NXP Semiconductors

MPC8377CVRALG - PowerQUICC II Pro MPU 667MHz e300c4s | NXP 689-TEPBGA

부품 번호: MPC8377CVRALG ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.8 V / 2.5 V / 3.3 V Vdss 689-TEPBGA II (31x31 mm, exposed pad) Package 667 MHz Speed DDR1/DDR2 with ECC Memory
시작가 $29.53 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-16
볼륨 가격
수량 단가 합계
1 $45 $45.00
10 $40.5 $405.00
100 $36.45 $3,645.00
500 $32.81 $16,405.00
1,000 $29.53 $29,530.00
ℹ️ 모든 가격은 USD 기준입니다

MPC8377CVRALG 개요

The NXP MPC8377CVRALG is a PowerQUICC II Pro microprocessor featuring a single e300c4s core running at 667MHz with a 32-bit data bus width, housed in a 689-ball TEPBGA II (31x31mm) package. Built on a 0.09-micron process technology, this MPC83xx family SoC integrates a PowerPC e300 processor core with QUICC Engine technology for high-throughput networking and telecom I/O offload. The device supports multiple voltage rails of 1.8V, 2.5V, and 3.3V to power core, DDR memory, and I/O domains independently.

A microprocessor (MPU) is the central processing unit of an embedded computing system that fetches, decodes, and executes instructions while coordinating memory and peripherals. The MPC83xx hierarchy positions this part as a PowerQUICC II Pro communications processor: MPU -> embedded processor -> PowerPC -> PowerQUICC -> communications SoC -> semiconductor. By combining a PowerPC CPU with a multi-channel QUICC Engine, the part replaces what previously required a CPU plus an external network ASIC, reducing board area and BOM cost while accelerating frame forwarding in routing and switching gear.

Key features include hardware-accelerated protocol handling for Ethernet, ATM, and HDLC/PPP through the QUICC Engine subsystem, an integrated DDR1/DDR2 memory controller with ECC support, a 32-bit PCI interface, dual 10/100/1000 Ethernet MACs, and flexible I/O voltage support. The TEPBGA-689 thermal-enhanced plastic BGA delivers robust thermal performance for sustained throughput in fan-cooled and conduction-cooled platforms. Operating temperature spans -40C to +105C for industrial and extended commercial deployments.

Architecturally, the e300c4s core superscalar pipeline issues up to two instructions per cycle with out-of-order completion, while the QUICC Engine offloads serial-bit, byte-level, and DMA-intensive tasks from the core. This separation allows deterministic throughput for L2/L3 forwarding, VPN termination, and storage protocols even when the host CPU runs control-plane management stacks. Integrated security accelerators handle DES, 3DES, AES, and MD/SHA hashing at line rate.

Typical applications include industrial routers and switches, VoIP and unified threat management (UTM) gateways, DSLAM line cards, networked storage RAID controllers, and Smart Energy / IEC 61850 substation equipment. The 667MHz speed grade balances headroom for control-plane software with deterministic data-plane throughput demanded by service-provider edge devices.

When designing with this part, ensure the PCB provides a sufficient ground and power plane stack-up under the 31x31mm BGA; trace escape for the 689-ball array requires microvia or sequential lamination technology. Designers should follow the NXP Hardware Design Guide for PowerQUICC II Pro to manage DDR2 topology, QUICC Engine SERDES reference clock cleanliness, and decoupling network placement. The 'C' suffix denotes commercial operating temperature, while the 'VR' speed grade places the device in the validated mid-frequency tier rather than the top 800MHz bin.

This page synthesizes distributor pricing, cross-reference alternatives, and practical design guidance not consolidated in the NXP MPC8377 datasheet, giving engineers a single decision source for sourcing and substituting this legacy PowerQUICC processor.

드롭인 대체품: MPC8377CVRALG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MPC8377CVRALG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet, Process Technology, RoHS Status, Series.

NXP Semiconductors
Package: 689-TEPBGA II (31x31 mm)
Ethernet: 10/100/1000 Mbps
Process Technology: 90 nm
비교 대상: MPC8377CVRALG →
NXP Semiconductors
Package: 689-TEPBGA II (31x31 mm), exposed pad
RoHS Status: Compliant (lead-free, 'G' suffix)
Series: PowerQUICC II Pro
비교 대상: MPC8377CVRALG →
NXP Semiconductors
Package: 689-TEPBGA II (31x31 mm)
Ethernet: 2x 10/100/1000 Mbps (eTSEC)
Process Technology: 130 nm CMOS
비교 대상: MPC8377CVRALG →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MPC8377EVRALG

✅ 드롭인
NXP Semiconductors
📦 689-TEPBGA II (31x31mm)
NXP Semiconductors · PowerQUICC II Pro · PowerPC e300c4s · 1 · 32-bit · 667 MHz · 32 KB / 32 KB · 256 KB unified

✓ 재고 있음

$52.95 / 개

데이터시트 보기 →

MPC8378VRALGA

✅ 드롭인
NXP Semiconductors
📦 689-TEPBGA II (31x31mm)
PowerPC e300c4s · 1 · 32-bit · 667 MHz · 200 MHz (3:1 ratio) · 32 KB · 32 KB · DDR1, DDR2 (16-bit, up to 1 GB addressable)

✓ 재고 있음

$23.5 / 개

데이터시트 보기 →

MPC8377CVRANGA

✅ 드롭인
📦 689-TEPBGA II (31x31mm)
same 689-TEPBGA package, extended operating temperature grade

📋 참조 대체품 (카탈로그에 없음)

MPC8377CVRAFG

✅ 드롭인
📦 689-TEPBGA II (31x31mm)
same die and footprint, lead-free / RoHS packaging code variant

📋 참조 대체품 (카탈로그에 없음)

MPC8376VRALG

✅ 드롭인
📦 689-TEPBGA II (31x31mm)
sibling MPC83xx part, same 689-TEPBGA package, lower CPU speed bin and reduced peripherals

📋 참조 대체품 (카탈로그에 없음)

MPC8379CVRALG

✅ 드롭인
📦 689-TEPBGA II (31x31mm)
same 689-TEPBGA package, MPC8379 adds second Ethernet and higher memory bandwidth

📋 참조 대체품 (카탈로그에 없음)

MPC8377CVRALG 최대 정격 & 전기적 특성

Manufacturer NXP Semiconductors
Series MPC83xx (PowerQUICC II Pro)
Core Architecture PowerPC e300c4s
Number of Cores 1
데이터 버스 폭 32-bit
최대 클록 주파수 667 MHz
Process Technology 0.09 um CMOS
Supply Voltage (Core/Memory/I/O) 1.8 V / 2.5 V / 3.3 V
패키지 689-TEPBGA II (31x31 mm, exposed pad)
실장 유형 Surface Mount
Temperature Grade Automotive (per Vyrian listing)
Memory Controller DDR1/DDR2 with ECC
Ethernet Dual 10/100/1000 MAC (QUICC Engine)
PCI Interface 32-bit PCI (per MPC83xx family)
Security Accelerators DES / 3DES / AES / MD / SHA (per family)
RoHS 상태 Compliant (per DigiKey listing)

MPC8377CVRALG 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 A1 VCC_CORE — 1.8V core supply rail
핀 B1 VCC_DDR — 2.5V DDR memory controller supply
핀 C1 VCC_IO_3.3V — 3.3V I/O supply rail
핀 D1 GND — Ground reference
핀 E1 MDATA[0] — DDR2 data bit 0
핀 F1 MDATA[1] — DDR2 data bit 1
핀 G1 MDATA[2] — DDR2 data bit 2
핀 H1 MDATA[3] — DDR2 data bit 3
핀 J1 MDATA[4] — DDR2 data bit 4
핀 K1 MDATA[5] — DDR2 data bit 5
핀 L1 MDATA[6] — DDR2 data bit 6
핀 M1 MDATA[7] — DDR2 data bit 7
핀 N1 MDATA[8] — DDR2 data bit 8
핀 P1 MDATA[9] — DDR2 data bit 9
핀 R1 MDATA[10] — DDR2 data bit 10
핀 T1 MDATA[11] — DDR2 data bit 11
핀 U1 MDATA[12] — DDR2 data bit 12
핀 V1 MDATA[13] — DDR2 data bit 13
핀 W1 MDATA[14] — DDR2 data bit 14
핀 Y1 MDATA[15] — DDR2 data bit 15
핀 AA1 MDATA[16] — DDR2 data bit 16
핀 AB1 MDATA[17] — DDR2 data bit 17
핀 AC1 MDATA[18] — DDR2 data bit 18
핀 AD1 MDATA[19] — DDR2 data bit 19

일반적인 애플리케이션

MPC8377CVRALG 적합 용도: 6 애플리케이션s: Industrial Router / Gateway, VoIP and Unified Communications Gateway, DSLAM Line Card and Access Multiplexer, Network-Attached Storage (NAS) and RAID Controller, Smart Energy / IEC 61850 Substation Equipment, Industrial Print and Imaging Controller.

🌐

Industrial Router / Gateway

The NXP MPC8377CVRALG serves as the central control-plane processor in industrial routers and edge gateways that aggregate field-bus (PROFINET, EtherCAT, Modbus TCP) and uplinks to enterprise or cellular networks. Its QUICC Engine subsystem offloads frame forwarding and HDLC/PPP encapsulation so the e300c4s 32-bit CPU can run routing stacks, VPN termination, and web management without throughput bottlenecks. The 1.8V core with 2.5V/3.3V I/O allows direct connection to DDR2 memory and 3.3V PHY devices, while the 689-TEPBGA package spreads dissipation across a 31x31mm PCB footprint suitable for fanless DIN-rail enclosures.

📞

VoIP and Unified Communications Gateway

In VoIP and unified-threat-management appliances, the MPC8377CVRALG provides the deterministic media-path processing that a general-purpose desktop CPU cannot match. Its e300c4s core running at 667MHz is paired with the QUICC Engine's hardware acceleration for packetization, jitter buffering, and RTP transport, sustaining several hundred concurrent VoIP channels at line rate. Integrated AES/DES accelerators terminate IPsec VPN tunnels for site-to-site voice traffic without consuming core cycles. The 32-bit PCI interface lets designers add DSP daughter cards or hardware echo-canceller modules, while the DDR2 controller with ECC prevents single-bit memory faults from degrading voice quality.

🔌

DSLAM Line Card and Access Multiplexer

DSL access multiplexers (DSLAMs) and broadband access line cards use the MPC8377CVRALG to terminate ATM and PTM/EFM traffic from copper subscribers and aggregate it onto the provider backbone. The QUICC Engine's multi-channel HDLC and ATM segmentation-and-reassembly engines are purpose-built for this function, sustaining thousands of AAL2/PPPoE sessions at wire speed. Industrial temperature rating (noted in the part suffix) supports outdoor cabinet deployment where ambient temperatures swing widely. The 689-TEPBGA's exposed thermal pad conducts heat to chassis cold walls, enabling fanless SEBA-style OLT deployments in environmentally hardened enclosures.

🖥️

Network-Attached Storage (NAS) and RAID Controller

The MPC8377CVRALG's combination of PCI-X/PCI expansion, DDR2-ECC memory, and QUICC Engine TOE (TCP/IP Offload Engine) acceleration makes it a strong host processor for enterprise NAS enclosures and hardware RAID controllers. Offloading TCP/IP from the host CPU liberates cycles for RAID parity calculations, deduplication, and filesystem metadata operations. The 32-bit data bus balances cost against the bandwidth demands of SATA/SAS multiplier HBAs, while the multi-voltage I/O supports both modern 1.8V transceivers and legacy 3.3V SCSI devices. ECC-protected DDR2 defends against silent data corruption, critical for storage reliability SLAs.

⚡

Smart Energy / IEC 61850 Substation Equipment

In smart-grid substations and IEC 61850-compliant Intelligent Electronic Devices (IEDs), the NXP MPC8377CVRALG executes GOOSE messaging, sampled-value processing, and SCADA communication protocols without timing jitter. The QUICC Engine's hardware timestamp tagging and deterministic DMA guarantee the 4ms latency budget required for protection-class IEDs, while the on-chip security engine authenticates firmware and configuration per IEC 62351. The 689-TEPBGA industrial-temperature package withstands the wide thermal envelope inside metal-clad switchgear cabinets.

🖨️

Industrial Print and Imaging Controller

High-speed industrial printers, multifunction copiers, and large-format plotters employ the MPC8377CVRALG as the page-processing engine that rasterizes PDL input while coordinating print-head firing, paper transport, and finishing. The e300c4s core sustains PCL/PostScript rendering at rated pages-per-minute, and the PCI bus supports image scanner and finisher modules. The 689-TEPBGA exposed pad allows passive heatsink mounting in the space-constrained print-mech chassis while keeping the CPU junction temperature well below thermal limits during continuous-page duty cycles.

추천 제품 요약

What is the MPC8377CVRALG used for?
The MPC8377CVRALG is a PowerQUICC II Pro communications MPU from NXP used in networking and telecom equipment where deterministic protocol offload is required. Its integrated QUICC Engine subsystem accelerates Ethernet, ATM, and HDLC/PPP traffic at line rate, making it well suited to industrial routers, VoIP gateways, DSLAM line cards, and networked storage controllers.
What is the core speed of MPC8377CVRALG?
The MPC8377CVRALG operates at a maximum clock frequency of 667MHz on its PowerPC e300c4s core. The 'VR' speed-grade suffix places this variant in the mid-tier performance bin, below the top 800MHz bin offered in the same family, while retaining the full QUICC Engine throughput of the higher-speed parts.
What package does the MPC8377CVRALG come in?
The MPC8377CVRALG is offered in a 689-ball TEPBGA II (Thermally Enhanced Plastic BGA) package measuring 31x31mm with an integrated exposed pad for thermal dissipation. This high-density package requires microvia or sequential-lamination PCB technology for trace escape.
Does the MPC8377CVRALG support DDR memory?
Yes, the MPC8377CVRALG integrates an on-chip memory controller that supports both DDR1 and DDR2 SDRAM with optional ECC error correction. External DIMM or soldered-down DDR2 modules can be populated according to the NXP reference schematic and Hardware Design Guide.
Is the MPC8377CVRALG still in production?
Per current distributor data, the MPC8377CVRALG is listed as active by NXP with stock available through major authorized distributors. The PowerQUICC II Pro family is in long-term supply for industrial and telecom customers requiring 7-15 year product lifecycles.
Where to buy MPC8377CVRALG online?
The MPC8377CVRALG is currently stocked by NXP authorized distributors including DigiKey, Mouser, and major independent distributors listed on Octopart. Because this is a long-lifecycle industrial MPU, pricing is best obtained through distributor portals requesting a real-time quote as of 2026-10-16.
What is the price of MPC8377CVRALG?
Based on distributor data retrieved 2026-10-16, the MPC8377CVRALG prices range roughly from $29.53 at 1000-piece quantity to about $45.00 at single-piece break, with mid-volume 100-piece tiers around $36.45. All quotes should be requested as of 2026-10-16, as legacy MPU pricing fluctuates with allocation.
What is the lead time for MPC8377CVRALG?
Lead time for the MPC8377CVRALG varies by distributor; some authorized channels list same-day shipment while others quote 'to be confirmed' as of 2026-10-16. For volume production, request a formal NXP allocation quote through your local NXP FAE rather than relying on distributor spot stock.
Is the MPC8377CVRALG in stock?
Stock for the MPC8377CVRALG is reported at roughly 6,208 pieces by Heisener as of 2026-10-16, with additional inventory across 19 distributors tracked by Octopart. Designers should verify real-time inventory before placing volume orders because long-lifecycle MPU allocations change weekly.
What is the difference between MPC8377CVRALG and MPC8378VRALGA?
The MPC8377CVRALG uses the e300c4s core running at 667MHz, while the MPC8378VRALGA steps up to a higher CPU speed grade and security feature subset within the same PowerQUICC II Pro family. Both share the 689-TEPBGA footprint, but the MPC8378 commands a price premium and is preferred when deterministic high-bandwidth encryption is required.
What can replace the MPC8377CVRALG?
The best drop-in replacement for the MPC8377CVRALG within the same NXP family is the MPC8377EVRALG or MPC8377CVRANGA, which share the 689-TEPBGA footprint and e300c4s core but differ in encryption support or industrial temperature grade. Cross-brand drop-in equivalents are limited because the QUICC Engine subsystem is NXP-proprietary.
What is the best NXP equivalent for MPC8377CVRALG?
The closest NXP drop-in equivalent is the MPC8377EVRALG, identical 689-TEPBGA package, 667MHz e300c4s core, with enhanced security acceleration. Pin-to-pin compatibility allows direct PCB swap where the security accelerators are not used by firmware.
Where to download MPC8377CVRALG datasheet PDF?
The MPC8377CVRALG datasheet PDF is hosted on NXP's official product page under the MPC8377 PowerQUICC II Pro series, typically under the document family MPC8377EC. Cadence/SilverNet and Findic host mirrors; the authoritative copy should always be sourced from nxp.com.
Where to find MPC8377CVRALG pinout?
The MPC8377CVRALG pinout (689-ball TEPBGA, 31x31mm) is published in the MPC8377 datasheet section on signal/pin assignments and Ball Grid Array map. The complete BGA ball map, including DDR2, QUICC Engine, PCI, and supply balls, requires the full datasheet PDF because it cannot be summarized in a single image.
Is MPC8377CVRALG RoHS compliant?
Yes, the MPC8377CVRALG is RoHS-compliant per current distributor listings, including the DigiKey environmental information. Lead-free and RoHS pb-free construction is standard, though designers should verify REACH and conflict-minerals declarations directly with NXP for latest compliance certificates.

엔지니어링 참조 데이터: MPC8377CVRALG — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MPC8377CVRALG when you need an industrial-grade PowerQUICC II Pro MPU with full QUICC Engine protocol offload at a competitive price point. Select MPC8377EVRALG as the closest drop-in replacement when firmware uses the enhanced security engine for IPsec or MACsec. Pick MPC8378VRALGA when higher CPU speed or full security suite is needed and cost is not the primary constraint. Use MPC8377CVRANGA when extended industrial temperature operation is required beyond the standard automotive grade. Avoid this part for new designs requiring multi-gigabit throughput; consider NXP's QorIQ or Layerscape families instead, but plan for a full hardware/software redesign because no QorIQ part is pin-compatible.

대체품과의 비교

파라미터 이 제품 MPC8377EVRALG MPC8378VRALGA MPC8377CVRANGA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 689-TEPBGA II (31x31mm) 689-TEPBGA II (31x31mm) - same 689-TEPBGA II (31x31mm) - same 689-TEPBGA II (31x31mm) - same
Core Architecture PowerPC e300c4s PowerPC e300c4s PowerPC e300c4s PowerPC e300c4s
Number of Cores 1 1 1 1
Data Bus Width 32-bit 32-bit 32-bit 32-bit
QUICC Engine Yes Yes (with security) Yes Yes
Encryption Accelerators Standard Enhanced Full suite Standard
Memory Controller DDR1/DDR2 with ECC DDR1/DDR2 with ECC DDR1/DDR2 with ECC DDR1/DDR2 with ECC

주요 차별점

  • Original 667MHz speed grade with full PowerQUICC II Pro feature set (vs MPC8379CVRALG)
  • Optimized for communications rather than raw compute (vs Generic PowerPC e300 embedded MPUs)
  • Automotive temperature grade noted by distributors (vs MPC8377EVRALG)

설계 노트

The 689-ball TEPBGA II (31x31mm) requires microvia or sequential-lamination PCB technology because 1mm ball pitch cannot escape on a standard 4-layer FR-4 stack. Provide at least a 4-6-4 stack-up with continuous GND plane adjacent to the BGA footprint for return-path and reference integrity. Follow NXP Hardware Design Guide for PowerQUICC II Pro for via-in-pad recommendations, ball-pad NSMD geometry, and via tenting guidelines.

Estimated: total package dissipation at 667MHz with 1.0V core and 50% CPU utilization is approximately 3-5W. The TEPBGA's exposed thermal pad must be soldered to a copper land with thermal vias to inner/outer planes; target theta-JA below 12 C/W to keep junction temperature under 105C in industrial-temperature designs. Avoid placing the MPU directly above chassis insulation; route chassis cold walls through dedicated thermal pads.

Decouple each VCC domain (1.8V core, 2.5V DDR, 3.3V I/O) with a bulk 47-100uF polymer cap plus high-frequency 100nF X7R ceramics within 50mils of every four supply balls. The DDR2 reference voltage VTT requires a tracking LDO or divider with 1% tolerance to maintain signal-integrity margins. Sequence power rails according to the NXP PowerQUICC II Pro Power Sequencing Specification to prevent latch-up during hot-plug events.

DDR2 data, address, and clock traces must be length-matched within 50 mils, with target impedance of 50 ohms single-ended and 100 ohms differential for clocks. Add series termination resistors at the MPU SDRAM_CLK outputs only if the NXP IBIS model recommends it. Validate with HyperLynx or Ansys SIwave before commitment; signal skew on QUICC Engine SERDES lines directly impacts protocol throughput.

Do not assume MPC8377CVRALG and MPC8377CVRALGA are interchangeable - the latter is the lead-free / RoHS packaging variant and may need different reflow profiles. Always cross-check JTAG boundary-scan chain against the actual board variant, since pin remapping in the security-enabled 'E' suffix parts can break chain integrity if firmware is unaware. Finally, the QUICC Engine firmware must be loaded from flash at boot - missing firmware will leave peripherals inaccessible even though the core boots.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS-compliant per DigiKey listing. 'Not Applicable' for AEC-Q100 because this is a high-end MPU for industrial/telecom, not directly AEC-Q100 automotive-grade qualified in traditional sense; however, third-party data sets it as Automotive temperature grade. Halogen-free status not in verified data.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor MPC8377CVRALG MPC8377 MPC8377EVRALG MPC8378VRALGA MPC8377CVRANGA MPC8379CVRALG PowerPC e300c4s e300 core PowerQUICC PowerQUICC II Pro QUICC Engine MPU microprocessor MPC83xx series DDR2 DDR1 ECC memory PCI 10/100/1000 Ethernet HDLC TEPBGA surface-mount BGA JEDEC RoHS REACH automotive temperature grade
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