MPC8536EAVTAQGA - PowerQUICC III 1GHz MPU, 783-FCBGA | NXP
부품 번호: MPC8536EAVTAQGA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $120.17 | $120.17 |
| 10 | $108.15 | $1,081.50 |
| 100 | $96.14 | $9,614.00 |
| 500 | $84.12 | $42,060.00 |
| 1,000 | $72.1 | $72,100.00 |
MPC8536EAVTAQGA 개요
A PowerQUICC III communications processor is a highly-integrated system-on-chip (SoC) that combines a PowerPC general-purpose processing core with hardware accelerators and a rich set of high-speed serial/parallel interfaces. Within the SoC taxonomy it sits under microprocessor (MPU) → embedded processor → communications processor → network/industrial SoC. PowerQUICC III parts such as the MPC8536E were designed for IP networking, line-card control, and advanced media processing where deterministic throughput and security offload matter more than raw CPU frequency.
Key features include a 1.0 GHz e500 core with 32-bit PowerPC architecture, integrated SEC block for cryptography, dual GbE controllers, DDR2/DDR3 memory controller with ECC, multi-protocol PCI Express and PCI interfaces, SATA, USB, and SDHC peripherals. The 783-FCBGA package provides the high pin density required for the parallel memory/IO buses plus multiple high-speed serial links. Operating temperature range is 0 °C to 90 °C (industrial temperature grade).
The MPC8536E uses a 32-bit superscalar e500 core backed by a multi-level cache hierarchy and a high-bandwidth internal fabric. The integrated SEC engine accelerates DES/3DES, AES, SHA, RSA, and ECC operations, freeing the core for control-plane or application logic. Memory and IO subsystems are managed by programmable controllers with parity/ECC support to meet telecom and industrial reliability targets.
Typical applications include IP network routers and switches, secure gateways, line cards, industrial control with security requirements, networked storage controllers, and advanced media processing appliances. The combination of GbE, PCIe, and a hardware crypto engine makes the MPC8536E particularly suited to control-plane and edge-security use cases.
When designing with this device, engineers must follow NXP's reference PCB layout guidelines for the 783-FCBGA, including controlled-impedance routing for the DDR2/DDR3 interface, matched-length pairs for GbE and PCIe, and a multi-layer stackup with solid power planes. Thermal design must keep the junction temperature within the 0 °C to 90 °C operating range using the package's specified theta-JA and theta-JC values.
This page synthesizes distributor inventory levels, lifecycle context, drop-in alternatives, and design considerations that are not consolidated in the manufacturer datasheet, giving procurement and engineering teams a single reference for the MPC8536EAVTAQGA.
드롭인 대체품: MPC8536EAVTAQGA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8536EAVTAQGA (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Core Architecture, Package, Ethernet, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8536EAVTAQG
✅ 드롭인✓ 재고 있음
$218.75 / 개
데이터시트 보기 →MPC8536AVTAQGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8536EAVTAKGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8535EAVTAQGA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8548EVTAUJB
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →MPC8536EAVTAQGA 최대 정격 & 전기적 특성
| Processor Type | PowerPC e500 (MPC85xx PowerQUICC III) |
| Core Architecture | 32-bit PowerPC |
| Number of Cores | 1 |
| Maximum CPU Clock | 1.0 GHz |
| Core Voltage | 1 V |
| Co-Processor / Security | SEC (Security Engine) |
| Memory Controller | DDR2, DDR3 |
| Ethernet | 10/100/1000 (Gigabit) MACs |
| PCI / PCIe | PCI and PCI Express |
| Storage Interfaces | SATA, SDHC |
| USB | Yes |
| 패키지 | 783-FCBGA (FC-PBGA), 29 mm × 29 mm |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | 0 °C to +90 °C |
| RoHS 상태 | Lead Free / RoHS compliant (per distributor listing) |
| Packaging | Tray |
| Lifecycle | Obsolete - last-time-buy sourcing recommended |
MPC8536EAVTAQGA 783-fcbga (fc-pbga), 29 mm × 29 mm 핀 구성 가이드
MPC8536EAVTAQGA(783-fcbga (fc-pbga), 29 mm × 29 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8536EAVTAQGA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8536EAVTAQGA 적합 용도: 6 애플리케이션s: IP Network Router / Switch Control Plane, Secure Gateway / VPN Appliance, Industrial Control with Security Requirements, Networked Storage Controller (NAS / iSCSI), Advanced Media Processing / Edge Appliance, Telecom Line Card / Base Station Controller.
IP Network Router / Switch Control Plane
The MPC8536EAVTAQGA's 1.0 GHz e500 core, dual GbE MACs, and PCI/PCIe expansion make it a strong fit for router and switch control-plane designs. Placed on the line card as the local supervisor, it runs the routing/management stack while offloading encryption to the integrated SEC engine for IPsec, MACsec, and control-plane authentication. The DDR2/DDR3 controller feeds the FIB and routing tables with low-latency access. Compared with discrete MCU+ASIC solutions, the integrated fabric cuts BOM count and PCB area. Power dissipation is dominated by the 1.0 GHz core and DDR I/O; estimate 5-8 W typical and budget a multilayer FR-4 stackup with solid GND pour under the 783-FCBGA to keep junction temperature within the 0-90 °C operating range.
추천
Secure Gateway / VPN Appliance
The integrated SEC engine accelerates AES, 3DES, SHA, and RSA operations, making the MPC8536EAVTAQGA a strong choice for secure gateway and VPN concentrator designs. The e500 core handles the control plane while SEC processes bulk crypto at line rate, freeing the CPU from per-packet encryption overhead. Gigabit Ethernet MACs terminate WAN/LAN links and the SATA port can host local log/audit storage. The 1 V core supply simplifies power tree design relative to multi-voltage MPUs. Estimated typical power dissipation at full GbE+IPsec load is 6-9 W; ensure the PCB has 1 oz copper inner planes for the FCBGA break-out region and follow NXP's reference layout for the DDR3 interface to avoid signal-integrity issues at 1.0 GHz core clock.
추천
Industrial Control with Security Requirements
Industrial controllers increasingly require authenticated firmware, encrypted telemetry, and signed command paths; the MPC8536EAVTAQGA's hardware SEC engine and GbE interfaces fit this profile. The DDR2/DDR3 controller supports ECC for reliable operation in electrically noisy industrial environments, and the 0-90 °C operating temperature range covers most cabinet installations. The part interfaces to field buses (PROFIBUS, CAN) through PCIe or PCI bridges and to local HMI displays via the SDHC/USB controllers. Compared with soft-core MCU implementations of cryptography, the SEC engine delivers 5-10x higher throughput at the same clock. Estimated power dissipation at typical industrial workloads is 4-6 W; ensure conformal coating or sealed enclosures for harsh environments and provide adequate heatsinking via PCB copper pour.
추천
Networked Storage Controller (NAS / iSCSI)
The combination of GbE, SATA, and PCI/PCIe on the MPC8536EAVTAQGA enables compact networked-attached storage and iSCSI target designs. The e500 core runs the storage stack (file system, RAID, iSCSI) while the SEC engine authenticates clients and encrypts volumes at rest. The DDR2/DDR3 controller provides the buffer cache, and the SDHC interface supports a recovery card for field service. Compared with ARM Cortex-A SoCs, both deliver similar Ethernet throughput but the PowerQUICC's deterministic interrupt latency is preferable for storage protocols. Estimated typical power dissipation is 5-7 W at full GbE+SATA throughput. Layout tip: route SATA traces with 90 Ω differential impedance and isolate them from the DDR3 bus to minimize crosstalk.
추천
Advanced Media Processing / Edge Appliance
The MPC8536EAVTAQGA's GbE, PCI/PCIe, USB, and SDHC mix supports edge devices that terminate network media and dispatch packets to co-processors (DSPs, codecs, FPGAs) over PCIe. The SEC engine authenticates media streams while the e500 core handles protocol framing and QoS. The DDR2/DDR3 controller is large enough for line-rate buffering of HD media streams. Power dissipation at typical edge workloads is 5-7 W. Compared with low-end Cortex-A SoCs, both deliver GbE throughput but the PowerQUICC's PCI/PCIe bandwidth and memory capacity headroom make it preferable for media-rich applications. Thermal design must keep the FCBGA below 90 °C junction using a minimum 6-layer stackup with dedicated GND planes.
추천
Telecom Line Card / Base Station Controller
The MPC8536EAVTAQGA's SEC engine, multi-protocol GbE/PCIe/PCI, and DDR2/DDR3 controller are well-matched to telecom line-card and small-cell base-station controller designs. The e500 core runs the OAM/SONET control stack while SEC handles authentication and key management. The SDHC port supports local logging, and the USB port simplifies field diagnostics. Power dissipation in typical line-card use is 4-6 W; ensure the chassis airflow keeps ambient below 70 °C to leave margin under peak load. Layout tip: maintain 90 Ω impedance on GbE and PCIe pairs, use length matching within 150 mil, and provide a continuous reference plane under the 783-FCBGA.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8536EAVTAQGA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8536EAVTAQG | MPC8536AVTAQGA | MPC8536EAVTAKGA | MPC8535EAVTAQGA | MPC8548EVTAUJB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500, 32-bit | PowerPC e500, 32-bit | PowerPC e500, 32-bit | PowerPC e500, 32-bit | PowerPC e500, 32-bit |
| Security Engine (SEC) | Yes | Yes | No (non-E suffix) | Yes | Yes | Yes |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 |
| Lifecycle | Obsolete (last-time-buy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Integrated SEC hardware crypto engine (vs MPC8536AVTAQGA)
- Direct compatibility with -G and -KGA speed/temperature bins (vs MPC8536EAVTAKGA)
- Lower L2 cache than MPC8535E predecessor (vs MPC8535EAVTAQGA)
- Mid-range peripheral mix vs higher-end MPC8548E (vs MPC8548EVTAUJB)
설계 노트
The 783-FCBGA (29×29 mm) demands a high-density PCB stackup. Recommended: 8-layer FR-4 with 1 oz copper outer / 0.5 oz inner, dedicated GND plane layer 2, and dedicated 1.0 V core power plane adjacent to the GND plane. Use 0.08 mm via-in-pad with filled-and-capped vias under the die shadow. Escape routing must follow NXP's BGA break-out guidelines; dog-bone fan-out is acceptable for inner rows. Maintain 90 Ω differential impedance for GbE pairs and 85 Ω for PCIe. Reference: NXP application note AN3944 and the MPC8535EEC hardware specifications document.
Estimated: at typical workload (1.0 GHz core active, dual GbE, DDR3 traffic) the MPC8536EAVTAQGA dissipates approximately 5-7 W. The 783-FCBGA exposes a thermal pad; ensure at least 6 thermal vias (0.3 mm drill, 1.0 mm pitch) under the die connect to the inner GND plane. With theta-JA around 15-20 °C/W on a 6-layer board, junction temperature rise is approximately 75-140 °C above ambient. Provide chassis airflow or a heatsink to keep Tj below 90 °C under worst-case ambient of 55 °C. Verify with a thermal probe or simulation before locking the mechanical design.
The DDR2/DDR3 interface runs at 400-533 MT/s and is the most critical signal-integrity challenge. Match DQ/DQS lengths within 25 mil, route address/command on a separate layer with 50 Ω single-ended impedance, and place the DDR termination VTT regulator within 1 inch of the memory. Use IBIS simulation (NXP publishes IBIS models) to validate eye margins at the SDRAM balls. For GbE, route the MII/RGMII traces on an inner stripline layer with continuous reference to GND and length-match within 50 mil. PCIe pairs require AC coupling capacitors at the TX side per the PCI-SIG spec.
Because the MPC8536EAVTAQGA is Obsolete, counterfeit risk is high. Always source from Rochester Electronics (NXP-franchised legacy partner) or distributors with strict traceability. Verify date code, lot trace, and ESD/handling labels on receipt. Do not substitute the MPC8536AVTAQGA in designs that depend on the SEC engine - the 'E' suffix is critical. Confirm the -Q temperature bin code matches your environmental spec; the -K and -Q suffixes denote different speed/temperature grades. Finally, ensure your U-Boot / board support package matches the silicon revision - errata differ between Rev 1.0 and Rev 2.0.
The 1.0 V core rail can draw 4-6 A transient during core frequency transitions; use a buck regulator with at least 8 A rating and 1% set-point accuracy (e.g., TPS54620). Add 4× 22 µF ceramic + 1× 470 µF bulk on the BGA side of the regulator. DDR termination VTT requires its own 1.5 A linear or buck regulator. Sequence the rails per NXP's POR (Power-On Reset) sequence: 3.3 V first, then 1.5 V DDR, then 1.0 V core; hold RESET until all rails are stable. Use the NXP-recommended supervisor (e.g., TPS3808) to assert reset.
규정 준수 정보
RoHS / lead-free per NXP product brief and DigiKey catalog. Not AEC-Q100 qualified (industrial / commercial MPU, not automotive). Halogen-free status not explicitly stated in verified data; treat as unknown.
