MPC8535BVTAKGA557 - PowerQUICC III e500 MPU, 600MHz, 783-FCPBGA
부품 번호: MPC8535BVTAKGA557 ✓ 활성MPC8535BVTAKGA557 개요
A PowerQUICC III processor is a PowerPC-based communications processor that traditionally combines a high-performance CPU core with a System-on-Chip peripheral set optimized for packet processing and bus mastering. Within the broader taxonomy, it sits under microprocessor -> MPU -> embedded processor -> SoC -> semiconductor. PowerQUICC III derivatives such as the MPC8535 specifically target cost-sensitive IP network equipment, balancing gigahertz-class compute with integrated GbE, PCI Express, SATA, USB, DDR2/DDR3 memory controllers, and SDHC peripherals for compact BOM designs.
Key specifications of the MPC8535BVTAKGA557 include a 32-bit PowerPC e500 core at up to 600 MHz, DDR2/DDR3 memory controller support, integrated GbE, SATA, USB, SDHC, and PCI/PCIe interfaces, and a 0 to 105 °C commercial operating temperature range. The non-E variant shown here does not include security acceleration, distinguishing it from the MPC8535E derivatives that add encryption engines; the trailing "BV" prefix marks the 600 MHz speed bin with the commercial temperature grade.
Architecturally, the MPC8535BVTAKGA557 uses a 32-bit PowerPC e500 core backed by L1 caches and an L2 cache controller, with the SoC peripherals routed through on-chip buses. This design delivers gigahertz-class complex application processing with exceptional feature integration and high-speed connectivity for IP networking and advanced media-handling tasks, while preserving software compatibility across the PowerQUICC III family for reuse of existing BSPs and reference designs.
Typical applications include wired networking routers, switches, and IP gateways; industrial control and factory automation controllers; secure (non-E) embedded compute modules; and telecom access equipment where integrated GbE, SATA, and DDR2/DDR3 support simplify board design. The wide peripheral mix also makes the device suitable for printer/imaging controllers and digital media adapters that benefit from PowerPC software ecosystems.
When designing with the MPC8535BVTAKGA557, engineers should pay attention to PCB power sequencing, DDR2/DDR3 signal-integrity routing (controlled-impedance, length-matched pairs), and proper thermal management of the 29x29 mm BGA; reference designs and validated BSPs are available from NXP/Freescale to reduce development time.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single engineering reference for sourcing and selection decisions.
드롭인 대체품: MPC8535BVTAKGA557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MPC8535BVTAKGA557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC III (MPC85xx) |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit |
| Core Frequency | 600 MHz |
| 패키지 | 783-FCPBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to +105 °C |
| Memory Controller | DDR2 / DDR3 |
| Peripheral Interfaces | GbE, SATA, USB, SDHC, PCI, PCIe |
| Security Engine (E variant) | Not included (non-E variant) |
| Speed Bin Marker | BV = 600 MHz commercial |
| RoHS 상태 | Compliant |
MPC8535BVTAKGA557 783-fcpbga (29x29 mm) 핀 구성 가이드
MPC8535BVTAKGA557(783-fcpbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8535BVTAKGA557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8535BVTAKGA557 적합 용도: 6 애플리케이션s: Wired Networking Routers, Industrial Control and Factory Automation, Telecom Access Equipment, Printer and Imaging Controllers, Embedded Compute Modules, Digital Media Adapters.
Wired Networking Routers
The MPC8535BVTAKGA557 fits wired router designs thanks to its 600 MHz PowerPC e500 core and integrated GbE, PCI Express, and DDR2/DDR3 controller. Routing table lookups, NAT, and QoS classifications run on the e500 core while packet DMA flows through the integrated GbE MACs, offloading work from the CPU. The non-E variant is sufficient for routers that handle encryption in software or offload it to a companion security chip.
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Industrial Control and Factory Automation
Factory automation controllers benefit from the MPC8535BVTAKGA557's 0 to +105 °C commercial temperature range, integrated DDR2/DDR3 controller with ECC for reliable memory operation, and PCIe/PCI for connecting to industrial I/O cards. The PowerPC e500 core runs deterministic control loops while the integrated GbE enables industrial Ethernet protocols. The mature PowerQUICC III software ecosystem provides long-term BSP support, which is critical for factory-floor deployments with multi-year lifecycles.
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Telecom Access Equipment
The MPC8535BVTAKGA557 is well suited for IP-DSLAM, GPON, and other telecom access platforms that require high-speed packet processing alongside legacy TDM-style interfaces. Its integrated GbE, SATA, and PCI/PCIe provide flexible backhaul options, while the DDR2/DDR3 controller handles high-bandwidth packet buffers. Designers can reuse PowerQUICC III BSPs across product generations, accelerating telecom OEM time-to-market.
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Printer and Imaging Controllers
The MPC8535BVTAKGA557's USB, SDHC, SATA, and GbE mix makes it a strong fit for networked multifunction printers and imaging controllers. The e500 core handles page-rendering pipelines while peripherals connect to scanner sensors, storage, and network uplinks. The PowerPC architecture supports legacy imaging software stacks, allowing OEMs to reuse proven printer firmware code on a single integrated SoC.
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Embedded Compute Modules
SOM (System-on-Module) makers value the MPC8535BVTAKGA557 for its integrated peripherals, which allow a single chip to expose GbE, SATA, USB, SDHC, and PCIe on a compact module. The 783-FCPBGA package concentrates routing density on the carrier board rather than requiring multiple companion ICs. PowerQUICC III BSP maturity also means SOM vendors can ship production-ready Linux and VxWorks images.
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Digital Media Adapters
Digital media adapters and set-top boxes leverage the MPC8535BVTAKGA557's SATA and GbE for streaming media from local storage or network sources. The 600 MHz e500 core decodes audio/video metadata and manages DRM (in the E variant) while the integrated DDR2/DDR3 controller provides low-latency memory for buffer management. Designers can build cost-effective media appliances with a single NXP SoC.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8535BVTAKGA557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8535BVTAKGA | MPC8535AVTAKGA | MPC8535EBVTANGA | MPC8536AVTAQGA | MPC8535BVTAKG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 600 MHz | 600 MHz | 800 MHz (+33%) | 800 MHz (+33%) | 800 MHz (+33%) | 600 MHz |
| Security Engine | Not included (non-E) | Not included (non-E) | Not included (non-E) | Included (E variant) | Not included (non-E) | Not included (non-E) |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | Extended temperature |
| DDR Memory Support | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 |
| Integrated GbE | Yes | Yes | Yes | Yes | Yes | Yes |
| Series | PowerQUICC III (MPC8535) | PowerQUICC III (MPC8535) | PowerQUICC III (MPC8535) | PowerQUICC III (MPC8535) | PowerQUICC III (MPC8536) | PowerQUICC III (MPC8535) |
주요 차별점
- Mature PowerQUICC III software ecosystem (vs Newer ARM-based SoCs)
- Highly integrated peripheral mix (vs Discrete solutions)
- Drop-in compatible speed-bin upgrades (vs MPC8535AVTAKGA (800 MHz))
설계 노트
Estimated: The 783-FCPBGA package requires 8+ layer PCB with controlled-impedance routing for DDR2/DDR3, PCIe, and GbE lanes. Use the NXP/Freescale reference design as a baseline; length-matched pairs and proper BGA fan-out are mandatory. Designers should allocate dedicated power planes and decoupling capacitors near each BGA quadrant to meet PowerQUICC III's switching current demands.
Estimated: At 600 MHz with all peripherals active, the MPC8535BVTAKGA557 dissipates several watts; the 29x29 mm FCPBGA package has a typical theta-JA in the 10-15 °C/W range when mounted on a 4-layer JEDEC test board. Ensure adequate airflow or heatsink attachment for closed enclosures. A thermal simulation is recommended for fanless industrial designs operating at the upper +105 °C limit.
DDR2/DDR3 memory routing must follow the NXP layout guidelines for the PowerQUICC III MPC8535, including matched trace lengths within the DDR timing budget. PCIe and SerDes traces should be routed on inner stripline layers with reference grounds on both sides. GbE and SATA differential pairs require 100 ohm differential impedance and length matching within the prescribed tolerance.
Do not confuse the non-E MPC8535 variant with the E (security) variant when sourcing. The MPC8535BVTAKGA557 lacks the hardware encryption engine, so security features must be implemented in software or offloaded to a companion chip. Also confirm the speed-bin marker ("BV" = 600 MHz, "AV" = 800 MHz) matches your thermal and power budget before PCB layout.
규정 준수 정보
RoHS and lead-free per NXP/Freescale product page. Not AEC-Q100 qualified - commercial temperature grade only.