MPC8560VT833LB - 833MHz PowerQUICC III MPU | Freescale/NXP | BGA-783
부품 번호: MPC8560VT833LB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $235 | $23,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
MPC8560VT833LB 개요
A microprocessor (MPU) is an integrated circuit containing a complete central processing unit (CPU) and core peripherals fabricated on a single die, typically paired with external memory and I/O devices. Within the broader semiconductor taxonomy, MPUs sit under microcontrollers and microprocessors (Embedded - Microprocessors), then logic ICs, and finally integrated circuits. The PowerQUICC III MPC85xx family is positioned for high-end industrial, telecom, and networking systems where deterministic CPU performance, integrated peripheral control, and an extended temperature range are required. The MPC8560VT833LB operates from 2.5V/3.3V rails and is supplied in a Tray packaging format suited for volume production.
Key features include the PowerPC e500 core running at 833 MHz, 32-bit instruction set support, a 783-ball FCBGA (flip-chip plastic BGA) thermal package compatible with high-density surface-mount assembly, and integration of the QUICC Engine for protocol acceleration in networking environments. The 29x29 mm body footprint delivers the I/O density needed for the address, data, and peripheral buses required for routing and switching equipment. The combination of high CPU frequency and integrated packet-handling peripherals is the primary reason this MPU is widely deployed in long-life industrial platforms.
The architecture follows PowerPC e500 RISC principles with deep pipeline stages and hardware multiply-accumulate support, paired with the unified peripheral bus structure characteristic of the MPC85xx family. The 783-pin FCPBGA exposes the full memory controller I/O, local bus, PCI/PCI-X, Ethernet, and QUICC Engine multiplexed interfaces required by networking equipment, while the 2.5V/3.3V power supply supports typical industrial board designs. The device is rated over commercial operating temperatures suitable for controlled-environment enclosures.
Typical applications include enterprise routers and switches, DSLAM and access multiplexers, industrial control and factory automation controllers, and long-life military and aerospace communication platforms. The MPC8560VT833LB is also used in legacy telecom base stations where the PowerQUICC III architecture offers protocol-offload efficiency alongside CPU horsepower for control-plane workloads.
When designing with this part, plan thermal dissipation through the FCPBGA package, provide generous via-stitched ground returns for high-speed interfaces, and verify that the BIOS / firmware / RTOS toolchain supports the e500 core. Memory timing must be matched to datasheet-supported DIMM and SDRAM configurations to prevent intermittent faults.
This page synthesizes distributor availability, same-family replacements, and practical hardware notes for the MPC8560VT833LB that complement the Freescale / NXP datasheet.
드롭인 대체품: MPC8560VT833LB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8560VT833LB (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Number of Cores, Package, Part Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8560VT833LC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8560VT833VG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8541EPXAPF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548EVTAUJB
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →MPC8536CVJAULA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8560VT833LB 최대 정격 & 전기적 특성
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Core Speed | 833 MHz |
| Series | MPC85xx |
| Product Family | PowerQUICC III |
| Instruction Set Architecture | RISC (PowerPC) |
| 공급 전압 | 2.5 V / 3.3 V |
| 패키지 | 783-FCPBGA (29x29 mm) |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Packaging Format | Tray |
| Peripheral Integration | QUICC Engine, memory controller, local bus, Ethernet, PCI/PCI-X |
| Part Status | Obsolete / End of Life (per Rochester listing) |
MPC8560VT833LB 783-fcpbga (29x29 mm) 핀 구성 가이드
MPC8560VT833LB(783-fcpbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8560VT833LB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8560VT833LB 적합 용도: 6 애플리케이션s: Enterprise Routers and Switches, DSLAM and Access Multiplexers, Industrial Automation Controllers, Telecom Base Station Controllers, Military and Aerospace Communication Platforms, Edge and Aggregation Networking.
Enterprise Routers and Switches
The MPC8560VT833LB's 833 MHz PowerPC e500 core plus the integrated QUICC Engine directly maps to enterprise router and multi-layer switch workloads. With 32-bit RISC performance and hardware-assisted packet classification, this MPU can sustain control-plane throughput without CPU saturation, even at full line rate on Gigabit Ethernet uplinks. Placed on the control board with external DDR memory and PHY interfaces, it offers deterministic latency under load, while the 783-FCPBGA (29x29) footprint provides the I/O density required for memory, PCI, and Ethernet buses. Unlike general-purpose MPUs, it consolidates serialization and protocol offload in one BGA, shrinking router BOM.
추천
DSLAM and Access Multiplexers
DSLAM (Digital Subscriber Line Access Multiplexer) line cards aggregate traffic from many subscribers into a high-speed uplink. The MPC8560VT833LB at 833 MHz can process the cell/packet pipeline while the QUICC Engine handles ATM, PPP, and Ethernet protocols in parallel, offloading the CPU. The 2.5V/3.3V supply matches typical DSLAM rack design power rails. With a 783-FCPBGA footprint, designers gain enough I/O for TDM/UTOPIA interfaces, peripheral buses, and external addressing, making it well suited to long-life multi-line aggregation hardware. The result is lower BOM cost than a CPU+ASIC split architecture.
추천
Industrial Automation Controllers
Industrial controllers require deterministic real-time execution alongside long product lifecycles. The MPC8560VT833LB's 32-bit PowerPC e500 architecture, paired with the integrated local bus and PCI/PCI-X peripherals, directly supports deterministic industrial fieldbus interfaces (PROFIBUS, EtherCAT gateways) and machine control loop execution. The 783-FCPBGA (29x29 mm) package suits enclosed industrial enclosures with substantial PCB area. Its extended-temperature silicon and legacy firmware support make it a workhorse for long-life industrial automation systems where re-qualification cost dominates new design budgets.
추천
Telecom Base Station Controllers
Telecom base-station control-plane processing benefits from the MPC8560VT833LB's 833 MHz PowerPC e500 core alongside the QUICC Engine for HDLC, PCM, and channelized TDM aggregation. The MPU serves as the central controller managing Layer 2/3 transport, framer handshaking, and backhaul links. Operating from 2.5V/3.3V rails, it integrates cleanly into existing telecom backplanes designed for PowerQUICC III. The 783-FCPBGA footprint simplifies board layout, replacing legacy multi-ASIC designs with a single die that consolidates serial logic, MAC, and host CPU.
추천
Military and Aerospace Communication Platforms
Military communications platforms demand deterministic, long-life embedded processing with extensive peripheral integration. The MPC8560VT833LB, with its PowerPC e500 RISC core and QUICC Engine, supports mission-specific protocols, encryption engines, and rugged Ethernet routing on a single chip. The 783-FCPBGA (29x29) package's high I/O count accommodates multiple redundant Ethernet, serial, and memory channels needed for fault-tolerant architectures. The legacy firmware ecosystem, with full BSP and RTOS support from VxWorks and Linux, reduces the cost of long-term support for defense programs. Pin-to-pin variants like MPC8560VT833LC ease obsolescence management.
추천
Edge and Aggregation Networking
Edge and aggregation networking boxes combine routing, firewalling, and Quality-of-Service at the network boundary. The MPC8560VT833LB provides the CPU horsepower for control-plane routing daemons, with the integrated QUICC Engine for hardware-based protocol handling (IPSec, L2TP, PPPoE). Placed on an aggregation board with multiple Gigabit Ethernet ports, the 783-FCPBGA (29x29 mm) package's footprint allows dense routing of memory and I/O buses. Compared to NPU+ASIC split designs, single-MPU integration reduces part count, BOM cost, and points-of-failure, simplifying long-term reliability planning.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8560VT833LB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8560VT833LC | MPC8560VT833VG | MPC8541EPXAPF | MPC8548EVTAUJB | MPC8536CVJAULA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA - same family footprint | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA - same family |
| Core Architecture | PowerPC e500, 32-bit RISC | PowerPC e500, 32-bit RISC | PowerPC e500, 32-bit RISC | PowerPC e500, 32-bit RISC | PowerPC e500, 32-bit RISC | PowerPC e500, 32-bit RISC |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Peripheral Integration | QUICC Engine, Ethernet, PCI/PCI-X, local bus | Same peripheral set | Same peripheral set | Reduced - no QUICC Engine | Enhanced peripherals vs MPC8560 | Different peripheral map |
| Part Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete | Obsolete |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tray |
주요 차별점
- Highest-tier 833 MHz MPC8560 within the PowerQUICC III family (vs MPC8560VT833VG)
- Full QUICC Engine peripheral set (vs MPC8541EPXAPF)
- Wide ecosystem and second-source availability via sibling parts (vs Cross-brand NPU)
설계 노트
The 783-FCPBGA (29x29 mm) package requires careful thermal management: FCPBGA exposes the silicon die directly to the PCB through an array of solder balls, so thermal dissipation depends on PCB copper area and via stitching under the package. For continuous full-clock operation at 833 MHz, follow NXP's reference layout guidelines for ground-return vias and power-plane stitching. In fanless enclosures, derate system clock or use a heatsink rated for 5-8 W BGA thermal loads. Use the package's junction-to-ambient thermal metrics to size PCB copper rather than relying on datasheet junction-to-case figures.
Use controlled-impedance routing for the memory bus (DDR/DDR2 traces matched to within 50-100 mil) and isolate the high-speed Ethernet SERDES lanes from slower control signals on the PCB. The 29x29 mm BGA footprint with 1.0 mm or finer ball pitch requires HDI PCB stackups with microvias and tight length-matching on the bus. Add ground-via stitching every 3 mm around the BGA perimeter and route differential pairs with reference planes. Use 8+ layer PCB stackups for production, and plan escape routing assuming 2 or 3 rows per signal layer as for high-density BGA.
Common pitfalls with this MPU include: (1) using JEDEC-standard DDR DIMMs that are not in the validated memory matrix - the MPC8560 supports a specific subset of DDR/DDR2 timing modes and non-validated modules can cause intermittent faults; (2) failing to update boot ROM and U-Boot / VxWorks BSP after silicon revision changes - the LC and VG suffixes indicate silicon rev or feature differences; (3) attempting drop-in replacement between MPC8560 and MPC8541E without verifying the QUICC Engine peripheral mapping - MPC8541E lacks the QUICC Engine so firmware must be revalidated. Always consult the latest NXP errata before production release.
Design the 2.5 V / 3.3 V power rails with bulk input capacitors close to the BGA and a low-impedance power-plane distribution. Estimated: at full load (1 GHz near the e500 pipe) the MPU core may consume around 5-10 W; use a switching regulator with at least 1.2x current margin for transient bursts. Decouple each voltage rail with 10uF ceramic + 0.1uF + 10nF capacitors placed within 5 mm of the BGA supply balls. Verify voltage ripple stays below 50 mV pp under peak CPU load to avoid core reset risk.
규정 준수 정보
RoHS, REACH, lead-free, and conflict-minerals data were not present in the verified web snippets. The device is End-of-Life and primarily procured through authorized/aftermarket distributors for sustaining legacy platforms.