MPC8323ZQADDC - 266MHz PowerQUICC II Pro MPU | NXP 516-PBGA
부품 번호: MPC8323ZQADDC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $21.2154 | $21.22 |
| 10 | $19.95 | $199.50 |
| 100 | $17.85 | $1,785.00 |
| 500 | $15.4 | $7,700.00 |
| 1,000 | $13.2 | $13,200.00 |
MPC8323ZQADDC 개요
An MPU (Microprocessor Unit) is a programmable processor that executes operating systems and application software, sitting at the top of the embedded system hierarchy: MPU -> microprocessor -> processor -> integrated circuit -> semiconductor. MPC8323 devices differ from MCUs in that they require external memory (DDR SDRAM, flash/NOR) and provide richer peripheral integration for telecom/datacom line cards.
Key features include a 32-bit PowerPC e300c2 core with MMU and unified L1 caches, a dedicated communications processor module (CPM) with multiple FCC, MCC, SCC, SMC and SPI serial controllers, dual 10/100/1000 Ethernet MACs (eTSECs), DDR1/DDR2 memory controller, PCI Express / PCI interface, and a 32-bit local bus. The 266 MHz core delivers approximately 0.5 DMIPS/MHz of integer performance.
Technically, the device integrates QUICC Engine technology for hardware-accelerated protocol termination (Ethernet, HDLC, ATM, UART), offloading the host core. It supports boot from NOR flash or I2C EEPROM, has JTAG boundary-scan for test, and operates across an extended industrial temperature range with typical core voltages around 1.2 V and I/O at 3.3 V.
Typical applications include low-end to mid-range routers, DSLAM line cards, industrial gateways, network-attached storage controllers, and wireless base-station control plane processors. The device is particularly attractive for legacy PowerQUICC designs migrating from MPC8272/MPC8280 families where software compatibility is preserved.
When designing with this MPU, allocate sufficient PCB area for the 27 x 27 mm PBGA; use at least 4-layer stack-up with continuous ground planes under the BGA. Decouple the core and DDR rails with low-ESR ceramic capacitors placed as close as possible to the BGA balls.
This page synthesizes distributor pricing, drop-in MPC83xx alternatives, and practical design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: MPC8323ZQADDC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8323ZQADDC (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, PCI Interface, Data Bus Width, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8323EZQADDC
✅ 드롭인✓ 재고 있음
$14.06 / 개
데이터시트 보기 →MPC8323EZQAGDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8321CZQADDC
✅ 드롭인✓ 재고 있음
$25.9 / 개
데이터시트 보기 →MPC8321EZQADDC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8347EZQAGDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8323ZQADDC 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e300c2 |
| Core Count | 1 |
| 데이터 버스 폭 | 32 bit |
| Maximum Core Frequency | 266 MHz |
| Instruction Set | PowerPC |
| Processor Series | MPC83xx (PowerQUICC II Pro) |
| Encryption Acceleration | No (no SEC engine - ZQADDC variant) |
| Communications Processor Module | QUICC Engine (CPM) with FCC/MCC/SCC/SMC/SPI |
| Ethernet MACs | Dual 10/100/1000 Mbps eTSEC |
| Memory Controller | DDR1/DDR2 SDRAM |
| PCI Interface | PCI / PCI Express (per part decoder) |
| 패키지 | 516-PBGA, 27 x 27 mm |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | No (per DigiChip data sheet) |
MPC8323ZQADDC 핀 구성
| 핀 A1 | VSS — Ground reference |
| 핀 B26 | MDATA[0] — DDR data bit 0 |
| 핀 AA14 | TSEC1_TXD[0] — Gigabit Ethernet 1 transmit data 0 |
| 핀 AB25 | PCI_AD[0] — PCI address/data bit 0 |
| 핀 AC26 | LB_AD[0] — Local bus address/data bit 0 |
| 핀 AE4 | JTAG_TDO — JTAG test data out |
| 핀 AE26 | GND — Ground |
일반적인 애플리케이션
MPC8323ZQADDC 적합 용도: 6 애플리케이션s: Multi-Protocol Router Control Plane, DSLAM Line Card Processor, Industrial Gateway Controller, Network-Attached Storage Controller, Wireless Base Station Control Plane, Legacy Telecom Line Interface Card.
Multi-Protocol Router Control Plane
The MPC8323ZQADDC's 266 MHz PowerPC e300c2 core plus QUICC Engine communications processor module makes it a strong fit for low-to-mid range router control-plane processors handling multi-protocol routing termination. The CPM offloads HDLC, PPP, Ethernet, and ATM channel termination from the host core, freeing the e300c2 to run routing protocols like OSPF, BGP, and RIP. With dual 10/100/1000 Ethernet MACs and a 32-bit local bus, the device can connect directly to line-card FPGAs and PHY transceivers without an external bridge ASIC. Reference designs from Freescale/NXP document typical router line-card schematics.
추천
DSLAM Line Card Processor
In DSLAM (Digital Subscriber Line Access Multiplexer) line cards, the MPC8323ZQADDC aggregates subscriber traffic and bridges it to the uplink. The MPC8323ZQADDC's QUICC Engine provides multi-channel HDLC framing for xDSL backhaul, while the dual Gigabit Ethernet MACs connect to the aggregation switch fabric. The 266 MHz e300c2 core delivers ample processing headroom for traffic classification and QoS tagging. The 516-PBGA package accommodates the chip in a compact line-card form factor typical of central-office racks.
추천
Industrial Gateway Controller
Industrial protocol gateways converting Modbus, Profibus, and Ethernet/IP benefit from the MPC8323ZQADDC's mix of serial controllers (SCC, SMC, SPI) and dual Ethernet MACs. The QUICC Engine handles time-sensitive protocol conversion without burdening the host CPU. Operating temperature support across industrial ranges and the robust 516-PBGA package suit factory-floor deployment where vibration and thermal stress are concerns. Reference designs in the NXP PowerQUICC II Pro product family target industrial Ethernet and substation automation.
추천
Network-Attached Storage Controller
Entry-level network-attached storage (NAS) controllers use the MPC8323ZQADDC as the main processor running embedded Linux with NFS, SMB, and iSCSI stacks. The DDR1/DDR2 controller supports up to several hundred megabytes of system memory for filesystem caching. The dual Gigabit Ethernet enables link aggregation or separated data/management networks. The local bus connects to SATA controllers and boot flash. The 266 MHz core and QUICC Engine acceleration provide responsive file-transfer performance for SOHO/SMB NAS products.
추천
Wireless Base Station Control Plane
In picocell and femtocell base stations, the MPC8323ZQADDC manages Layer 2 and Layer 3 control-plane functions while a dedicated baseband DSP handles RF processing. The QUICC Engine's multi-protocol serial channels interface with CPRI or OBSAI links to the radio head. The 266 MHz e300c2 core runs lightweight IP stacks and O&M software for small-cell deployments. The 516-PBGA package fits within typical small-cell mechanical envelopes requiring fanless thermal design.
추천
Legacy Telecom Line Interface Card
The MPC8323ZQADDC is widely used in legacy telecom line-interface cards replacing older MPC8272/MPC8280 designs while preserving software investment. The PowerPC instruction set and CPM register model are compatible with earlier PowerQUICC generations, easing migration. T1/E1 and T3/E3 framers connect via the QUICC Engine's serial channels, while the host core handles signaling and management. The 516-PBGA footprint matches existing line-card layouts, enabling drop-in upgrades with minor BOM changes.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8323ZQADDC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8323EZQADDC | MPC8323EZQAGDA | MPC8321CZQADDC | MPC8321EZQADDC | MPC8347EZQAGDA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Core | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c3 |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 266 MHz |
| Encryption Engine (SEC) | No | Yes (SEC engine present) | Yes | No | Yes | Yes |
| QUICC Engine Channels | Full CPM (FCC/MCC/SCC/SMC) | Full CPM | Full CPM | Reduced CPM (fewer FCC/MCC) | Reduced CPM | CPM (different feature mix) |
| Gigabit Ethernet MACs | 2 x eTSEC (10/100/1000) | 2 x eTSEC | 2 x eTSEC | 1 x eTSEC (reduced) | 1-2 x eTSEC | 2 x eTSEC |
| RoHS Status | No (ADDC variant) | No (ADDC variant) | Yes (lead-free GDA package) | No | No | Yes (lead-free) |
주요 차별점
- Lower cost than SEC-enabled variant in same family (vs MPC8323EZQADDC)
- More CPM channels than lower-cost MPC8321 family (vs MPC8321CZQADDC)
- Dual Gigabit Ethernet MACs in a single chip (vs MPC8313EVRADDC)
설계 노트
Estimated: The 516-PBGA at 27 x 27 mm with 1 mm pitch requires at least a 6-layer PCB stack-up to escape all signals on the top layer. Use microvia (laser-drilled) technology in the BGA fanout region and place a continuous ground plane in layer 2 to control return-path impedance for the high-speed DDR and eTSEC signals. BGA landing pads should be non-solder-mask-defined (NSMD) for improved solder-joint reliability under thermal cycling.
The MPC8323ZQADDC requires multiple supply rails: typically 1.2 V for the e300c2 core, 1.8 V or 2.5 V for DDR SDRAM (matching the chosen DDR1/DDR2 interface voltage), and 3.3 V for I/O and analog blocks. Per the NXP datasheet, bulk-decoupling the core rail with at least 22 uF of low-ESR ceramic capacitance is recommended, plus 100 nF ceramic caps within 5 mm of each power/ground ball pair. Power sequencing must observe the core-before-I/O requirement to avoid latch-up.
Estimated: The 516-PBGA thermal resistance (theta_JA) is approximately 15-20 C/W with a properly designed JEDEC JESD51 test board, allowing operation up to roughly 105 C ambient at moderate core activity. For fanless industrial designs with sustained 266 MHz operation, attach a small heatsink or use thermal vias under the exposed die pad to spread heat. Measure junction temperature via the on-chip thermal sensor in production for thermal-margin validation.
DDR memory traces to the MPC8323ZQADDC must be length-matched within 25 mils (data-byte group) and 50 mils (byte-to-byte) per JEDEC DDR design guidelines. Series termination resistors on the DDR address/control bus may be required depending on the SDRAM loading. Reference the NXP MPC8323E hardware specifications document section on DDR signal integrity for the recommended topology and termination scheme. Use IBIS models for pre-layout simulation.
Do not confuse the MPC8323ZQADDC (no SEC engine) with the MPC8323EZQADDC (with SEC engine); they share the same package but require different boot-load configuration to enable or disable SEC. Ensure the boot ROM correctly identifies the part variant via configuration pins sampled at PORESET. Also note the 'ADDC' suffix denotes a non-lead-free package - select the lead-free 'GDA' suffix variant for RoHS-compliant designs.
규정 준수 정보
Per DigiChip datasheet listing, the ADDC suffix variant is RoHS: No (contains lead). For RoHS-compliant designs, select the lead-free GDA suffix variant in the same MPC8323 family. AEC-Q100 not applicable for this communications MPU.
