MT16LSDT3264AG-10E - 256MB PC100 SDRAM DIMM | Micron Technology
부품 번호: MT16LSDT3264AG-10E ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.95 | $249.50 |
| 100 | $21.4 | $2,140.00 |
| 500 | $18.75 | $9,375.00 |
| 1,000 | $16.2 | $16,200.00 |
MT16LSDT3264AG-10E 개요
An SDRAM DIMM (Synchronous DRAM Dual In-line Memory Module) is a printed-circuit-board assembly that places multiple SDRAM chips on a small PCB with a standardized edge-finger connector so the memory subsystem can be upgraded or replaced without soldering. SDRAM succeeded earlier asynchronous DRAM (FPM/EDO) by synchronizing all operations to the system clock, which improved burst-read/write efficiency; PC100 is the JEDEC-standard speed grade that guarantees correct operation at a 100 MHz external bus clock with a CAS latency of 2. In the broader taxonomy, SDRAM -> DRAM -> volatile memory -> semiconductor memory, sitting below non-volatile NAND/NOR flash and above SRAM in the cost/density curve.
Key feature highlights for this Micron module: 100 MHz bus frequency (PC100 compliant), CAS latency 2, 168-pin unbuffered DIMM form factor, 32 Meg x 64 organization yielding 256 MB, single +3.3V ±0.3V supply, fully synchronous operation, and a dual-rank PCB assembly. The module is compatible with motherboards that expose a standard SDRAM DIMM socket (Intel 440BX, VIA Apollo Pro 133 and earlier chipsets) and supports an initial 100 µs pause followed by two AUTO REFRESH commands after power-up.
The architecture is built from discrete 125/133 MHz-capable SDRAM components mounted on a multi-layer PCB with all address, control and data nets length-matched and terminated to support the 100 MHz command and data rate. Because the module is unbuffered and non-ECC, signal loading is at the minimum, which keeps the design simple but means it cannot be used in registered-memory systems such as high-end server boards of the era.
Typical applications include legacy desktop PC memory upgrades, PC100-era workstation memory expansion, embedded industrial PCs, point-of-sale terminals, legacy telecom/datacom line cards, and hobbyist retro-computing projects. The combination of 256 MB density and PC100 timing keeps the module useful for reviving industrial controllers and older office PCs that still require a JEDEC-standard 168-pin SDRAM DIMM.
When designing with this module, ensure the host chipset supports PC100 timing and 168-pin unbuffered DIMMs; mixing it with PC133 modules will down-clock the bus to 100 MHz. ESD handling during insertion and a proper power-supply ramp-up sequence (VDD and VDDQ must rise together) are essential for reliable initialization per the Micron datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single decision-ready reference for legacy SDRAM DIMM selection.
드롭인 대체품: MT16LSDT3264AG-10E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT16LSDT3264AG-133G3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT16LSDT3264AG-10EE1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT16LSDT3264AG-10EG1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT16LSDT3264AG-10E
✅ 드롭인✓ 재고 있음
$16.2 / 개
데이터시트 보기 →MT16LSDT3264AG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT16LSDT3264AG-10E 최대 정격 & 전기적 특성
| Module Type | SDRAM DIMM (Synchronous DRAM Dual In-line Memory Module) |
| Memory Standard | PC100 (JEDEC-standard, 100 MHz) |
| Capacity | 256 MB |
| 메모리 구성 | 32 Meg x 64 |
| Bus Frequency | 100 MHz |
| CAS 레이턴시 | CL2 |
| 핀 수 | 168 pins |
| Form Factor | 168-pin UDIMM (Unbuffered DIMM) |
| ECC Support | Non-ECC |
| Buffering | Unbuffered |
| Rank | Dual rank |
| Operating Voltage (VDD) | +3.3 V ±0.3 V |
| 동작 온도 | 0 °C to +70 °C |
| Compliance | PC100 / PC133-compliant JEDEC-standard 168-pin DIMM |
| Component Speed Grades Used | 125 MHz / 133 MHz SDRAM components |
| Initialization Sequence | 100 µs pause + 2x AUTO REFRESH after power-up |
| Synchronous Operation | Fully synchronous (signals latched on rising clock edge) |
| 실장 유형 | Through-hole edge-card socket (168-pin DIMM socket) |
MT16LSDT3264AG-10E standard 핀 구성 가이드
MT16LSDT3264AG-10E(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MT16LSDT3264AG-10E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MT16LSDT3264AG-10E 적합 용도: 6 애플리케이션s: Legacy Desktop PC Memory Upgrade, PC100-Era Workstation Memory Expansion, Embedded Industrial PC and Point-of-Sale Terminal, Retro-Computing Hobbyist Builds, Legacy Telecom and Datacom Line Cards, Vintage Server Memory Spare Parts.
Legacy Desktop PC Memory Upgrade
The MT16LSDT3264AG-10E was designed as the canonical 256 MB PC100 SDRAM upgrade for late-1990s and early-2000s desktop motherboards on chipsets like Intel 440BX, VIA Apollo Pro and SiS 630. The module's 32 Meg x 64 organization matches the chipset's address-window requirements at 100 MHz / CL2, and the unbuffered, non-ECC signaling is the lowest-latency configuration those chipsets support, eliminating any address-pipeline delay that registered DIMMs would introduce. The 168-pin UDIMM edge-card connector is mechanically keyed so the module seats only in matching SDRAM sockets, and the +3.3V ±0.3V supply aligns with the ATX power-rail budget of that era. Engineers reviving legacy office PCs or hobbyist retro-computing builds (Socket 370 / Socket A systems) will find this part matches original-equipment specifications without requiring BIOS tuning beyond SPD-based auto-detection.
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PC100-Era Workstation Memory Expansion
Entry-level CAD and DCC workstations from the PC100 era (Intel 440GX / 440BX-based single-CPU boards) use 256 MB of PC100 SDRAM as the standard memory population, exactly matching the MT16LSDT3264AG-10E specification. The module's dual-rank topology doubles the page-interleaving bandwidth versus single-rank modules, improving sustained read performance in workloads that stream large datasets through the L2 cache. Unbuffered signaling keeps command-to-DRAM latency at one clock cycle, which matters for latency-sensitive interactive CAD sessions. The non-ECC configuration matches the workstation's non-server cost target while still supporting the full 100 MHz synchronous burst capability that the host chipset advertises.
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Embedded Industrial PC and Point-of-Sale Terminal
Long-lifecycle industrial PCs, factory-floor HMIs and point-of-sale terminals often rely on legacy 168-pin SDRAM DIMMs because their x86 chipsets were qualified for that form factor and the firmware has never been ported to DDR. The MT16LSDT3264AG-10E's commercial 0 °C to +70 °C operating range covers most indoor industrial environments, and its JEDEC PC100 compliance guarantees interoperability with the chipset's SPD-based auto-detection, eliminating any custom firmware provisioning. The +3.3V ±0.3V supply rail aligns with the AT/ATX power budgets used in industrial enclosures, and the unbuffered interface matches the chipset's expected load. For factories running equipment designed in the late-1990s that still requires SDRAM DIMM replacements, this module is a direct-fit spare part.
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Retro-Computing Hobbyist Builds
Retro-computing enthusiasts restoring Socket 370 Pentium III, Socket 7 Pentium MMX and original Slot 1 Pentium II systems routinely need period-correct 256 MB PC100 SDRAM to populate the chipset's full memory address range. The MT16LSDT3264AG-10E provides an authentic Micron-branded module with correct SPD EEPROM contents that vintage BIOS auto-detection routines can interpret, avoiding the compatibility quirks that newer third-party modules sometimes exhibit with legacy BIOS revisions. The 168-pin UDIMM form factor is mechanically keyed against DDR1/DDR2 insertion so the module cannot be mis-seated on a board whose DDR slot is not in fact SDRAM-compatible. Original Micron labelling and date codes make it a desirable part for period-correct restorations.
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Legacy Telecom and Datacom Line Cards
Late-1990s telecom and datacom line cards (SS7 signalling, voice-over-IP gateways, base-station controllers) were designed around x86 CPUs with PC100 SDRAM DIMM sockets and often require exact Micron part-number equivalents for spares replacement. The MT16LSDT3264AG-10E's JEDEC-standard 168-pin UDIMM pinout is electrically compatible with the line-card backplane, and the unbuffered, non-ECC signaling matches the chipset's expected interface so no firmware updates are required to qualify the replacement. The commercial 0-70 °C operating range covers central-office and edge-of-base-station deployments where temperature-controlled cabinets are standard. Long-term availability is the primary driver, and brokers specializing in obsolete Micron parts are a typical source.
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Vintage Server Memory Spare Parts
Some legacy entry-level servers (single-CPU Intel 440BX-based and early VIA-based white-box servers) used unbuffered non-ECC PC100 DIMMs as their baseline memory configuration, despite the 'server' label. The MT16LSDT3264AG-10E fits this exact configuration as a spare part for boards whose original Micron DIMMs have aged out. The 256 MB density matches the typical baseline memory population for these systems, and the unbuffered, non-ECC signaling is the lowest-latency configuration the chipset supports, matching the original deployed bill-of-materials. Operators maintaining such legacy servers can use this module to extend system life until a planned migration to newer hardware.
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추천 제품 요약
엔지니어링 참조 데이터: MT16LSDT3264AG-10E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT16LSDT3264AG-133G3 | MT16LSDT3264AG-10EE1 | MT16LSDT3264AG-10EG1 | MT16LSDT3264AG-10E | MT16LSDT3264AG |
|---|---|---|---|---|---|---|
| Package | 168-pin UDIMM (Unbuffered DIMM) | 168-pin UDIMM (same) | 168-pin UDIMM (same) | 168-pin UDIMM (same) | 168-pin UDIMM (same) | 168-pin UDIMM (same) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Standard | PC100 (100 MHz) | PC133 (133 MHz) | PC100 (100 MHz) | PC100 (100 MHz) | PC100 (100 MHz) | PC100/PC133 (SPD-configurable) |
| Capacity | 256 MB | 256 MB | 256 MB | 256 MB | 256 MB | 256 MB |
| Organization | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 |
| CAS Latency | CL2 | CL3 (down-clocks to CL2 at PC100) | CL2 | CL2 | CL2 | CL2 (PC100) / CL3 (PC133) |
| ECC Support | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC |
| Buffering | Unbuffered | Unbuffered | Unbuffered | Unbuffered | Unbuffered | Unbuffered |
| Operating Voltage | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V |
주요 차별점
- PC100 (100 MHz) timing rather than PC133 (133 MHz) (vs MT16LSDT3264AG-133G3)
- Genuine Micron-branded module with full SPD EEPROM (vs Third-party compatible 256 MB PC100 UDIMMs)
- 32 Meg x 64 organization with dual-rank topology (vs Single-rank 32 Meg x 64 modules)
설계 노트
Estimated: A 256 MB PC100 SDRAM UDIMM built from 16 discrete 16Mx16 SDRAM components typically draws 1.2-1.5 A at +3.3 V under full read/write activity (approximately 4-5 W). Per Micron datasheet MT16LSDT3264Ax_Rev2010, VDD and VDDQ must rise together during power-up; an initial 100 µs pause followed by two AUTO REFRESH commands is mandatory before normal operation. Place a 100 µF bulk decoupling capacitor adjacent to the DIMM socket to absorb the inrush current during simultaneous VDD/VDDQ ramp-up.
Do not insert a 168-pin SDRAM UDIMM into a 184-pin DDR DIMM socket or a 200-pin DDR2 SO-DIMM socket: the keying is different and insertion will not seat. Mixing PC100 and PC133 modules in the same bank down-clocks the entire bus to 100 MHz; populate banks with matching speed grades for optimal throughput. Per Micron datasheet, do not exceed 64 ms refresh interval and ensure the chipset issues AUTO REFRESH commands at the JEDEC-required cadence to maintain data retention.
Estimated: Maintain 50 Ω ±10% controlled impedance on DQ, address, command and clock traces between the chipset and the DIMM socket to preserve signal integrity at 100 MHz. Match clock-to-DQS trace lengths within ±50 mil and use source-series termination on clock outputs per the Intel 440BX reference design. Route the +3.3 V plane as a dedicated island with low-inductance vias adjacent to each SDRAM component's decoupling network (0.1 µF + 10 µF per component) to suppress switching transients during burst reads.
규정 준수 정보
RoHS/lead-free status not explicitly stated in verified web data; the -10EE1 suffix on the lead-free variant indicates lead-free assembly. AEC-Q100 not applicable for legacy SDRAM DIMM memory modules. Compliance fields marked unknown per Data Authenticity Rule 10.
