MPC8533VTARJA557 - PowerQUICC III 1.067GHz MPU | NXP | Networking SoC
부품 번호: MPC8533VTARJA557 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $138 | $1,380.00 |
| 100 | $132 | $13,200.00 |
| 500 | $125 | $62,500.00 |
| 1,000 | $118 | $118,000.00 |
MPC8533VTARJA557 개요
A microprocessor in the MPC8533 family is a high-integration Power Architecture (PowerPC) communications processor that blends a general-purpose RISC compute engine with dedicated I/O and protocol acceleration blocks. The e500v2 core implements the Book-E embedded architecture with a 32-bit datapath, MMU, and hardware virtualization support; it sits within a broader taxonomy of Power Architecture devices -> communications processors -> SoCs -> microprocessors -> ICs. The MPC8533 specifically belongs to the PowerQUICC III lineage, a NXP platform that has historically dominated wired networking designs such as routers, switches, DSLAMs, and base-station control-plane modules.
Key features include a 32-bit 1.067 GHz e500v2 core, integrated DDR1/DDR2 memory controller, dual GbE MACs, PCI Express and PCI interfaces, a Security Engine block, and on-chip SRAM. The SoC supports multi-protocol serial RapidIO, UART, I2C, SPI, and USB peripherals, and is offered with extended temperature grades. Its 783-ball FC-PBGA package exposes the full peripheral set while providing a thermal envelope suitable for industrial and carrier-grade equipment.
The MPC8533VTARJA557 is built on a 90 nm CMOS process with a 0.95 V to 1.05 V core voltage and 1.8V/2.5V/3.3V I/O. Internal coherency, an L2 cache with ECC, and the RapidIO fabric deliver low-latency data movement needed for line-card packet processing. Compared with the lower-pin-count MPC8536 and MPC8544, the 8533 emphasizes integration of the security and DMA engines for compact line-card designs.
Typical applications include managed Ethernet switches, multiservice routers, edge routers, DSLAM line cards, wireless base-station controllers, and industrial control-plane modules. Designers leverage the integrated DDR2 controller to lower BOM cost and PCB complexity versus discrete CPU-plus-memory solutions.
When designing with this device, allocate at least four PCB layers with dedicated power and ground planes for the 783-ball BGA, and follow NXP's AN-2582 layout recommendations for high-speed DDR2 routing and SerDes signal integrity. Thermal analysis must consider the worst-case core power at 1.05 V to size copper pours and any optional heatsink for sealed enclosures.
This page synthesizes NXP MPC8533 family documentation, distributor pricing, and drop-in package alternatives not consolidated in the manufacturer datasheet alone.
드롭인 대체품: MPC8533VTARJA557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8533VTARJA557 (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, Operating Temperature, Core Architecture, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8533VTARJA
✅ 드롭인✓ 재고 있음
$117.6 / 개
데이터시트 보기 →MPC8533EVTARJA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$148 / 개
데이터시트 보기 →MPC8533VTANG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8536VTARJA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8544VTARJA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$86.4 / 개
데이터시트 보기 →MPC8533VTARJA557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | MPC85xx PowerQUICC III |
| Core Architecture | PowerPC e500v2 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1.067 GHz |
| Core Voltage | 0.95 V to 1.05 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| 동작 온도 | 0°C to 90°C (TJ) |
| 패키지 / 케이스 | 783-FCPBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Ethernet | 1 GbE integrated MAC |
| Security Features | Integrated Security Engine |
| Memory Controller | DDR1/DDR2 |
| Process Technology | 90 nm CMOS |
MPC8533VTARJA557 783-fcpbga (29x29 mm) 핀 구성 가이드
MPC8533VTARJA557(783-fcpbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8533VTARJA557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8533VTARJA557 적합 용도: 6 애플리케이션s: Managed Ethernet Switch, Edge Router / Multiservice Router, DSLAM Line Card, Wireless Base Station Controller, Industrial Control-Plane Module, Network-Attached Storage (NAS) Controller.
Managed Ethernet Switch
The MPC8533VTARJA557's integrated dual GbE MACs and PCI/PCIe interfaces make it a natural control-plane processor for managed Layer-2/Layer-3 Ethernet switches. Designers place the part alongside a switching ASIC, leveraging the e500v2 core to run the management stack (SNMP, LLDP, RSTP) while the ASIC handles wire-speed forwarding. The DDR2 controller supplies 2-4 GB of DRAM for routing tables and ACLs without an external memory controller, reducing BOM cost. Compared with discrete CPU-plus-GbE solutions, this SoC eliminates two chips and roughly 30% of PCB area, while the Security Engine accelerates MACsec and IPsec on uplink ports.
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Edge Router / Multiservice Router
In edge router designs the MPC8533VTARJA557 serves as the main CPU, running routing daemons (Quagga, FRR) and management plane while TDM or packet offload engines handle line-rate forwarding. The integrated DDR2 controller with ECC supports large BGP RIB tables, and the Security Engine accelerates IPsec tunnels for branch-office VPN aggregation. At 1.067 GHz the e500v2 delivers sufficient headroom for control-plane workloads in sub-1 Gbps platforms. The part's commercial temperature grade (0-90°C TJ) suits indoor telco closet environments, and the 783-ball FC-PBGA exposes all SerDes lanes needed for multi-WAN uplink cards.
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DSLAM Line Card
DSL access multiplexer (DSLAM) line cards pair the MPC8533VTARJA557 with a PHY/Framer ASIC to terminate hundreds of xDSL subscribers per shelf. The MPC8533VTARJA557 runs the ADSL/VDSL link management stack, traffic shaping, and per-subscriber QoS policies, while the 783-ball FC-PBGA exposes PCI/PCIe lanes to communicate with the line-card framer. The integrated DDR2 controller with ECC ensures reliable operation across thousands of subscriber sessions, and the Security Engine accelerates per-subscriber authentication. Compared with an x86 solution, the MPC8533VTARJA557 reduces idle power by approximately 50% in always-on line-card service.
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Wireless Base Station Controller
The MPC8533VTARJA557 is widely used in 2G/3G/4G base-station controllers and small-cell baseband units. The e500v2 core runs the radio resource management (RRM) and O&M software, while the integrated GbE MACs backhaul traffic over Ethernet or optical links. The DDR2 controller with ECC supports real-time baseband sample buffering, and the Security Engine handles authentication, key management, and IPsec backhaul encryption. Designers favor the part for its deterministic interrupt latency and proven NXP PowerQUICC software ecosystem. The commercial temperature grade is acceptable for indoor BTS deployments with controlled airflow.
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Industrial Control-Plane Module
For industrial control and SCADA systems, the MPC8533VTARJA557 provides deterministic real-time processing with the e500v2 core and integrated PCI/PCIe for connecting to FPGA-based I/O cards. The DDR2 controller with ECC ensures reliable operation in electrically noisy factory environments, while the GbE MACs enable deterministic Ethernet protocols such as EtherCAT or PROFINET when paired with an external PHY. Compared with general-purpose x86 SBCs, the MPC8533VTARJA557 offers predictable interrupt latency, long-term supply stability, and a path to functional safety certification via the MPC8533 safety manual. The 783-ball FC-PBGA supports industrial thermal ranges with proper heatsinking.
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Network-Attached Storage (NAS) Controller
In NAS appliances the MPC8533VTARJA557 acts as the storage controller CPU, running filesystem stacks (ext4, ZFS) and RAID management software. The integrated GbE MACs handle 1 GbE client connectivity, while PCI/PCIe connects to SATA/SAS controller ASICs for disk shelves. The DDR2 controller with ECC supports large page-cache sizes and journaling. Compared with ARM-based NAS SoCs of the same era, the MPC8533VTARJA557 delivers higher single-thread performance for metadata operations, at the cost of higher idle power. NXP's long-term Linux BSP and U-Boot port simplify custom firmware development.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8533VTARJA557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8533VTARJA | MPC8533EVTARJA | MPC8533VTANG | MPC8536VTARJA | MPC8544VTARJA |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Maximum Core Frequency | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.067 GHz |
| Core Voltage | 0.95 V - 1.05 V | 0.95 V - 1.05 V | 0.95 V - 1.05 V | 0.95 V - 1.05 V | 0.95 V - 1.05 V | 0.95 V - 1.05 V |
| Operating Temperature | 0°C to 90°C (TJ) | 0°C to 90°C (TJ) | 0°C to 90°C (TJ) | -40°C to 105°C (TJ) | 0°C to 90°C (TJ) | 0°C to 90°C (TJ) |
| Memory Controller | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Ethernet MACs | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Single GbE (reduced) |
| Security Engine | Integrated | Integrated | Integrated (enhanced) | Integrated | Integrated | Reduced |
| Unit Price (approx., qty 1) | $145 | $135 | $148 | $155 | $165 | $110 |
주요 차별점
- Integrated Security Engine for line-rate IPsec/MACsec (vs MPC8544VTARJA)
- Dual integrated GbE MACs vs single MAC in MPC8544 (vs MPC8544VTARJA)
- Broader peripheral set than cost-optimized MPC8544 (vs MPC8544VTARJA)
설계 노트
The 783-ball FC-PBGA at 1 mm pitch requires at least 4-6 PCB layers with dedicated power and ground planes, plus microvia-in-pad or HDI construction to fan out the inner-row balls. NXP's AN-2582 reference design recommends matched-length traces within ±25 mil for DDR2 address/command signals and within ±50 mil for DDR2 byte lanes to preserve timing margin. Decoupling requires 0402-size 100 nF caps within 2 mm of every VDD/VSS ball pair, plus bulk 22 uF ceramic and 220 uF polymer caps near the core supply pins. Estimated: the worst-case core current of approximately 8 A at 1.05 V draws ~8.4 W, so a 6-layer FR4 stack-up with 1 oz copper outer layers and 2 oz inner planes is the thermal/power minimum.
SerDes lanes (PCIe, RapidIO, SGMII) require 100 ohm differential impedance with intra-pair skew under 1 ps/mm, plus AC-coupling capacitors placed symmetrically and within 4 cm of the BGA ball. Reference the MPC8533 SerDes characterization report for eye-mask templates; the 5 Gbps SerDes variants are more sensitive to PCB stack-up than the 3.125 Gbps variants. For EMI control, place a common-mode choke on each differential pair near the connector side and a 0 ohm series resistor pad option for tuning. Keep SerDes traces away from clock and DDR regions to minimize crosstalk.
A common pitfall is confusing the 'MPC8533VTARJA' base part with the 'MPC8533VTARJA557' speed/revision identifier - both share the same datasheet but the '557' suffix encodes a specific CPU/SerDes bin. Designers should also verify that the firmware U-Boot device tree is built for the exact MPN, because Linux kernel boot logs fail silently on mis-binned parts. Another frequent mistake is under-budgeting the core bulk capacitors: the part can draw up to 8 A transient on VDD, so a single 22 uF bulk is insufficient; use at least three 22 uF ceramics plus a 220 uF polymer. Finally, do not assume the 'RJA' suffix implies lead-free - confirm via the shipping label.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status not present in the verified web data snapshot - flagged as [DATA_NEEDED] in the specs array. AEC-Q100 not applicable to networking MPU.