MPC875CZT133 - PowerQUICC 32-Bit MPU, 133MHz, 256-BGA | NXP
부품 번호: MPC875CZT133 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $65.4 | $6,540.00 |
| 500 | $59.2 | $29,600.00 |
| 1,000 | $54.8 | $54,800.00 |
MPC875CZT133 개요
A PowerQUICC processor is a family of integrated communications processors that combine a Power Architecture CPU core with system peripherals and communication engines on a single die. In the broader taxonomy, the MPC875 sits within the Microprocessor Unit (MPU) category, itself a subset of microcontrollers and processing ICs used for embedded control and networking. PowerQUICC architecture is widely used in networking equipment where on-chip Ethernet, ATM, and serial controllers replace external PHY and glue logic, reducing BOM cost and PCB area.
Key features of the MPC875CZT133 include a 32-bit PowerPC core running at 133 MHz, an integrated communications processor module (CPM) for protocol acceleration, dual 10/100 Ethernet MACs, peripheral interfaces including UART, SPI, I2C, and a memory controller supporting SDRAM and Flash. The device is manufactured in a 0.18 micron CMOS process and supports an industrial operating temperature range from -40C to +100C, enabling deployment in thermally constrained networking line cards.
Typical application areas include telecom line cards, Ethernet switches and routers, industrial control gateways, and embedded serial backplane designs where deterministic comms offload is more valuable than raw CPU frequency. The integrated CPM handles HDLC, ATM, and Ethernet bridging independently of the CPU, freeing the core for application and management tasks.
When designing with this part, ensure proper power decoupling and signal integrity on the BGA substrate, and plan for thermal dissipation in enclosed enclosures. NXP recommends JTAG boundary scan and a buffered reset supervisor for production-grade boards.
This page synthesizes distributor pricing, drop-in alternatives from the same PowerQUICC family, lifecycle notes (EOL announced by NXP), and practical design considerations not found in the manufacturer datasheet alone.
드롭인 대체품: MPC875CZT133 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC875CZT133 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Manufacturer, Operating Temperature, Core Architecture, Core Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC875CZT166
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC875CVR133
✅ 드롭인✓ 재고 있음
$43.75 / 개
데이터시트 보기 →MPC870CZT133
✅ 드롭인✓ 재고 있음
$71 / 개
데이터시트 보기 →MPC852TCVR50A
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →MPC852TVR100A
✅ 드롭인✓ 재고 있음
$21.1 / 개
데이터시트 보기 →MPC875CZT133 최대 정격 & 전기적 특성
| Core Architecture | Power Architecture (PowerPC) 32-bit |
| Core Frequency | 133 MHz |
| Family | MPC8xx PowerQUICC |
| Processor Type | MPC8xx Communications Processor |
| 공급 전압 | 3.3 V |
| 동작 온도 | -40 C to +100 C |
| 패키지 | 256-Pin BGA (23x23 mm) |
| Process Technology | 0.18 micron CMOS |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 상태 | RoHS non-compliant (contains lead) |
| Ethernet MACs | Dual 10/100 (per datasheet) |
| System Core | Power Architecture technology |
MPC875CZT133 256-pin bga (23x23 mm) 핀 구성 가이드
MPC875CZT133(256-pin bga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC875CZT133.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC875CZT133 적합 용도: 6 애플리케이션s: Telecom Line Cards, Industrial Ethernet Gateways, Routers and Access Concentrators, Embedded Communication Controllers, Printer and Imaging Controllers, Avionics and Defense Subsystems.
Telecom Line Cards
The MPC875CZT133 fits telecom line card designs that require deterministic multi-channel serial connectivity. Its integrated CPM offloads HDLC and PPP framing at wire speed, freeing the 133 MHz PowerPC core for service-layer processing and OAM tasks. The dual 10/100 Ethernet MACs support direct connection to PHY transceivers for backhaul or aggregation ports. The 256-BGA's 23x23 mm footprint is well-suited to standard line card form factors (AdvancedTCA, compactPCI), where board real estate is at a premium. Power consumption is bounded by the 3.3V single-rail design, simplifying PSU design and reducing BOM cost. Compared with general-purpose MPU alternatives, the MPC875CZT133's hardware protocol acceleration eliminates the need for an external framer or TCAM, reducing overall system cost and latency. The -40C to +100C industrial range covers carrier-grade indoor environments comfortably.
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Industrial Ethernet Gateways
The MPC875CZT133 suits industrial Ethernet gateway designs that bridge fieldbus networks to enterprise IT infrastructure. Its serial peripherals (UART, SPI, I2C) connect directly to industrial sensors and motor controllers, while the dual Ethernet MACs provide redundant LAN connectivity for ring or daisy-chain topologies. The Power Architecture core executes Modbus TCP, EtherNet/IP, or PROFINET stacks deterministically at 133 MHz, and the CPM handles the lower-layer MAC bridging without consuming CPU cycles. Operating temperature of -40C to +100C covers factory floor cabinets near motors and process equipment. The leaded PBGA package issue can be worked around with conformal coating for harsh industrial environments. Engineers migrating to newer designs should evaluate PowerQUICC II successors for better toolchain support and RoHS compliance.
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Routers and Access Concentrators
The MPC875CZT133 targets small-to-medium enterprise router and access concentrator platforms that benefit from integrated Ethernet and serial connectivity. The integrated CPM handles packet classification, forwarding, and shaping at line rate, allowing the 133 MHz core to focus on routing protocol processing (OSPF, BGP, RIP), firewalling, and management plane software. The 256-BGA package supports the high pin count needed for multiple external PHY interfaces and SDRAM expansion typical of branch-office routers. Power dissipation is moderate at the 133 MHz / 3.3V operating point and is manageable with passive copper cooling on standard router enclosures. Drop-in migration to the MPC875CZT166 (166 MHz) is supported for higher-throughput SKUs within the same PCB layout.
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Embedded Communication Controllers
The MPC875CZT133 is well matched to embedded communications controllers used in SCADA systems, building automation, and remote telemetry units (RTUs). Its CPM offloads protocol framing (DNP3, IEC 60870-5, Modbus), enabling deterministic response times that are critical for utility and transportation automation. The dual Ethernet MACs support redundant IP links, while serial interfaces connect to legacy field devices. Operating from a single 3.3V rail simplifies power tree design for solar-powered or battery-backed remote deployments. The Power Architecture toolchain (gcc PowerPC, CodeWarrior, Green Hills) is mature and well-documented, easing long-term software maintenance. For new designs NXP recommends migration to PowerQUICC II/III but the MPC875CZT133 remains a cost-effective option for maintenance and refurbishment programs.
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Printer and Imaging Controllers
The MPC875CZT133 historically served high-end networked printer and multifunction device controllers where deterministic I/O and integrated Ethernet were valued. The dual Ethernet MACs enable printer sharing across departments, while parallel and serial interfaces connect to scanner, finisher, and engine subsystems. The CPM handles pre-processing of PDL (page description language) data and rasterization offload, freeing the 133 MHz PowerPC core for higher-level job control and user interface logic. Operating temperature of -40C to +100C covers typical office equipment thermal envelopes. Drop-in upgrade to MPC875CZT166 is supported for higher-page-per-minute SKUs without PCB rework.
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Avionics and Defense Subsystems
The MPC875CZT133's extended temperature range and Power Architecture core make it suitable for avionics databus and defense subsystem controllers. The integrated serial controllers map directly to MIL-STD-1553 and ARINC 429 interfaces via external transceivers, and the CPM handles deterministic databus traffic. The 133 MHz core runs real-time OS kernels (VxWorks, LynxOS, INTEGRITY) commonly used in defense applications. The 256-BGA package has a track record in aerospace board designs. Note that defense applications often require long-term availability commitments that the EOL status of the MPC875CZT133 does not support; new defense designs should consult NXP's last-time-buy and obsolescence management program.
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추천 제품 요약
엔지니어링 참조 데이터: MPC875CZT133 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC875CZT166 | MPC875CVR133 | MPC870CZT133 | MPC852TCVR50A | MPC852TVR100A |
|---|---|---|---|---|---|---|
| Package | 256-Pin BGA (23x23 mm) | 256-Pin BGA (23x23 mm) - same | 256-Pin BGA (VR suffix) - same | 256-Pin BGA (23x23 mm) - same | 256-Pin BGA - same family | 256-Pin BGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 133 MHz | 166 MHz (+25%) | 133 MHz (same) | 133 MHz (same) | 50 MHz (-62%) | 100 MHz (-25%) |
| Architecture | Power Architecture (PowerPC) 32-bit | Power Architecture | Power Architecture | Power Architecture | Power Architecture | Power Architecture |
| Family | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.7 V / 3.3 V (mixed) | 1.7 V / 3.3 V (mixed) |
| Lifecycle Status | Last Time Buy (EOL) | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete | Obsolete |
| RoHS Status | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) |
주요 차별점
- Higher CPM integration level compared to MPC852 (vs MPC852TCVR50A)
- Pin-compatible higher-frequency upgrade within same family (vs MPC875CZT166)
- Same-package lower-cost option for cost-sensitive designs (vs MPC870CZT133)
설계 노트
Estimated: at 3.3V supply and 133 MHz operation the MPC875CZT133 dissipates approximately 0.8-1.2W; the 256-BGA package requires attention to PCB thermal relief. Use a minimum 4-layer PCB with continuous ground and power planes directly beneath the BGA, plus thermal vias under the center balls. For enclosed industrial enclosures without airflow, derate clock speed or add a small heatsink to maintain junction temperature below 100C.
The 256-BGA at 1.27mm pitch demands 6/6 mil trace-and-space PCB fabrication rules per NXP application notes. All power pins (3.3V and GND) require local decoupling capacitors of 0.1uF ceramic placed within 2mm of each ball, with bulk 10uF tantalum or ceramic capacitors near the package edge. JTAG pins (TRST, TCK, TMS, TDI, TDO) must be brought out to a header for boundary-scan debug during prototype bring-up.
Do not confuse the MPC875CZT133 (256-BGA ZT suffix) with the MPC875CVR133 - the VR suffix denotes a different package variant (CBGA/PBGA family). Pin 1 orientation differs between the two, and the BOM must specify the correct variant. Also note the part is leaded PBGA and RoHS non-compliant; do not specify this part for new RoHS-bound designs without consulting the environmental compliance team.
The 3.3V supply must be sequenced after the 1.7V internal core voltage regulator stabilizes - check the datasheet power-up sequencing diagram before power-on. Use a supervisor IC (e.g., TLV803) to assert reset until the supply rail is stable. Inrush at power-up is approximately 0.5A for the bulk capacitors and BGA core; size upstream regulators with adequate transient headroom.
규정 준수 정보
MPC875CZT133 contains lead and is RoHS non-compliant per distributor datasheet summary. EOL status as of NXP product page. Reach, halogen-free, and conflict-mineral status not specified in publicly available data.
