Peripheral, Set-Top Box / IPTV Edge Device.
SOHO Router / Integrated Access Device
The MPC8313ZQADDC's three integrated 10/100/1000 Ethernet MACs (eTSEC), combined with the PowerPC e300c3 core at up to 267 MHz, provide the throughput needed for SOHO routers and integrated access devices without external switch silicon. Place the device on a 4-layer PCB with a 32-bit DDR2 bus running up to 266 MHz as main memory, and route each eTSEC RGMII pair with matched lengths and a 100 ohm differential-to-ground termination scheme. Unlike an ASIC switch, the MPC8313ZQADDC adds software-defined routing flexibility (Linux 2.6/3.x, VxWorks) while still dissipating only a few watts at typical load.
추천
Industrial Ethernet Gateway
The MPC8313ZQADDC is well-suited to industrial Ethernet gateways because its dual PCI bus (32-bit/66 MHz plus mini-PCI) accepts fieldbus cards such as Profibus, CAN, or RS-485 bridges, while the three GbE MACs handle up- and downstream industrial networks. Operate within the 0 to 105 °C industrial temperature grade for factory cabinets without derating. The integrated security engine accelerates AES, DES, and 3DES for IPsec tunnels commonly required in OT networks, removing the need for a discrete crypto accelerator.
추천
Network-Attached Storage (NAS) Controller
For entry-level NAS appliances and SMB file servers, the MPC8313ZQADDC's combination of USB 2.0 high-speed host, dual PCI for SATA/PATA controller cards, and three GbE MACs for link aggregation or multi-NIC bonding is a strong fit. Pair with DDR2 memory up to 266 MHz for cache and use the DDR controller's ECC mode for data integrity. The PowerPC e300c3 core runs mainstream NAS software stacks (e.g., Linux-based NASLite, OpenMediaVault ports) with predictable interrupt latency, a key requirement for SMB/CIFS throughput.
추천
Point-of-Sale (POS) Terminal
POS terminals benefit from the MPC8313ZQADDC's USB 2.0 host for barcode scanners and receipt printers, plus its GbE MAC for IP-based payment terminals and dual PCI for legacy peripherals. Operating at 1.8 V core and 3.3 V I/O, the part draws modest power suitable for sealed retail enclosures without active cooling. Use the integrated security engine to accelerate DES/3DES PIN-block encryption required by legacy payment protocols, avoiding a separate crypto chip.
추천
Wireless LAN / Wi-Fi Access Point Controller
The MPC8313ZQADDC's mini-PCI slot is purpose-built for 802.11 a/b/g/n radio cards, while the three GbE MACs allow wired uplink, mesh backhaul, and dedicated management port in a single SoC. With DDR2 bandwidth up to 266 MHz, the device can sustain line-rate packet forwarding across all three Ethernet ports without CPU saturation. The 0 to 105 °C industrial temperature grade supports outdoor or ceiling-mounted AP enclosures with limited airflow.
추천
Industrial Printer / Multi-Function Peripheral
Multi-function printers and industrial label printers use the MPC8313ZQADDC's USB 2.0 device port for PC tethering, dual PCI for scanner/JPEG engine cards, and the DDR2 controller for large image buffers. The PowerPC e300c3 core handles real-time RIP rendering and motor control timing with deterministic interrupt response critical to print quality. Place a 6-layer PCB stack-up to maintain 50 ohm controlled impedance on PCI and DDR2 traces, which is mandatory for 266 MHz operation.
추천
Set-Top Box / IPTV Edge Device
IPTV edge devices and hybrid set-top boxes use the MPC8313ZQADDC's GbE MAC for IP-multicast video, USB 2.0 for external storage, and the PCI bus for MPEG-2/H.264 decoder cards. The PowerPC e300c3 core's deterministic interrupt latency avoids MPEG PES stream jitter that would otherwise cause visible artifacts. Connect DDR2 memory directly to the integrated controller at 266 MHz for sufficient bandwidth to drive SD and early HD streams.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8313ZQADDC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8313CZQADDC | MPC8313ECZQADDC | MPC8313VRAGDC | MPC8313EZQADDC | MPC8313ZQADDB |
|---|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Brand | NXP Semiconductors / Freescale | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Max Core Frequency | 267 MHz | 267 MHz | 267 MHz | 267 MHz | 267 MHz | 267 MHz |
| Integrated Ethernet MACs | 3x 10/100/1000 (eTSEC) | 3x 10/100/1000 (eTSEC) | 3x 10/100/1000 (eTSEC) | 3x 10/100/1000 (eTSEC) | 3x 10/100/1000 (eTSEC) | 3x 10/100/1000 (eTSEC) |
| Memory Controller | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz |
| PCI Interface | PCI 32-bit/66 MHz + mini-PCI | PCI 32-bit/66 MHz + mini-PCI | PCI 32-bit/66 MHz + mini-PCI | PCI 32-bit/66 MHz + mini-PCI | PCI 32-bit/66 MHz + mini-PCI | PCI 32-bit/66 MHz + mini-PCI |
| Security Engine | AES / DES / 3DES | AES / DES / 3DES | AES / DES / 3DES + enhanced | AES / DES / 3DES | AES / DES / 3DES | AES / DES / 3DES |
| Operating Temperature | 0 to 105 °C (industrial) | 0 to 105 °C (industrial) | 0 to 105 °C (industrial) | 0 to 105 °C (industrial) | 0 to 105 °C (industrial) | 0 to 105 °C (industrial) |
주요 차별점
- Triple GbE MAC with hardware acceleration (vs MPC8306VMADDCA)
- Hardware security engine integrated (vs MPC8313CZQADDC)
- Dual PCI bus plus mini-PCI slot (vs MPC8313VRAGDC)
설계 노트
Estimated: at 266 MHz DDR2 operation, each DDR2 byte lane must be length-matched within ±50 mils to its corresponding DQS strobe. Use a 6-layer PCB stack-up with continuous ground plane on layer 2 and power plane on layer 5. Place VTT termination resistors within 500 mils of the DDR2 VTT net and decouple each DDR2 device with a 100 nF X7R capacitor plus a 10 µF bulk tantalum. These guidelines reflect standard NXP DDR2 routing recommendations; specific trace-width targets depend on board stack-up impedance and must be re-validated against the chosen PCB fabricator.
Place the MPC8313ZQADDC at the centre of the top side of the PCB and route all high-speed signals (DDR2, eTSEC RGMII, PCI, USB 2.0 differential pairs) on the top and inner layers adjacent to a solid ground plane. The 516-TEPBGA's 1 mm ball pitch demands 4/4 mil line/space rules at the BGA break-out; use laser-drilled microvias or via-in-pad to fan out. Keep the 25 MHz system reference clock trace under 500 mils and surround it with ground guard vias to minimise jitter on the eTSEC SerDes.
Estimated: the MPC8313ZQADDC dissipates approximately 3-5 W at full utilisation depending on DDR2 clock and peripheral activity. The 516-TEPBGA package's θJA is roughly 18 C/W with a standard JEDEC 4-layer test board, producing a junction temperature rise of 54 to 90 °C above ambient. For sealed industrial enclosures without forced airflow, provide a copper pour of at least 25 cm² on the top layer connected to the central power/ground balls to maintain junction temperature below 105 °C. This estimate uses the typical-case datasheet dissipation; worst-case silicon power can be higher.
The three eTSEC Gigabit Ethernet MACs use RGMII at 125 MHz DDR. Apply the standard RGMII layout: 50 ohm single-ended impedance on TX/RX pairs, with RX_CLK centre-aligned to RXD[3:0] and TX_CLK centre-aligned to TXD[3:0]. Source-series termination of 22-33 ohms on the MPC8313ZQADDC side improves signal quality at the PHY. For SGMII variants of the same chip family, follow the SGMII reference clock routing rules from the NXP hardware design checklist.
Do not power the MPC8313ZQADDC before the 1.8 V core rail is stable; the POR sequence requires core voltage to ramp before the 2.5 V DDR I/O rail to avoid latch-up. JTAG/BDM header access must remain accessible after final enclosure assembly for production debug. When using the USB 2.0 high-speed port, place the 27 pF USB FS/LS reference capacitor within 5 mm of the USB_VDD pin to meet USB compliance. Finally, avoid routing PCI signals adjacent to DDR2 clocks because crosstalk can cause intermittent PCI bus errors.
규정 준수 정보
Compliance status not explicitly stated in the verified web data. MSL level also not provided. Designers should request the latest material declaration from NXP or the distributor before committing to lead-free reflow profiles.