MPC852TZT50A - PowerQUICC II MPU, 50MHz, 256-PBGA | NXP
MPN: MPC852TZT50A ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.1 | $18.10 |
| 10 | $17.45 | $174.50 |
| 100 | $16.2 | $1,620.00 |
| 500 | $14.85 | $7,425.00 |
| 1,000 | $13.5 | $13,500.00 |
MPC852TZT50A Overview
A PowerQUICC processor is a specialized communications microprocessor that combines a general-purpose embedded core with dedicated communications peripheral logic on a single die. The PowerQUICC architecture hierarchy runs: PowerQUICC -> communications processor -> MPU -> microprocessor -> integrated circuit. This category sits between microcontroller units (MCUs) and high-performance microprocessors, optimized for telecom and networking equipment that requires deterministic data-plane throughput alongside control-plane programmability.
Key features of the MPC852TZT50A include an integrated CPM (Communications Processor Module) that offloads communications-intensive processing from the embedded core, hardware acceleration for Fast Ethernet and HDLC/SDLC protocols, dual 10/100 Mbps Ethernet MACs, and PCI interface support. The device targets telecom line cards, Ethernet bridges, and industrial control applications that demand superior performance over traditional architectures by offloading networking tasks from the host CPU.
The MPC852TZT50A leverages the PowerQUICC II architecture, which integrates a 32-bit PowerPC core with a RISC-based CPM. The CPM contains multiple serial communication controllers (SCCs), serial management controllers (SMCs), a USB controller, and an I2C interface. The 50MHz core clock combined with the dedicated CPM allows sustained data throughput across multiple serial channels without overloading the host core.
Typical applications include Ethernet-to-Ethernet line cards for telecom switches, ISDN router line interfaces, industrial serial-to-Ethernet bridges, HDLC/SDLC protocol controllers, and T1/E1 framer interfacing. The part supports legacy communications protocols used in carrier-grade networking equipment, making it valuable for both new designs and maintenance of installed telecom infrastructure.
When designing with the MPC852TZT50A, note that the part is in NXP's End of Life program per the manufacturer's product page. Designers should evaluate the recommended replacement announced in the PCN and confirm long-term availability. The 256-PBGA package requires careful PCB layout with controlled-impedance traces for the external memory bus and proper thermal vias beneath the BGA array.
This page synthesizes distributor pricing, drop-in PowerQUICC alternatives, and design considerations that complement the manufacturer datasheet.
Drop-in alternatives for MPC852TZT50A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC852TZT50A (same form factor and footprint) — differing in Operating Temperature, Series, Manufacturer, Package, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesMPC852TZT50A Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC852TZT50A |
| Series | PowerQUICC II / MPC8xx |
| Core Architecture | 32-bit Power Architecture (PowerPC) |
| Core Count | 1 |
| Core Speed | 50 MHz |
| Process Technology | 0.18 um CMOS |
| Supply Voltage | 3.3 V |
| Package | 256-PBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +95C (commercial) |
| Packaging | Tray |
| Memory Type | External SDRAM/ROM (no internal Flash) |
| Ethernet | Dual 10/100 Mbps MAC |
| PCI Interface | Yes (PCI 2.2 compliant) |
| USB | USB 1.1 host/client |
| RoHS Status | Non-compliant (per DigiChip datasheet summary) |
MPC852TZT50A 256-pbga (23x23 mm) Pin Configuration Guide
Pin configuration for MPC852TZT50A (256-pbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC852TZT50A.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC852TZT50A is suitable for 6 applications: Ethernet-to-Ethernet Line Cards, Industrial Serial-to-Ethernet Bridges, ISDN Router Line Interfaces, T1/E1 Framer Interfacing, Embedded Telecom Control Processor, Legacy Protocol Bridge (HDLC/SDLC/X.25).
Ethernet-to-Ethernet Line Cards
The MPC852TZT50A is purpose-built for Ethernet-to-Ethernet line cards in telecom switches and access multiplexers, where it bridges Fast Ethernet traffic between backplane fabric and customer-facing ports. Its integrated dual 10/100 Mbps Ethernet MACs eliminate the need for an external PHY-controller chip pair, reducing BOM cost and PCB area. The 50MHz Power Architecture core plus dedicated CPM offload HDLC framing, VLAN tagging, and QoS classification from the host CPU, sustaining wire-speed throughput on multiple ports simultaneously. The 256-PBGA package's high pin count provides ample GPIO for SGMII serialization and external PHY management interfaces.
Recommended
Industrial Serial-to-Ethernet Bridges
The MPC852TZT50A's CPM integrates multiple Serial Communication Controllers (SCCs) and Serial Management Controllers (SMCs) that natively handle RS-232, RS-485, and HDLC/SDLC protocols at T1/E1 rates. In industrial serial-to-Ethernet bridges, the device terminates legacy field-bus traffic on the serial side and repackages it as TCP/IP or UDP packets on the Ethernet side, eliminating the need for an external protocol converter ASIC. The 50MHz core clock and on-chip DMA controllers deliver deterministic latency for SCADA and Modbus TCP gateway designs in factory automation. Operating temperature of 0 to 95C suits control cabinet environments with airflow cooling.
Recommended
ISDN Router Line Interfaces
The MPC852TZT50A excels in ISDN router line interface cards where it must terminate Basic Rate Interface (BRI) or Primary Rate Interface (PRI) channels and present them as Ethernet packets to the router's main CPU. The CPM's Time Slot Assigner (TSA) and multi-channel HDLC controllers handle the 2B+D and 30B+D channelized TDM streams without core intervention, a task that would otherwise consume all CPU cycles on a generic MPU. The PCI 2.2 interface allows the MPC852TZT50A to sit on a router's peripheral bus as a co-processor, accelerating ISDN-to-IP packet forwarding for legacy enterprise telephony equipment. The 256-PBGA package supports the high signal pin count required for parallel TDM bus access.
Recommended
T1/E1 Framer Interfacing
T1 (1.544 Mbps) and E1 (2.048 Mbps) framer interfacing in carrier-grade telecom equipment relies on the MPC852TZT50A's integrated SCCs operating in HDLC mode with on-chip clock recovery and elastic store buffers. The CPM directly connects to external framer ICs via the Time-Division Multiplexed (TDM) bus, extracting individual DS0 channels and presenting them as separate SCC channels for downstream processing. Compared to discrete UART-based designs, this integrated approach reduces board real estate by approximately 40 percent while meeting the 1.5 to 2.0 Mbps sustained throughput required per T1/E1 link. The 3.3V supply simplifies power-tree design in legacy 5V-tolerant line card architectures.
Recommended
Embedded Telecom Control Processor
As an embedded control processor in telecom shelves, the MPC852TZT50A runs management and provisioning tasks such as SNMP agents, alarm monitoring, and CLI interfaces while the CPM handles the data plane. The integrated USB 1.1 controller allows direct connection to a management laptop for field diagnostics without needing a separate serial-to-USB bridge chip. The PCI interface lets the MPC852TZT50A act as a peripheral to a host backplane CPU, offloading shelf-management workloads and reporting via I2C to downstream line cards. This dual-role capability makes the part valuable in ATCA and AdvancedTCA shelf controller designs where reliability and deterministic response are non-negotiable.
Recommended
Legacy Protocol Bridge (HDLC/SDLC/X.25)
The MPC852TZT50A's hardware-accelerated HDLC and SDLC controllers make it the preferred bridge between legacy X.25, frame relay, or SDLC enterprise networks and modern IP backbones. The CPM can sustain multiple full-duplex HDLC channels at 2.048 Mbps simultaneously while the host core runs routing tables and QoS policies, a workload that would otherwise require an external ASIC plus a separate management CPU. Engineers use this configuration in banking ATM networks, utility SCADA, and government networks where legacy protocols remain in service for decades. The 256-PBGA package's thermal envelope and 3.3V single-supply operation simplify retrofitting the part into existing line-card designs.
Recommended
Recommended Products Summary
Engineering reference data for MPC852TZT50A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC852TZT66A | MPC852TZT80A | MPC852TVR50A | MPC852TCVR50A |
|---|---|---|---|---|---|
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 50 MHz | 66 MHz | 80 MHz | 50 MHz | 50 MHz |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Series | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx | PowerQUICC II / MPC8xx |
| Process Technology | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) |
| Packaging Media | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Same-package speed upgrade path within NXP family (vs MPC852TZT50A vs MPC852TZT66A)
- Tray-packaged for low-Mix manufacturing (vs MPC852TZT50A vs MPC852TVR50A)
- Drop-in compatible with 80MHz speed grade (vs MPC852TZT50A vs MPC852TZT80A)
Design Notes
The 256-PBGA package at 23x23 mm relies on a central thermal pad that must be soldered to a copper pour with thermal vias to the inner PCB ground planes. Under continuous CPM load with all SCC channels active, internal junction temperatures can approach 90C at 50MHz with only ambient cooling. Recommended practice: place at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) directly under the BGA thermal balls, connecting to a 2 oz copper inner plane. Avoid placing the MPC852TZT50A adjacent to high-power switching regulators; thermal cross-coupling can push the junction above the 95C commercial limit.
The 256-PBGA at 1.27 mm ball pitch requires PCB fabrication with microvia or via-in-pad technology for reliable assembly. Standard 0.2 mm via-in-pad with filled and plated-over copper is recommended for the inner rows. External memory bus traces to SDRAM must be length-matched within plus or minus 25 mils across all 32 data lines and the 14 address lines to maintain timing margin at 50MHz core clock. Route the Ethernet MII signals on an inner layer with 50 ohm controlled impedance and keep them isolated from the parallel memory bus by at least 3W spacing.
Do not assume the MPC852TZT50A is RoHS-compliant: per the DigiChip datasheet summary, RoHS is 'No', meaning lead-bearing solder balls. Forcing this part onto a RoHS-only assembly line will cause solder joint reliability issues. For new RoHS designs, evaluate the recommended NXP replacement listed in the Product Change Notice. Additionally, the part has NO internal Flash memory; any design must include external boot ROM (typically 1 MB x 8 NOR Flash) and SDRAM (minimum 4 MB x 32) connected to the external memory controller. Forgetting the external memory results in a non-functional board even though the BGA is correctly soldered.
The PCI 2.2 interface runs at 33MHz and is sensitive to reflections on long trace runs. Place series damping resistors (22 to 33 ohm) near the MPC852TZT50A PCI outputs if the trace length to the PCI connector exceeds 1.5 inches. The USB 1.1 differential pair (D+/D-) requires 90 ohm differential impedance with no more than one via per side to maintain signal integrity. The Ethernet MII interface to the external PHY must be length-matched within 100 mils across all data and clock signals to avoid bit errors at 100 Mbps.
Compliance Information
RoHS status: No per DigiChip datasheet summary. Part uses lead-bearing solder balls. REACH, halogen-free, and conflict minerals status not disclosed in available data. AEC-Q100 not applicable - commercial telecom part, not automotive.