MT47H128M16RT-25EIT:C - 2Gb DDR2 SDRAM, 128Mx16, 400 MHz | Micron
부품 번호: MT47H128M16RT-25EIT:C ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.95 | $395.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.15 | $3,150.00 |
MT47H128M16RT-25EIT:C 개요
A DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) is a volatile memory IC that transfers data on both clock edges, doubling peak throughput versus single-data-rate SDRAM at the same clock frequency. DDR2 builds on DDR with lower voltage (1.8V vs 2.5V), higher prefetch (4n-bit vs 2n-bit), on-die termination, and stricter signal integrity requirements, making it a member of the SDRAM family inside the broader DRAM > Memory IC > Semiconductor taxonomy.
Key features include a 4n-bit prefetch architecture, differential data strobe (DQS/DQS#), SSTL_18-compatible 1.8V I/O, VDD and VDDQ both at 1.8V +/-0.1V, and an 8-bank internal organization for concurrent operations. The 84-ball FBGA footprint is JEDEC-standard and pin-compatible across density variants in the MT47H family. The -25E speed grade specifies a tRCD/tRP of 13.125 ns and a tCK minimum of 2.5 ns, equivalent to DDR2-800 (CL5) operation.
Typical applications include legacy industrial controllers, networking line cards, set-top box main memory, printer image buffers, and any 1.8V main-memory subsystem designed around DDR2-800 with x16 organization. The industrial temperature range (-40C to +85C) supports factory-floor and outdoor enclosures.
When designing with this device, follow JEDEC DDR2 PCB layout guidelines for controlled-impedance 50 ohm single-ended traces, 100 ohm differential DQS pairs, and VREF supply decoupling. The MT47H128M16RT-25EIT:C is pin-compatible with other MT47H128M16 speed grades (-25, -3, -37) and density variants, enabling simple BOM scaling.
This page synthesizes distributor pricing, verified Micron drop-in alternatives within the MT47H family, and JEDEC-aligned design notes not collected in a single place on the manufacturer datasheet.
드롭인 대체품: MT47H128M16RT-25EIT:C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT47H128M16RT-25EIT:H
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT47H128M16HQ-25EIT:C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT47H128M16RT-25EIT:C TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT47H128M16RT-25E:C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT47H128M16RT-25EIT:C 최대 정격 & 전기적 특성
| 메모리 유형 | DDR2 SDRAM |
| Density | 2 Gbit (128M x 16) |
| 메모리 구성 | 128M words x 16 bits |
| Number of Banks | 8 |
| Clock Frequency | 400 MHz |
| Access Time | 2.5 ns (tCK min, -25E speed grade) |
| 데이터 속도 | DDR2-800 |
| Prefetch Architecture | 4n-bit |
| Supply Voltage VDD | 1.8 V +/-0.1 V |
| Supply Voltage VDDQ | 1.8 V +/-0.1 V |
| I/O Standard | SSTL_18 (JEDEC-standard 1.8V) |
| Data Strobe | Differential DQS, DQS# |
| 패키지 | 84-ball FBGA (9x12.5 mm) |
| 동작 온도 | -40C to +85C (Industrial / IT grade) |
| RoHS 상태 | Compliant (per Micron product page) |
| 실장 유형 | Surface Mount |
MT47H128M16RT-25EIT:C 84-ball fbga (9x12.5 mm) 핀 구성 가이드
MT47H128M16RT-25EIT:C(84-ball fbga (9x12.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MT47H128M16RT-25EIT:C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MT47H128M16RT-25EIT:C 적합 용도: 6 애플리케이션s: Legacy Industrial Controller Main Memory, Networking Line Card Packet Buffer, Set-Top Box Main Memory, Printer / MFP Image Buffer, Automotive Infotainment Legacy Platform, Medical Imaging Buffer (Legacy).
Legacy Industrial Controller Main Memory
The MT47H128M16RT-25EIT:C fits legacy industrial controllers because its 2 Gbit DDR2 capacity and 128Mx16 organization directly match the address map designed into CPU boards from the DDR2 era (2005-2015). The 400 MHz clock and 5-5-5 timing deliver 800 MT/s peak bandwidth, which is sufficient for HMI panels, PLC runtime memory, and fieldbus buffers. The IT (-40C to +85C) industrial temperature grade is critical for factory-floor enclosures and outdoor cabinets. Unlike newer DDR3/DDR4 SDRAMs, this DDR2 part requires 1.8V VDD/VDDQ supplies and SSTL_18 receivers, so the host controller must already be DDR2-compatible. Recommended companion MPNs include a DDR2 register/PLL like the Micron MT47H series timing reference and a 1.8V LDO for the VTT termination rail.
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Networking Line Card Packet Buffer
In networking line cards and routers, the MT47H128M16RT-25EIT:C serves as packet-buffer memory when the line card ASIC/FPGA has a native DDR2 controller. Its x16 organization matches the typical 16-bit DDR2 controller PHY on legacy Broadcom/Intel/Marvell switching ASICs, providing 128 M of 16-bit-wide storage per chip. With 800 MT/s peak transfer rate, a single 2 Gbit device handles ~12.8 Gbps of read+write bandwidth, suitable for gigabit-class access ports. The industrial temperature range supports outdoor DSLAM/PON cabinet installations. Use this part instead of newer DDR3/LPDDR only when the host ASIC cannot be re-fabricated; the IT suffix makes it suitable for telecom outdoor units.
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Set-Top Box Main Memory
The MT47H128M16RT-25EIT:C is well-suited for set-top box (STB) main memory because legacy STB SoCs from STMicro, Broadcom, and Ali Corporation were designed around 1.8V DDR2 interfaces with x16 organization. A single 2 Gbit device provides 256 MB of system RAM, sufficient for Linux/Middleware stacks on entry-level IPTV and cable STBs. The 84-ball FBGA footprint keeps the PCB small, which is essential for compact enclosure designs. The DDR2-800 speed grade ensures adequate bandwidth for H.264 1080p decoding and graphics overlay operations. The IT temperature rating supports enclosures mounted near heat sources without active cooling. Pair this part with a JEDEC-compliant DDR2 clock driver for source-synchronous operation.
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Printer / MFP Image Buffer
Office printers and multifunction peripherals (MFPs) use the MT47H128M16RT-25EIT:C as a frame buffer to hold rasterized print images before the laser or inkjet engine. A 128M x 16 organization matches the legacy DDR2 image-processor ASICs from manufacturers like Ricoh and Canon, providing 256 MB of buffer for full-bleed A3 rasterization at 1200 dpi. The 400 MHz clock rate keeps data flowing to the print engine without stalling, while the 84-ball FBGA enables compact controller boards. The IT temperature grade supports printers installed in non-climate-controlled offices and warehouses. Use this part instead of SDR/DDR1 only if the print engine controller was designed for DDR2.
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Automotive Infotainment Legacy Platform
Some automotive infotainment head units designed around 2010-2015 used DDR2 x16 SDRAM for main memory, and the MT47H128M16RT-25EIT:C is qualified for that role in non-safety-critical applications. Its industrial temperature range covers the cabin environment, while the DDR2-800 bandwidth is sufficient for navigation map caching and rear-seat entertainment streams. The 84-ball FBGA footprint is JEDEC-standard, enabling direct compatibility with the original automotive design's PCB land pattern. Note that this is NOT an AEC-Q100 qualified part; for safety-critical automotive applications, contact Micron about AEC-Q100 equivalent variants or use a newer DDR3L automotive SDRAM.
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Medical Imaging Buffer (Legacy)
Legacy ultrasound and patient-monitoring systems with DDR2-based SoCs use the MT47H128M16RT-25EIT:C as image buffer memory. The 2 Gbit capacity holds a full ultrasound frame at diagnostic resolution, while the 400 MHz DDR2-800 throughput keeps Doppler processing latency low. The IT (-40C to +85C) temperature range supports portable cart-based equipment used in variable-temperature clinical environments. For new medical designs, consider the Micron MT47H family as a drop-in but verify IEC 60601-1 compliance at the system level; the SDRAM itself does not carry a medical certification.
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추천 제품 요약
엔지니어링 참조 데이터: MT47H128M16RT-25EIT:C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT47H128M16RT-25EIT:H | MT47H128M16HQ-25EIT:C | MT47H128M16RT-25EIT:C TR | MT47H128M16RT-25E:C |
|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 84-ball FBGA (9x12.5 mm) | 84-ball FBGA (9x12.5) - same | 84-ball FBGA (9x12.5) - same | 84-ball FBGA (9x12.5) - same | 84-ball FBGA (9x12.5) - same |
| Density | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) | 2 Gbit (128M x 16) |
| Speed Grade | -25E (DDR2-800, CL5) | H grade (higher speed option) | -25E (DDR2-800, CL5) | -25E (DDR2-800, CL5) | -25E (DDR2-800, CL5) |
| Operating Temperature | -40C to +85C (Industrial / IT) | -40C to +85C (Industrial / IT) | -40C to +85C (Industrial / IT) | -40C to +85C (Industrial / IT) | 0C to +70C (Commercial) |
| Supply Voltage | 1.8V +/-0.1V (VDD/VDDQ) | 1.8V +/-0.1V | 1.8V +/-0.1V | 1.8V +/-0.1V | 1.8V +/-0.1V |
| Packaging Form | Tray | Tray or Tape & Reel (variant-dependent) | Tray | Tape & Reel | Tray |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Industrial Temperature (IT) grade as standard (vs MT47H128M16RT-25E:C)
- JEDEC-standard 84-ball FBGA footprint across family (vs MT47H64M8B6-25E L:D TR)
- DDR2-800 (-25E) is the highest-volume speed bin (vs MT47H128M16RT-25EIT:H)
설계 노트
Per JEDEC DDR2 layout guidelines, route the 16-bit DQ bus and differential DQS/DQS# strobe pairs as 50 ohm single-ended and 100 ohm differential controlled-impedance traces on the outer PCB layers. Estimated: at 1.8V SSTL_18 swing, trace lengths on the DQ group must be matched within +/-25 mil to preserve setup/hold margins at DDR2-800. Place VREF decoupling caps within 200 mil of every VREF pin and use a star-ground topology to keep reference-plane return paths short.
Per the Micron MT47H datasheet, VDD and VDDQ both require 1.8V +/-0.1V with bulk decoupling of at least 10uF plus 0.1uF high-frequency ceramic per pin. VTT (termination supply) must track VDDQ/2 within +/-40 mV; use a dedicated VTT LDO such as a TPS51200 or equivalent. The ZQ pin requires a 240 ohm 1% resistor to ground for output-driver calibration - omitting this pin disables impedance matching and may cause signal-integrity failures.
DDR2 source-synchronous timing relies on the DQS/DQS# strobe pair being centered in the data eye. Per Micron application notes, fly-by routing with via-in-pad is NOT recommended for DDR2 - use microstrip or stripline on a continuous reference plane. Length matching of DQ to DQS within +/-50 ps is recommended for DDR2-800. Estimated: a 1mm trace mismatch at 1.8V edge rate (~1ns) contributes approximately 6 ps, so keep DQ-to-DQS length differences under 8 mm.
Common pitfalls when designing with MT47H128M16RT-25EIT:C include: (1) forgetting the 240 ohm ZQ calibration resistor - DDR2 will fail JEDEC compliance without it; (2) using a DDR3 SDRAM footprint - DDR2 uses 84-ball FBGA with different ball pitch; (3) mismatching the IT and Commercial temperature grades - the IT grade is -40C to +85C, the commercial is 0C to +70C; (4) assuming NRND means 'unavailable' - Micron NRND parts still ship for legacy support but should not be used in new designs.
규정 준수 정보
RoHS compliance per Micron product page. NOT AEC-Q100 qualified - this is an industrial-temperature SDRAM, not an automotive-grade part. Halogen-free status not stated in available web data; set to 'unknown'. DDR2 SDRAM lifecycle status is NRND (Not Recommended for New Designs) per Micron.
