MPC8347VVAJDB557 - PowerQUICC II Pro 533MHz Host Processor | NXP
부품 번호: MPC8347VVAJDB557 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $79 | $7,900.00 |
| 500 | $72 | $36,000.00 |
| 1,000 | $65 | $65,000.00 |
MPC8347VVAJDB557 개요
What is a PowerQUICC II Pro integrated host processor? PowerQUICC II Pro is NXP's (formerly Freescale) family of communications-focused system-on-chip processors built on the PowerPC e300 architecture. These SoCs integrate a CPU core with communications peripherals (Ethernet, PCI, USB, security engine) to reduce BOM count and board area in routers, switches, printers, and industrial gateways. They sit at the boundary between microcontrollers and high-end network processors, offering deterministic performance for protocol processing.
Key features include a 533 MHz maximum core frequency, integrated DDR1/DDR2 memory controller supporting up to 333 MHz operation, dual 10/100/1000 Ethernet MACs (one configurable as RGMII), USB 2.0 full/high-speed interface, and a 32-bit PCI 2.3 bus. The device also integrates a security engine supporting AES, DES, 3DES, SHA-1/MD5 hash, and an integrated UART, I2C, and SPI controller set. Operating temperature grade spans 0C to 105C.
The architecture combines a superscalar e300 core with a system interface unit (SIU) and communications processor module. Internal DMA controllers and dedicated peripheral channels enable wire-speed packet handling. The on-chip memory controller supports up to 1 GB of DDR2 SDRAM with ECC, addressing the requirements of large routing tables and network buffers. Hardware encryption offloads AES, 3DES, and IPsec processing for VPN termination.
Typical applications include industrial routers, network switches, secure VPN gateways, industrial control gateways, networked printers, and embedded communications controllers. The integrated crypto engine and dual GbE make it suitable for IPsec terminators and secure edge routers in industrial and enterprise environments.
When designing with MPC8347VVAJDB557, ensure proper thermal management because the 672-ball TBGA at 533 MHz can dissipate several watts under load. Use the NXP BSP and U-Boot for board bring-up; the device requires a specific DDR2 initialization sequence and SerDes configuration per Reference Manual.
This page synthesizes distributor pricing, drop-in alternatives, application recommendations, and practical design guidance not consolidated on any single manufacturer page or distributor listing.
드롭인 대체품: MPC8347VVAJDB557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8347VVAJDB557 (동일 폼 팩터 및 풋프린트) — 차이점: Manufacturer, Series, Mounting Type, Ethernet, Memory Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8347VVAJDB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$58.95 / 개
데이터시트 보기 →MPC8347VVAJD
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.2 / 개
데이터시트 보기 →MPC8347EVVAJDB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8343VVAJDB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8358VVAJD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8347VVAJDB557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro |
| Core Architecture | PowerPC e300 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 533 MHz |
| 패키지 | 672-TBGA (35x35 mm) |
| Memory Controller | DDR1/DDR2 up to 333 MHz |
| Ethernet | 10/100/1000 (1 Gbit/s MAC) |
| USB | USB 2.0 (Full/High-speed) |
| PCI | 32-bit PCI 2.3 |
| Security Engine | AES, 3DES, SHA-1/MD5 |
| 동작 온도 | 0C to +105C |
| Silicon Revision | Rev 2 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
MPC8347VVAJDB557 672-tbga (35x35 mm) 핀 구성 가이드
MPC8347VVAJDB557(672-tbga (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8347VVAJDB557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8347VVAJDB557 적합 용도: 6 애플리케이션s: Industrial Routers and Gateways, Networked Printers and MFPs, Secure VPN Gateway, Industrial Ethernet Switches, Embedded Data Acquisition Controllers, VoIP Media Gateways.
Industrial Routers and Gateways
The MPC8347VVAJDB557 suits industrial routers because it integrates a 533 MHz PowerPC e300 core with 1 Gigabit Ethernet MAC, dual 32-bit PCI 2.3, USB 2.0, DDR1/DDR2 controller, and a hardware security engine on a single chip. At 533 MHz, the CPU can sustain wire-speed packet processing for routing protocols (OSPF, BGP, RIP) while the integrated AES/3DES engine accelerates IPsec VPN termination for site-to-site tunnels. Placed as the main SoC with external PHY (RGMII) and DDR2 SDRAM, it eliminates an external crypto ASIC that would otherwise add $5-$15 BOM. Unlike an MCU-only solution, this part handles full protocol stacks without external packet processor.
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Networked Printers and MFPs
The MPC8347VVAJDB557 fits networked printer and multifunction peripheral designs because its PowerPC e300 core has ample headroom for printer firmware (PostScript, PCL, JPEG render), while the integrated Gigabit Ethernet MAC supports 1Gbps LAN connectivity for enterprise MFP deployments. The 32-bit PCI bus interfaces to scanner/imaging ASICs, and USB 2.0 connects to external storage or fax modules. Operating temperature 0C to 105C covers office and light industrial environments. DDR2 controller with ECC ensures reliable operation under continuous duty cycles of office printers.
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Secure VPN Gateway
The MPC8347VVAJDB557 is appropriate for secure VPN gateway applications because the integrated security engine accelerates AES-128/192/256, 3DES, and SHA-1/MD5 in hardware, offloading encryption from the main CPU. At 533 MHz wire-speed IPsec throughput achieves 200+ Mbps depending on algorithm and packet size. Dual PCI bus enables co-processing with additional crypto accelerators when higher throughput is required. The 672-TBGA integrates all functions into a single device, reducing PCB footprint compared to a discrete CPU + external crypto ASIC implementation typical of older VPN designs.
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Industrial Ethernet Switches
The MPC8347VVAJDB557 suits managed industrial Ethernet switch applications because the PowerPC e300 at 533 MHz has the throughput to run Layer 2/3 switching firmware (VLAN, QoS, IGMP snooping) while the integrated 1 Gbit Ethernet MAC uplinks to the management CPU. The 32-bit PCI 2.3 bus connects to external switch fabric ASICs (e.g., Vitesse/Marvell) for multi-port switching. Industrial temperature range (0C to 105C) supports factory floor deployment. Hardware watchdog and timer support industrial reliability requirements including IEC 61850 when properly designed.
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Embedded Data Acquisition Controllers
The MPC8347VVAJDB557 fits embedded data acquisition systems because the 533 MHz e300 core processes high-rate ADC data streams while the integrated Ethernet MAC publishes results via Modbus TCP, EtherNet/IP, or proprietary protocols. Dual PCI slots accept data acquisition cards; USB 2.0 supports local storage. DDR2 controller with 333 MHz operation handles large data buffers without dropping samples. Industrial temperature grade supports factory environments. Compared to an MCU-based architecture, this part handles TCP/IP stacks and web interfaces without external network processors.
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VoIP Media Gateways
The MPC8347VVAJDB557 suits small-to-medium VoIP media gateway designs because the PowerPC e300 at 533 MHz handles multiple G.711/G.729 codec channels while the integrated Ethernet and PCI provide connectivity to legacy PSTN interfaces (T1/E1). The hardware security engine supports SRTP/TLS for encrypted media. DDR2 controller with ECC prevents bit errors that would corrupt voice streams. Operating temperature 0C to 105C covers carrier-class deployment. Single-chip integration reduces the typical 3-chip (CPU + Ethernet + DSP) VoIP gateway architecture to a single SoC.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8347VVAJDB557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8347VVAJDB | MPC8347VVAJD | MPC8347EVVAJDB | MPC8343VVAJDB | MPC8358VVAJD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 672-TBGA (35x35) | 672-TBGA (35x35) - same | 672-TBGA (35x35) - same | 672-TBGA (35x35) - same | 672-TBGA (35x35) - same | 672-TBGA (35x35) - same |
| Core Frequency | 533 MHz | 400 MHz | 400 MHz | 533 MHz | 400 MHz | 667 MHz |
| Core Architecture | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Memory Controller | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Ethernet | 10/100/1000 (1 GbE) | 10/100/1000 | 10/100/1000 | 10/100/1000 | 10/100/1000 | 10/100/1000 (dual) |
| Security Engine | AES, 3DES, SHA-1/MD5 | AES, 3DES, SHA-1/MD5 | AES, 3DES, SHA-1/MD5 | Enhanced (same + extras) | Not included | AES, 3DES, SHA-1/MD5 |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| USB | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 |
주요 차별점
- Highest speed grade within MPC8347 family (vs MPC8347VVAJDB (400 MHz))
- Includes enhanced security engine variants (vs MPC8343VVAJDB (no crypto))
- Integrated GbE + DDR2 controller in single chip (vs MPC8358VVAJD (dual GbE, 667 MHz))
설계 노트
Estimated: at 533 MHz with 1.0V core voltage under typical load, power dissipation is approximately 2-3W for the MPC8347VVAJDB557. The 672-TBGA package requires a thermal via array beneath the die and a copper pad on PCB top layer. For sealed enclosures without airflow, consider a small clip-on heatsink. Junction temperature must remain below 105C per the operating grade. NXP Reference Manual provides thermal model guidelines for board designers.
Route DDR2 data signals with matched-length traces within the skew budget specified in the NXP Reference Manual. Power supply decoupling requires 0.1uF X7R capacitors placed within 100 mils of every power pin. The 672-TBGA package demands a 6-layer or 8-layer PCB stackup with dedicated ground/power planes. Use micro-via-in-pad technology for BGA breakout routing when PCB area is constrained. Maintain solid ground return paths under high-speed signal traces.
Do not skip the DDR2 initialization sequence in the bootloader - the MPC8347VVAJDB557 requires specific register programming before the memory controller is operational. Ensure SerDes configuration matches the connected PHY interface (RGMII vs GMII vs TBI). Verify hardware strapping pins during board bring-up per the Reference Manual configuration chapter. Use the NXP BSP with verified U-Boot configurations rather than custom bootloaders during initial development to avoid silent configuration errors.
The Gigabit Ethernet RGMII signals require source-series termination to maintain signal integrity across PCB traces. Trace impedance must be controlled to 50 ohms single-ended with 100-ohm differential pairs. The PCI bus operates at up to 66 MHz - route with 50-ohm controlled impedance and keep traces under 2 inches when possible. Place Ethernet magnetics within 100 mils of the RJ45 connector to minimize radiated emissions on the MDI traces.
규정 준수 정보
RoHS and REACH compliance verified through LCSC and NXP product listings. AEC-Q100 not applicable - this is an industrial-grade communications processor, not automotive-qualified.
