MPC8358EZQAGDDA - PowerQUICC II Pro MPU 400MHz | NXP
부품 번호: MPC8358EZQAGDDA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $47.24 | $47.24 |
| 10 | $42.51 | $425.10 |
| 100 | $38.05 | $3,805.00 |
| 500 | $33.92 | $16,960.00 |
| 1,000 | $30.4 | $30,400.00 |
MPC8358EZQAGDDA 개요
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions of a program stored in external memory, with on-chip caches and peripheral controllers. The MPC8358E sits in the PowerQUICC II Pro hierarchy: e300 core -> MPC83xx MPU family -> PowerQUICC communications processors -> embedded processors -> semiconductors. As a system-on-chip (SoC) variant, it integrates memory and communications peripherals that historically required companion chips.
Key features include the e300 core with MMU and instruction/data caches, dual DDR1/DDR2 memory controller with ECC, 32-bit PCI 2.2 interface, USB 2.0 FS/HS, up to three 10/100/1000 Mbit Ethernet MACs via the QUICC Engine, integrated security engine (SEC 2.0), ATM and HDLC/TDM serial support, and four DMA channels. Local bus controller supports up to eight chip selects for glue-less SRAM/flash/NOR.
The architecture combines a classic PowerPC superscalar core with NXP's QUICC Engine multi-protocol RISC coprocessor, offloading DMA and protocol handling. Hardware encryption acceleration reduces host CPU load for IPSec, SSL/TLS, and 3GPP cipher suites, making the part well-suited to VPN concentrators and security appliances.
Typical applications include broadband access routers, integrated access devices (IAD), VoIP gateways, DSLAM line cards, industrial control with Ethernet, and wireless LAN controllers. The integrated peripherals reduce BOM cost and PCB area versus discrete MPU + PHY + security IC solutions.
When designing with this device, allocate proper decoupling for the four voltage rails and route DDR traces with controlled impedance. Verify thermal dissipation at peak load because the 668-ball PBGA concentrates heat; airflow or a heat spreader is recommended above 2 W.
This page synthesizes distributor pricing, drop-in same-package alternatives from the MPC83xx family, and practical PCB layout notes not present in the manufacturer datasheet, giving engineers a single source for sourcing and design decisions.
드롭인 대체품: MPC8358EZQAGDDA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8358EZQAGDDA (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Core Architecture, Ethernet, Process Technology, Security Engine.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8358EVRAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8358VRAGDDA
✅ 드롭인✓ 재고 있음
$47.85 / 개
데이터시트 보기 →MPC8358EZUADDEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8360EZQAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8360EVRAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8358EZQAGDDA 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e300 (single core) |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 400 MHz |
| Core Supply Voltage | 1.2 V |
| Package Type | 668-pin TE-PBGA-PGE (29x29 mm) |
| 실장 유형 | Surface Mount |
| Memory Interface | DDR1/DDR2 with ECC |
| Ethernet | Up to 3 x 10/100/1000 Mbit (via QUICC Engine) |
| PCI | PCI 2.2, 32-bit, up to 66 MHz |
| USB | USB 2.0 (Full/High Speed) |
| Serial Protocols | ATM, HDLC, TDM, UART |
| Security Engine | SEC 2.0 (IPSec/SSL/3GPP acceleration) |
| Local Bus | 8 chip selects, SRAM/Flash/NOR |
| 동작 온도 | 0 C to +105 C (junction) |
| Lead-Free / RoHS | Lead-free finish; RoHS compliant |
MPC8358EZQAGDDA 668-pin te-pbga-pge (29x29 mm) 핀 구성 가이드
MPC8358EZQAGDDA(668-pin te-pbga-pge (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8358EZQAGDDA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8358EZQAGDDA 적합 용도: 6 애플리케이션s: Broadband Access Routers, Low-end DSLAM Line Cards, IP PBX and VoIP Gateways, Industrial Ethernet Controllers, Wireless Base-station Controllers, Network Security Appliances.
Broadband Access Routers
The MPC8358EZQAGDDA's 400 MHz e300 core with integrated three-port Gigabit Ethernet via QUICC Engine and SEC 2.0 hardware encryption makes it a strong fit for SME broadband routers and integrated access devices. According to NXP's PowerQUICC II Pro brief, the part delivers sufficient IPSec/SSL throughput for SOHO VPN gateways without offloading to a discrete crypto ASIC. Placed on the main control board with DDR2 and a 4-port GbE switch, it eliminates external PHY/MAC bridges and reduces BOM. The DDR1/DDR2 controller with ECC supports memory-intensive routing tables, while PCI 2.2 enables Wi-Fi or DSL modem co-processor expansion. Trade-off: at 400 MHz the part cannot run multi-gigabit WAN aggregation, so plan throughput headroom in the BOM.
추천
Low-end DSLAM Line Cards
The MPC8358EZQAGDDA's QUICC Engine multi-protocol RISC coprocessor with ATM and HDLC support is ideal for low-end DSLAM line cards where per-port protocol offload is required. Per the NXP MPC8360E/MPC8358E datasheet, the QUICC Engine handles ATM AAL2/AAL5 segmentation and HDLC bit-stuffing in hardware, freeing the e300 core for layer-2/3 forwarding. The 668 TE-PBGA package provides ample signal margin for backplane routing, and the 32-bit PCI bus interfaces to DSL chip sets without glue logic. Trade-off: thermal dissipation rises with port density; use forced airflow above 48-port configurations.
추천
IP PBX and VoIP Gateways
The MPC8358EZQAGDDA's TDM serial interface combined with SEC 2.0 encryption acceleration suits IP PBX and VoIP gateway designs handling encrypted SIP/TLS and SRTP streams. According to the hardware specifications, the part provides multiple TDM channels for connecting to legacy PSTN trunks, while the e300 core runs the VoIP stack. The integrated USB 2.0 enables local console/management attachment without extra glue. Trade-off: voice codec DSP processing competes with encryption throughput; prioritize codec selection or use a co-processor for high-channel-count designs.
추천
Industrial Ethernet Controllers
The MPC8358EZQAGDDA's industrial operating temperature range (0 C to 105 C junction) and triple GbE MACs make it suitable for industrial Ethernet controllers, protocol converters, and remote telemetry units. Per NXP's datasheet, the local bus controller supports SRAM/Flash/NOR with up to eight chip selects, allowing glue-less interface to industrial peripherals and FRAM. The SEC engine accelerates industrial cybersecurity (IEC 62443) and the DDR controller with ECC supports long MTBF designs. Trade-off: the 0 C minimum junction temperature precludes unheated outdoor enclosures; specify conformal coating separately.
추천
Wireless Base-station Controllers
The MPC8358EZQAGDDA's combination of high-throughput QUICC Engine, hardware encryption, and PCI expansion makes it appropriate for small-cell and femtocell base-station controllers. According to the NXP family brief, the e300 core runs layer-2 protocols while QUICC Engine handles backhaul serial interfaces, and SEC 2.0 accelerates 3GPP cipher suites (Kasumi, Snow 3G). The 668-ball PBGA with 1 mm pitch enables compact baseband board layout. Trade-off: LTE-Advanced throughput may exceed 400 MHz capability; consider the MPC8313 series for newer small-cell designs.
추천
Network Security Appliances
The MPC8358EZQAGDDA's SEC 2.0 hardware encryption engine accelerates IPSec, SSL/TLS, and 3GPP ciphers at line rate, making it well-suited for small/medium business VPN concentrators and security gateways. According to NXP documentation, the SEC offloads AES, 3DES, SHA, and public-key algorithms from the e300 core, doubling effective throughput versus software-only implementations. The three Gigabit Ethernet MACs support WAN, LAN, and DMZ segmentation in a single chip. Trade-off: for 10 Gbps aggregation, consider the MPC8572 series or external crypto accelerators.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8358EZQAGDDA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8358EVRAGDDA | MPC8358VRAGDDA | MPC8358EZUADDEA | MPC8360EZQAGDDA |
|---|---|---|---|---|---|
| Package | 668-TEPBGA (29x29 mm) | 668-TEPBGA (29x29) - same | 668-TEPBGA (29x29) - same | 668-TEPBGA (29x29) - same | 668-TEPBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e300, 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core | PowerPC e300, 1 core |
| QUICC Engine Channels | Yes (multi-protocol) | Yes | Reduced | Yes | Yes (higher throughput) |
| Security Engine | SEC 2.0 | SEC 2.0 | SEC 2.0 (per variant) | SEC 2.0 | SEC 2.0 |
| DDR Memory Interface | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
| Pinout in Composite (compat with E-series) | TBGA only | TBGA only (pin-compatible) | TBGA only (pin-compatible) | TBGA only (pin-compatible) | TBGA only (pin-compatible) |
주요 차별점
- Pin-compatible with the higher-throughput MPC8360E (vs MPC8360EZQAGDDA)
- Full QUICC Engine and SEC 2.0 integration (vs MPC8358VRAGDDA)
- Triple Gigabit Ethernet with hardware offload (vs MPC8313VRAFFC)
설계 노트
The MPC8358EZQAGDDA requires four independent supply rails: 1.2 V core, 2.5/1.8 V DDR I/O, 3.3 V standard I/O, and a quiet PLL/analog rail. Per the NXP hardware specifications, place a 10 uF bulk plus 0.1 uF ceramic decoupling pair within 5 mm of each supply pin group. Power sequencing must follow the POR rules in the datasheet to prevent internal latch-up; an external supervisor (e.g. TPS3808) is recommended.
At 400 MHz the part dissipates up to 2.5 W typical. The 668-ball TBGA with 1 mm pitch concentrates heat; design with a thermal via array under the exposed die region and use at least 1 oz copper on inner layers. For enclosed industrial enclosures, specify a small heat spreader or 100 LFM airflow. Estimated junction rise at 2.5 W with the NXP-recommended 4-layer PCB is 25-30 C above ambient.
Route DDR traces as 50 ohm single-ended controlled impedance with matched length within the DDR byte lanes. The local bus and PCI bus should also be length-matched per the NXP reference design. Place the 25 MHz system oscillator within 5 mm of the SYSCLK pins with a guard ring; the DDR reference clock must be sourced from the dedicated DDRCLK pin, not SYSCLK.
Common design pitfalls: (1) failing to strap the configuration pins correctly during POR, which can leave the part in a non-functional mode; (2) omitting the JTAG pull-ups on TCK/TMS/TDI, causing boundary-scan failures; (3) underestimating boot time after reset - the part requires up to 250 ms before code fetch; (4) confusing the E-suffix and V-suffix speed grades in ordering. Always cross-check the orderable part number against the datasheet decoder.
규정 준수 정보
RoHS compliant with lead-free finish per NXP product page. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. For material declaration documents (MDDS) and full substance compliance, request under NDA from NXP.
