MPC860SRZQ66D4 - PowerQUICC MPC8xx MPU 66MHz 357-BGA | NXP
부품 번호: MPC860SRZQ66D4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $160.41 | $160.41 |
| 10 | $152.39 | $1,523.90 |
| 100 | $144.37 | $14,437.00 |
| 500 | $136.35 | $68,175.00 |
| 1,000 | $128.33 | $128,330.00 |
MPC860SRZQ66D4 개요
An MPU (Microprocessor Unit) is the central processing engine of an embedded system; the PowerQUICC family specifically integrates a 32-bit PowerPC core with a versatile peripheral set, classifying it as a microprocessor -> embedded processor -> communications processor -> PowerQUICC. The 32-bit data path and integrated CPM (Communications Processor Module) make this class of device a system-on-chip-style building block for routers, bridges, and remote-access equipment.
Key features include a single 32-bit PowerPC core, an integrated CPM for serial communications, a 66 MHz internal/core frequency, 3.3 V core I/O supply, 357-ball PBGA package, and the legacy PowerQUICC peripheral complement including SCC/SMC serial channels, timers, and memory controllers. The 'SR' suffix indicates the specific configuration of memory, peripheral enablement, and operating-mode options available within the MPC860 family.
Architecturally, the MPC860SRZQ66D4 is implemented in a 0.32 um CMOS process and pairs an integer PowerPC execution pipeline with a dedicated RISC communications engine (the CPM), allowing protocol processing to offload the main core. This dual-engine design was a hallmark of PowerQUICC and the reason the family dominated early-to-mid 2000s telecom infrastructure designs.
Typical applications include telecom and networking line cards, T1/E1 and ISDN interface controllers, industrial serial bridging, and legacy router or hub platforms. The 357-PBGA footprint and 3.3 V supply allow direct placement into existing PowerQUICC reference designs without PCB rework.
When designing with this device, ensure the host PCB provides the 357-ball PBGA land pattern specified by the manufacturer and that adequate thermal relief is provided for the 25x25 mm substrate. Plan for external SDRAM and flash as the on-chip RAM is limited; consult the PowerQUICC family reference manual for memory-map and CPM configuration details.
This page synthesizes distributor stock signals, datasheet specifications, and drop-in MPC860 family alternatives that share the 357-PBGA footprint, providing information not consolidated in any single distributor listing.
드롭인 대체품: MPC860SRZQ66D4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC860SRZQ66D4 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, RoHS Status, Operating Temperature, Package / Case, Processor Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC860ENZQ66D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860TZQ66D4
✅ 드롭인✓ 재고 있음
$81.28 / 개
데이터시트 보기 →MPC860ENVR66D4
✅ 드롭인✓ 재고 있음
$48.85 / 개
데이터시트 보기 →MPC860SRCZQ66D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860TVR66D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860SRZQ66D4 최대 정격 & 전기적 특성
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core | PowerPC, 1 Core |
| Core Speed | 66 MHz |
| 데이터 버스 폭 | 32-Bit |
| Operating Voltage | 3.3 V |
| 패키지 / 케이스 | 357-BBGA (PBGA 25x25 mm) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 상태 | RoHS |
| 실장 유형 | Surface Mount |
| Process Technology | 0.32 um CMOS |
| Family | PowerQUICC |
| 핀 수 | 357 |
| On-chip Peripherals | CPM (SCC/SMC), Timers, Memory Controller |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
MPC860SRZQ66D4 357-bbga (pbga 25x25 mm) 핀 구성 가이드
MPC860SRZQ66D4(357-bbga (pbga 25x25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC860SRZQ66D4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC860SRZQ66D4 적합 용도: 6 애플리케이션s: Telecom Line Cards, T1/E1 and ISDN Interface Controllers, Legacy Router and Hub Platforms, Industrial Serial Bridging, Remote Access and VPN Equipment, Embedded Control with Multi-Channel Serial.
Telecom Line Cards
The MPC860SRZQ66D4's integrated CPM (Communications Processor Module) and 32-bit PowerPC core make it a drop-in engine for telecom line card designs. The 66 MHz core provides sufficient host throughput for system management, while the CPM offloads multi-channel serial protocol processing (HDLC, UART, transparent). The 357-PBGA 25x25 mm package fits standard line-card PCB footprints, and the 3.3 V supply aligns with legacy telecom power rails. Designers benefit from deterministic serial handling without consuming host CPU cycles, and the part's industrial temperature rating supports CO (Central Office) deployments. Unlike newer SoCs, the MPC860SRZQ66D4 requires an external SDRAM and flash, allowing designers to right-size memory for each line card variant without re-qualifying the processor.
추천
T1/E1 and ISDN Interface Controllers
T1/E1 and ISDN PRI interface controllers rely on the MPC860SRZQ66D4's SCC (Serial Communications Controller) channels and time-slot assigner within the CPM. At 66 MHz, the core can sustain host-side call control and signaling while the CPM handles the bit-level framing, robbing-bit handling, and HDLC encapsulation. The 357-PBGA footprint allows the processor to sit adjacent to T1/E1 framer ICs on the same PCB, minimizing trace length on critical serial lines. Engineers select this part for proven interoperability with legacy PBX and channel-bank equipment. The 3.3 V supply matches typical framer/line-interface power domains, simplifying power-tree design.
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Legacy Router and Hub Platforms
The MPC860SRZQ66D4 is a proven host CPU for legacy router, hub, and remote-access platforms that require multi-channel serial aggregation. The 66 MHz PowerPC core runs routing/bridging stacks, while the CPM terminates WAN-side serial links. The 357-PBGA 25x25 mm package provides the high pin count needed for the parallel SDRAM/Flash bus plus CPM channel I/O. Designers continue to specify this part for sustaining legacy field-deployed units because of its established firmware ecosystem (VxWorks, pSOS, Linux PPC). For new designs, engineers should evaluate MPC860ENZQ66D4 or MPC860TZQ66D4 as drop-in alternates with updated PCN status.
추천
Industrial Serial Bridging
Industrial serial-bridging applications use the MPC860SRZQ66D4 to convert between legacy RS-232/RS-485, HDLC, and Ethernet interfaces in factory automation and SCADA equipment. The CPM's multiple SCC/SMC channels handle the heterogeneous serial mix, while the PowerPC core runs the bridging/encapsulation logic. The industrial operating temperature range and 357-PBGA robust package suit factory-floor environments. At 66 MHz, the core provides comfortable headroom for protocol translation stacks. The part's long lifecycle in industrial design-in means many platforms continue to specify it despite EOL status, relying on distributor residual stock and authorized long-term suppliers like Rochester Electronics.
추천
Remote Access and VPN Equipment
Remote access concentrators and VPN equipment in the early-to-mid 2000s were built around the MPC860SRZQ66D4, leveraging its CPM to terminate multiple WAN-side serial channels while the PowerPC core ran encryption and tunneling stacks. The 66 MHz core provides adequate headroom for software-based encryption of aggregated T1/E1 links. The 357-PBGA package supports the wide external memory bus required for crypto buffers and routing tables. Engineers value this part for its deterministic interrupt response and stable firmware ecosystem. For new deployments, the MPC860ENZQ66D4 or MPC860TZQ66D4 should be evaluated as drop-in alternates sharing the same 357-ball footprint.
추천
Embedded Control with Multi-Channel Serial
Beyond telecom, the MPC860SRZQ66D4 serves any embedded control application that needs a 32-bit host CPU paired with multi-channel serial I/O: medical instrumentation front-ends, military communications gear, and avionics databus interfaces. The CPM's flexible channel routing lets designers map SCCs to MIL-STD-1553, ARINC 429, or proprietary serial protocols. At 66 MHz the host CPU runs application logic while the CPM handles bit-level protocol work in hardware. The 357-PBGA 25x25 mm footprint and 3.3 V supply are standard for industrial/mil-grade hardware platforms. Designers continue to specify this part where field-proven reliability outweighs the appeal of newer ARM-based MCUs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC860SRZQ66D4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC860ENZQ66D4 | MPC860TZQ66D4 | MPC860ENVR66D4 | MPC860SRCZQ66D4 | MPC860TVR66D4 |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Data Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Family Suffix | SR | EN | T | ENVR | SRC | TVR |
| Core Architecture | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS |
주요 차별점
- CPM single-architecture and same-package reuse (vs MPC860ENZQ66D4)
- Industrial temperature grade in same package (vs MPC860ENVR66D4)
- Field-proven PowerQUICC firmware ecosystem (vs Generic 32-bit MCU alternatives)
설계 노트
The MPC860SRZQ66D4's 357-ball PBGA 25x25 mm substrate provides a large thermal mass, but designers should still follow the manufacturer's thermal management guidelines in the PowerQUICC hardware specifications document. For continuous 66 MHz operation with active CPM channels, provide a ground plane directly beneath the BGA and thermal vias through the PCB core. In enclosed housings without airflow, monitor junction temperature via the on-chip thermal sensor and derate CPM channel count if temperatures approach limits.
Implement the 357-ball PBGA land pattern exactly as specified in the manufacturer datasheet. Use NSMD (non-solder mask defined) pads with a 0.5 mm pitch and via-in-pad or dog-bone fanout as recommended. Place external SDRAM as close as possible to the data/address bus balls to minimize stub lengths, and route CPM serial channel traces with controlled impedance. Decoupling must include bulk 3.3 V caps near the supply balls plus 0.1 uF high-frequency caps at each supply pin group.
Do not assume all MPC860 357-PBGA SKUs are firmware-identical. The 'SR' vs 'EN' vs 'T' suffixes denote different peripheral enablement, memory-map configurations, and CPM channel routing. Engineers porting firmware between SKUs must re-validate the PowerPC reset configuration words and CPM parameter RAM layouts. Additionally, the part is EOL per the NXP product page, so new designs should not select MPC860SRZQ66D4; instead use MPC860ENZQ66D4 or MPC860TZQ66D4 if a drop-in replacement is needed for new builds.
규정 준수 정보
Digchip listing indicates 'Lead Free Status: Contains Lead' and 'RoHS Status: RoHS'. The 'Contains Lead' designation reflects legacy BGA ball finish. RoHS, REACH, halogen-free, and conflict-minerals compliance not explicitly confirmed in verified data.
