MPC852TZT50A - PowerQUICC II MPU, 50MHz, 256-PBGA | NXP
부품 번호: MPC852TZT50A ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.1 | $18.10 |
| 10 | $17.45 | $174.50 |
| 100 | $16.2 | $1,620.00 |
| 500 | $14.85 | $7,425.00 |
| 1,000 | $13.5 | $13,500.00 |
MPC852TZT50A 개요
A PowerQUICC processor is a specialized communications microprocessor that combines a general-purpose embedded core with dedicated communications peripheral logic on a single die. The PowerQUICC architecture hierarchy runs: PowerQUICC -> communications processor -> MPU -> microprocessor -> integrated circuit. This category sits between microcontroller units (MCUs) and high-performance microprocessors, optimized for telecom and networking equipment that requires deterministic data-plane throughput alongside control-plane programmability.
Key features of the MPC852TZT50A include an integrated CPM (Communications Processor Module) that offloads communications-intensive processing from the embedded core, hardware acceleration for Fast Ethernet and HDLC/SDLC protocols, dual 10/100 Mbps Ethernet MACs, and PCI interface support. The device targets telecom line cards, Ethernet bridges, and industrial control applications that demand superior performance over traditional architectures by offloading networking tasks from the host CPU.
The MPC852TZT50A leverages the PowerQUICC II architecture, which integrates a 32-bit PowerPC core with a RISC-based CPM. The CPM contains multiple serial communication controllers (SCCs), serial management controllers (SMCs), a USB controller, and an I2C interface. The 50MHz core clock combined with the dedicated CPM allows sustained data throughput across multiple serial channels without overloading the host core.
Typical applications include Ethernet-to-Ethernet line cards for telecom switches, ISDN router line interfaces, industrial serial-to-Ethernet bridges, HDLC/SDLC protocol controllers, and T1/E1 framer interfacing. The part supports legacy communications protocols used in carrier-grade networking equipment, making it valuable for both new designs and maintenance of installed telecom infrastructure.
When designing with the MPC852TZT50A, note that the part is in NXP's End of Life program per the manufacturer's product page. Designers should evaluate the recommended replacement announced in the PCN and confirm long-term availability. The 256-PBGA package requires careful PCB layout with controlled-impedance traces for the external memory bus and proper thermal vias beneath the BGA array.
This page synthesizes distributor pricing, drop-in PowerQUICC alternatives, and design considerations that complement the manufacturer datasheet.
드롭인 대체품: MPC852TZT50A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC852TZT50A (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Series, Manufacturer, Package, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC852TZT66A
✅ 드롭인✓ 재고 있음
$21.85 / 개
데이터시트 보기 →MPC852TZT80A
✅ 드롭인✓ 재고 있음
$29.95 / 개
데이터시트 보기 →MPC852TVR50A
✅ 드롭인✓ 재고 있음
$23.9 / 개
데이터시트 보기 →MPC852TCVR50A
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →MPC852TZT50A 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC852TZT50A |
| Series | PowerQUICC II / MPC8xx |
| Core Architecture | 32-bit Power Architecture (PowerPC) |
| Core Count | 1 |
| Core Speed | 50 MHz |
| Process Technology | 0.18 um CMOS |
| 공급 전압 | 3.3 V |
| 패키지 | 256-PBGA (23x23 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +95C (commercial) |
| Packaging | Tray |
| 메모리 유형 | External SDRAM/ROM (no internal Flash) |
| Ethernet | Dual 10/100 Mbps MAC |
| PCI Interface | Yes (PCI 2.2 compliant) |
| USB | USB 1.1 host/client |
| RoHS 상태 | Non-compliant (per DigiChip datasheet summary) |
MPC852TZT50A 256-pbga (23x23 mm) 핀 구성 가이드
MPC852TZT50A(256-pbga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC852TZT50A.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC852TZT50A 적합 용도: 6 애플리케이션s: Ethernet-to-Ethernet Line Cards, Industrial Serial-to-Ethernet Bridges, ISDN Router Line Interfaces, T1/E1 Framer Interfacing, Embedded Telecom Control Processor, Legacy Protocol Bridge (HDLC/SDLC/X.25).
Ethernet-to-Ethernet Line Cards
The MPC852TZT50A is purpose-built for Ethernet-to-Ethernet line cards in telecom switches and access multiplexers, where it bridges Fast Ethernet traffic between backplane fabric and customer-facing ports. Its integrated dual 10/100 Mbps Ethernet MACs eliminate the need for an external PHY-controller chip pair, reducing BOM cost and PCB area. The 50MHz Power Architecture core plus dedicated CPM offload HDLC framing, VLAN tagging, and QoS classification from the host CPU, sustaining wire-speed throughput on multiple ports simultaneously. The 256-PBGA package's high pin count provides ample GPIO for SGMII serialization and external PHY management interfaces.
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Industrial Serial-to-Ethernet Bridges
The MPC852TZT50A's CPM integrates multiple Serial Communication Controllers (SCCs) and Serial Management Controllers (SMCs) that natively handle RS-232, RS-485, and HDLC/SDLC protocols at T1/E1 rates. In industrial serial-to-Ethernet bridges, the device terminates legacy field-bus traffic on the serial side and repackages it as TCP/IP or UDP packets on the Ethernet side, eliminating the need for an external protocol converter ASIC. The 50MHz core clock and on-chip DMA controllers deliver deterministic latency for SCADA and Modbus TCP gateway designs in factory automation. Operating temperature of 0 to 95C suits control cabinet environments with airflow cooling.
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ISDN Router Line Interfaces
The MPC852TZT50A excels in ISDN router line interface cards where it must terminate Basic Rate Interface (BRI) or Primary Rate Interface (PRI) channels and present them as Ethernet packets to the router's main CPU. The CPM's Time Slot Assigner (TSA) and multi-channel HDLC controllers handle the 2B+D and 30B+D channelized TDM streams without core intervention, a task that would otherwise consume all CPU cycles on a generic MPU. The PCI 2.2 interface allows the MPC852TZT50A to sit on a router's peripheral bus as a co-processor, accelerating ISDN-to-IP packet forwarding for legacy enterprise telephony equipment. The 256-PBGA package supports the high signal pin count required for parallel TDM bus access.
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T1/E1 Framer Interfacing
T1 (1.544 Mbps) and E1 (2.048 Mbps) framer interfacing in carrier-grade telecom equipment relies on the MPC852TZT50A's integrated SCCs operating in HDLC mode with on-chip clock recovery and elastic store buffers. The CPM directly connects to external framer ICs via the Time-Division Multiplexed (TDM) bus, extracting individual DS0 channels and presenting them as separate SCC channels for downstream processing. Compared to discrete UART-based designs, this integrated approach reduces board real estate by approximately 40 percent while meeting the 1.5 to 2.0 Mbps sustained throughput required per T1/E1 link. The 3.3V supply simplifies power-tree design in legacy 5V-tolerant line card architectures.
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Embedded Telecom Control Processor
As an embedded control processor in telecom shelves, the MPC852TZT50A runs management and provisioning tasks such as SNMP agents, alarm monitoring, and CLI interfaces while the CPM handles the data plane. The integrated USB 1.1 controller allows direct connection to a management laptop for field diagnostics without needing a separate serial-to-USB bridge chip. The PCI interface lets the MPC852TZT50A act as a peripheral to a host backplane CPU, offloading shelf-management workloads and reporting via I2C to downstream line cards. This dual-role capability makes the part valuable in ATCA and AdvancedTCA shelf controller designs where reliability and deterministic response are non-negotiable.
추천
Legacy Protocol Bridge (HDLC/SDLC/X.25)
The MPC852TZT50A's hardware-accelerated HDLC and SDLC controllers make it the preferred bridge between legacy X.25, frame relay, or SDLC enterprise networks and modern IP backbones. The CPM can sustain multiple full-duplex HDLC channels at 2.048 Mbps simultaneously while the host core runs routing tables and QoS policies, a workload that would otherwise require an external ASIC plus a separate management CPU. Engineers use this configuration in banking ATM networks, utility SCADA, and government networks where legacy protocols remain in service for decades. The 256-PBGA package's thermal envelope and 3.3V single-supply operation simplify retrofitting the part into existing line-card designs.
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추천 제품 요약
엔지니어링 참조 데이터: MPC852TZT50A — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC852TZT66A | MPC852TZT80A | MPC852TVR50A | MPC852TCVR50A |
|---|---|---|---|---|---|
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 50 MHz | 66 MHz | 80 MHz | 50 MHz | 50 MHz |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Series | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx |
| Process Technology | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) |
| Packaging Media | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Same-package speed upgrade path within NXP family (vs MPC852TZT50A vs MPC852TZT66A)
- Tray-packaged for low-Mix manufacturing (vs MPC852TZT50A vs MPC852TVR50A)
- Drop-in compatible with 80MHz speed grade (vs MPC852TZT50A vs MPC852TZT80A)
설계 노트
The 256-PBGA package at 23x23 mm relies on a central thermal pad that must be soldered to a copper pour with thermal vias to the inner PCB ground planes. Under continuous CPM load with all SCC channels active, internal junction temperatures can approach 90C at 50MHz with only ambient cooling. Recommended practice: place at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) directly under the BGA thermal balls, connecting to a 2 oz copper inner plane. Avoid placing the MPC852TZT50A adjacent to high-power switching regulators; thermal cross-coupling can push the junction above the 95C commercial limit.
The 256-PBGA at 1.27 mm ball pitch requires PCB fabrication with microvia or via-in-pad technology for reliable assembly. Standard 0.2 mm via-in-pad with filled and plated-over copper is recommended for the inner rows. External memory bus traces to SDRAM must be length-matched within plus or minus 25 mils across all 32 data lines and the 14 address lines to maintain timing margin at 50MHz core clock. Route the Ethernet MII signals on an inner layer with 50 ohm controlled impedance and keep them isolated from the parallel memory bus by at least 3W spacing.
Do not assume the MPC852TZT50A is RoHS-compliant: per the DigiChip datasheet summary, RoHS is 'No', meaning lead-bearing solder balls. Forcing this part onto a RoHS-only assembly line will cause solder joint reliability issues. For new RoHS designs, evaluate the recommended NXP replacement listed in the Product Change Notice. Additionally, the part has NO internal Flash memory; any design must include external boot ROM (typically 1 MB x 8 NOR Flash) and SDRAM (minimum 4 MB x 32) connected to the external memory controller. Forgetting the external memory results in a non-functional board even though the BGA is correctly soldered.
The PCI 2.2 interface runs at 33MHz and is sensitive to reflections on long trace runs. Place series damping resistors (22 to 33 ohm) near the MPC852TZT50A PCI outputs if the trace length to the PCI connector exceeds 1.5 inches. The USB 1.1 differential pair (D+/D-) requires 90 ohm differential impedance with no more than one via per side to maintain signal integrity. The Ethernet MII interface to the external PHY must be length-matched within 100 mils across all data and clock signals to avoid bit errors at 100 Mbps.
규정 준수 정보
RoHS status: No per DigiChip datasheet summary. Part uses lead-bearing solder balls. REACH, halogen-free, and conflict minerals status not disclosed in available data. AEC-Q100 not applicable - commercial telecom part, not automotive.