MT16LSDT3264AG-10E - 256MB PC100 SDRAM DIMM | Micron Technology
MPN: MT16LSDT3264AG-10E ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.95 | $249.50 |
| 100 | $21.4 | $2,140.00 |
| 500 | $18.75 | $9,375.00 |
| 1,000 | $16.2 | $16,200.00 |
MT16LSDT3264AG-10E Overview
An SDRAM DIMM (Synchronous DRAM Dual In-line Memory Module) is a printed-circuit-board assembly that places multiple SDRAM chips on a small PCB with a standardized edge-finger connector so the memory subsystem can be upgraded or replaced without soldering. SDRAM succeeded earlier asynchronous DRAM (FPM/EDO) by synchronizing all operations to the system clock, which improved burst-read/write efficiency; PC100 is the JEDEC-standard speed grade that guarantees correct operation at a 100 MHz external bus clock with a CAS latency of 2. In the broader taxonomy, SDRAM -> DRAM -> volatile memory -> semiconductor memory, sitting below non-volatile NAND/NOR flash and above SRAM in the cost/density curve.
Key feature highlights for this Micron module: 100 MHz bus frequency (PC100 compliant), CAS latency 2, 168-pin unbuffered DIMM form factor, 32 Meg x 64 organization yielding 256 MB, single +3.3V ±0.3V supply, fully synchronous operation, and a dual-rank PCB assembly. The module is compatible with motherboards that expose a standard SDRAM DIMM socket (Intel 440BX, VIA Apollo Pro 133 and earlier chipsets) and supports an initial 100 µs pause followed by two AUTO REFRESH commands after power-up.
The architecture is built from discrete 125/133 MHz-capable SDRAM components mounted on a multi-layer PCB with all address, control and data nets length-matched and terminated to support the 100 MHz command and data rate. Because the module is unbuffered and non-ECC, signal loading is at the minimum, which keeps the design simple but means it cannot be used in registered-memory systems such as high-end server boards of the era.
Typical applications include legacy desktop PC memory upgrades, PC100-era workstation memory expansion, embedded industrial PCs, point-of-sale terminals, legacy telecom/datacom line cards, and hobbyist retro-computing projects. The combination of 256 MB density and PC100 timing keeps the module useful for reviving industrial controllers and older office PCs that still require a JEDEC-standard 168-pin SDRAM DIMM.
When designing with this module, ensure the host chipset supports PC100 timing and 168-pin unbuffered DIMMs; mixing it with PC133 modules will down-clock the bus to 100 MHz. ESD handling during insertion and a proper power-supply ramp-up sequence (VDD and VDDQ must rise together) are essential for reliable initialization per the Micron datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single decision-ready reference for legacy SDRAM DIMM selection.
Drop-in alternatives for MT16LSDT3264AG-10E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT16LSDT3264AG-133G3
✅ Drop-In📋 Reference alternative (not in catalog)
MT16LSDT3264AG-10EE1
✅ Drop-In📋 Reference alternative (not in catalog)
MT16LSDT3264AG-10EG1
✅ Drop-In📋 Reference alternative (not in catalog)
MT16LSDT3264AG-10E
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →MT16LSDT3264AG
✅ Drop-In📋 Reference alternative (not in catalog)
MT16LSDT3264AG-10E Maximum Ratings & Electrical Characteristics
| Module Type | SDRAM DIMM (Synchronous DRAM Dual In-line Memory Module) |
| Memory Standard | PC100 (JEDEC-standard, 100 MHz) |
| Capacity | 256 MB |
| Organization | 32 Meg x 64 |
| Bus Frequency | 100 MHz |
| CAS Latency | CL2 |
| Pin Count | 168 pins |
| Form Factor | 168-pin UDIMM (Unbuffered DIMM) |
| ECC Support | Non-ECC |
| Buffering | Unbuffered |
| Rank | Dual rank |
| Operating Voltage (VDD) | +3.3 V ±0.3 V |
| Operating Temperature | 0 °C to +70 °C |
| Compliance | PC100 / PC133-compliant JEDEC-standard 168-pin DIMM |
| Component Speed Grades Used | 125 MHz / 133 MHz SDRAM components |
| Initialization Sequence | 100 µs pause + 2x AUTO REFRESH after power-up |
| Synchronous Operation | Fully synchronous (signals latched on rising clock edge) |
| Mounting Type | Through-hole edge-card socket (168-pin DIMM socket) |
MT16LSDT3264AG-10E standard Pin Configuration Guide
Pin configuration for MT16LSDT3264AG-10E (standard package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MT16LSDT3264AG-10E.
Refer to the datasheet for full pin configuration.
Typical Applications
MT16LSDT3264AG-10E is suitable for 6 applications: Legacy Desktop PC Memory Upgrade, PC100-Era Workstation Memory Expansion, Embedded Industrial PC and Point-of-Sale Terminal, Retro-Computing Hobbyist Builds, Legacy Telecom and Datacom Line Cards, Vintage Server Memory Spare Parts.
Legacy Desktop PC Memory Upgrade
The MT16LSDT3264AG-10E was designed as the canonical 256 MB PC100 SDRAM upgrade for late-1990s and early-2000s desktop motherboards on chipsets like Intel 440BX, VIA Apollo Pro and SiS 630. The module's 32 Meg x 64 organization matches the chipset's address-window requirements at 100 MHz / CL2, and the unbuffered, non-ECC signaling is the lowest-latency configuration those chipsets support, eliminating any address-pipeline delay that registered DIMMs would introduce. The 168-pin UDIMM edge-card connector is mechanically keyed so the module seats only in matching SDRAM sockets, and the +3.3V ±0.3V supply aligns with the ATX power-rail budget of that era. Engineers reviving legacy office PCs or hobbyist retro-computing builds (Socket 370 / Socket A systems) will find this part matches original-equipment specifications without requiring BIOS tuning beyond SPD-based auto-detection.
Recommended
PC100-Era Workstation Memory Expansion
Entry-level CAD and DCC workstations from the PC100 era (Intel 440GX / 440BX-based single-CPU boards) use 256 MB of PC100 SDRAM as the standard memory population, exactly matching the MT16LSDT3264AG-10E specification. The module's dual-rank topology doubles the page-interleaving bandwidth versus single-rank modules, improving sustained read performance in workloads that stream large datasets through the L2 cache. Unbuffered signaling keeps command-to-DRAM latency at one clock cycle, which matters for latency-sensitive interactive CAD sessions. The non-ECC configuration matches the workstation's non-server cost target while still supporting the full 100 MHz synchronous burst capability that the host chipset advertises.
Recommended
Embedded Industrial PC and Point-of-Sale Terminal
Long-lifecycle industrial PCs, factory-floor HMIs and point-of-sale terminals often rely on legacy 168-pin SDRAM DIMMs because their x86 chipsets were qualified for that form factor and the firmware has never been ported to DDR. The MT16LSDT3264AG-10E's commercial 0 °C to +70 °C operating range covers most indoor industrial environments, and its JEDEC PC100 compliance guarantees interoperability with the chipset's SPD-based auto-detection, eliminating any custom firmware provisioning. The +3.3V ±0.3V supply rail aligns with the AT/ATX power budgets used in industrial enclosures, and the unbuffered interface matches the chipset's expected load. For factories running equipment designed in the late-1990s that still requires SDRAM DIMM replacements, this module is a direct-fit spare part.
Recommended
Retro-Computing Hobbyist Builds
Retro-computing enthusiasts restoring Socket 370 Pentium III, Socket 7 Pentium MMX and original Slot 1 Pentium II systems routinely need period-correct 256 MB PC100 SDRAM to populate the chipset's full memory address range. The MT16LSDT3264AG-10E provides an authentic Micron-branded module with correct SPD EEPROM contents that vintage BIOS auto-detection routines can interpret, avoiding the compatibility quirks that newer third-party modules sometimes exhibit with legacy BIOS revisions. The 168-pin UDIMM form factor is mechanically keyed against DDR1/DDR2 insertion so the module cannot be mis-seated on a board whose DDR slot is not in fact SDRAM-compatible. Original Micron labelling and date codes make it a desirable part for period-correct restorations.
Recommended
Legacy Telecom and Datacom Line Cards
Late-1990s telecom and datacom line cards (SS7 signalling, voice-over-IP gateways, base-station controllers) were designed around x86 CPUs with PC100 SDRAM DIMM sockets and often require exact Micron part-number equivalents for spares replacement. The MT16LSDT3264AG-10E's JEDEC-standard 168-pin UDIMM pinout is electrically compatible with the line-card backplane, and the unbuffered, non-ECC signaling matches the chipset's expected interface so no firmware updates are required to qualify the replacement. The commercial 0-70 °C operating range covers central-office and edge-of-base-station deployments where temperature-controlled cabinets are standard. Long-term availability is the primary driver, and brokers specializing in obsolete Micron parts are a typical source.
Recommended
Vintage Server Memory Spare Parts
Some legacy entry-level servers (single-CPU Intel 440BX-based and early VIA-based white-box servers) used unbuffered non-ECC PC100 DIMMs as their baseline memory configuration, despite the 'server' label. The MT16LSDT3264AG-10E fits this exact configuration as a spare part for boards whose original Micron DIMMs have aged out. The 256 MB density matches the typical baseline memory population for these systems, and the unbuffered, non-ECC signaling is the lowest-latency configuration the chipset supports, matching the original deployed bill-of-materials. Operators maintaining such legacy servers can use this module to extend system life until a planned migration to newer hardware.
Recommended
Recommended Products Summary
Engineering reference data for MT16LSDT3264AG-10E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT16LSDT3264AG-133G3 | MT16LSDT3264AG-10EE1 | MT16LSDT3264AG-10EG1 | MT16LSDT3264AG-10E | MT16LSDT3264AG |
|---|---|---|---|---|---|---|
| Package | 168-pin UDIMM (Unbuffered DIMM) | 168-pin UDIMM (same) | 168-pin UDIMM (same) | 168-pin UDIMM (same) | 168-pin UDIMM (same) | 168-pin UDIMM (same) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Standard | PC100 (100 MHz) | PC133 (133 MHz) | PC100 (100 MHz) | PC100 (100 MHz) | PC100 (100 MHz) | PC100/PC133 (SPD-configurable) |
| Capacity | 256 MB | 256 MB | 256 MB | 256 MB | 256 MB | 256 MB |
| Organization | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 | 32 Meg x 64 |
| CAS Latency | CL2 | CL3 (down-clocks to CL2 at PC100) | CL2 | CL2 | CL2 | CL2 (PC100) / CL3 (PC133) |
| ECC Support | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC |
| Buffering | Unbuffered | Unbuffered | Unbuffered | Unbuffered | Unbuffered | Unbuffered |
| Operating Voltage | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V | +3.3 V ±0.3 V |
Key Differentiators
- PC100 (100 MHz) timing rather than PC133 (133 MHz) (vs MT16LSDT3264AG-133G3)
- Genuine Micron-branded module with full SPD EEPROM (vs Third-party compatible 256 MB PC100 UDIMMs)
- 32 Meg x 64 organization with dual-rank topology (vs Single-rank 32 Meg x 64 modules)
Design Notes
Estimated: A 256 MB PC100 SDRAM UDIMM built from 16 discrete 16Mx16 SDRAM components typically draws 1.2-1.5 A at +3.3 V under full read/write activity (approximately 4-5 W). Per Micron datasheet MT16LSDT3264Ax_Rev2010, VDD and VDDQ must rise together during power-up; an initial 100 µs pause followed by two AUTO REFRESH commands is mandatory before normal operation. Place a 100 µF bulk decoupling capacitor adjacent to the DIMM socket to absorb the inrush current during simultaneous VDD/VDDQ ramp-up.
Do not insert a 168-pin SDRAM UDIMM into a 184-pin DDR DIMM socket or a 200-pin DDR2 SO-DIMM socket: the keying is different and insertion will not seat. Mixing PC100 and PC133 modules in the same bank down-clocks the entire bus to 100 MHz; populate banks with matching speed grades for optimal throughput. Per Micron datasheet, do not exceed 64 ms refresh interval and ensure the chipset issues AUTO REFRESH commands at the JEDEC-required cadence to maintain data retention.
Estimated: Maintain 50 Ω ±10% controlled impedance on DQ, address, command and clock traces between the chipset and the DIMM socket to preserve signal integrity at 100 MHz. Match clock-to-DQS trace lengths within ±50 mil and use source-series termination on clock outputs per the Intel 440BX reference design. Route the +3.3 V plane as a dedicated island with low-inductance vias adjacent to each SDRAM component's decoupling network (0.1 µF + 10 µF per component) to suppress switching transients during burst reads.
Compliance Information
RoHS/lead-free status not explicitly stated in verified web data; the -10EE1 suffix on the lead-free variant indicates lead-free assembly. AEC-Q100 not applicable for legacy SDRAM DIMM memory modules. Compliance fields marked unknown per Data Authenticity Rule 10.
