MT48LC4M32B2B5-7G - 128Mb x32 SDRAM 143MHz | Micron
부품 번호: MT48LC4M32B2B5-7G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.81 | $58.10 |
| 100 | $5.18 | $518.00 |
| 500 | $4.66 | $2,330.00 |
| 1,000 | $4.12 | $4,120.00 |
MT48LC4M32B2B5-7G 개요
What is SDRAM? Synchronous DRAM is a generation of dynamic random-access memory that synchronizes all address, data, and control signals to a free-running system clock, in contrast to the asynchronous DRAM used in earlier PCs. Within the memory hierarchy, SDRAM sits above asynchronous DRAM and below Double Data Rate SDRAM (DDR), and within modern computing platforms it remains a low-cost, low-power solution for embedded graphics, networking line cards, set-top boxes, and industrial HMI where x32 bus width is convenient and DDR is unnecessary. SDRAM -> DRAM -> volatile memory -> semiconductor IC is the standard taxonomy.
Key features of the MT48LC4M32B2B5-7G include auto-refresh (64 ms / 4096 rows), self-refresh mode, four-bank operation with concurrent bank precharge, and a programmable burst length of 1, 2, 4, 8, or full page with sequential or interleave burst type. The device supports LVTTL levels on all inputs and outputs, has a deep power-down mode, and provides a CKE pin for clock enable/disable and clock suspend operation, enabling fine-grained power management in battery-backed or intermittently active systems.
Architecturally the part uses an internal pipelined 2n-prefetch architecture that allows the column address to change on every clock cycle, enabling fully random access. The four-bank design lets one bank be precharged while another is being accessed, which hides precharge cycles and sustains high throughput. The x32 organization maps directly to common 32-bit embedded buses such as 32-bit microcontrollers and DSPs, eliminating bus-width glue logic in many designs.
Typical applications include graphics buffers in laser printers and POS terminals, frame stores in industrial cameras, SDRAM expansion for 32-bit microcontrollers (PIC32MZ, STM32, NXP i.MX external memory bus), networking line cards and DSLAM buffers, and main memory for low-cost FPGA soft-core processors such as Nios II and MicroBlaze. The wide x32 data bus makes the part especially attractive where the host is already 32 bits wide.
When designing with the MT48LC4M32B2B5-7G, follow Micron TN-48-05 layout guidelines - matched-length clock, address, and command traces, a clean 3.3 V analog supply with local decoupling, Vss/VddQ noise isolation, and proper SSTL-style termination if multiple loads are present. Note that the -7G speed grade is the 143 MHz / CL3 commercial variant; the -7 IT:G variant is the industrial-temperature equivalent for -40 C to +85 C operation, and the -6A variant is the slower 166 MHz pin-compatible grade.
This page synthesizes distributor pricing, drop-in speed-grade alternatives within the same Micron x32 SDRAM family, and practical PCB design notes not found in the manufacturer datasheet.
드롭인 대체품: MT48LC4M32B2B5-7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT48LC4M32B2B5-6A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT48LC4M32B2B5-7 IT:G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT48LC4M32B2B5-6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT48LC4M32B2B5-6A IT:G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
IS42S32400J-6BL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AS4C4M32S-6BIN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT48LC4M32B2B5-7G 최대 정격 & 전기적 특성
| 메모리 유형 | SDRAM (Synchronous DRAM) |
| 메모리 크기 | 128 Mbit (4M x 32) |
| 메모리 구성 | 4M words x 32 bits |
| Number of Banks | 4 |
| 최대 클록 주파수 | 143 MHz |
| Access Time (tAC) | 5.5 ns |
| Supply Voltage (VDD/VDDQ) | 3.0 V to 3.6 V |
| 인터페이스 유형 | Parallel (LVTTL) |
| CAS 레이턴시 | Programmable, 2 or 3 |
| Burst Length | 1, 2, 4, 8, Full Page |
| Refresh | Auto-refresh, 64 ms / 4096 rows |
| Self-Refresh | Yes (CKE controlled) |
| 동작 온도 | 0 C to +70 C (commercial, -G) |
| 패키지 | 90-ball VFBGA, 8 mm x 13 mm |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (-7G suffix) |
| RoHS 상태 | Compliant |
MT48LC4M32B2B5-7G 90-ball vfbga, 8 mm x 13 mm 핀 구성 가이드
MT48LC4M32B2B5-7G(90-ball vfbga, 8 mm x 13 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MT48LC4M32B2B5-7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MT48LC4M32B2B5-7G 적합 용도: 6 애플리케이션s: Embedded Graphics Frame Buffer, 32-bit Microcontroller External Memory, Networking Line Card Packet Buffer, Industrial Camera Image Buffer, Set-Top Box and Consumer AV Buffer, FPGA Soft-Processor Main Memory.
Embedded Graphics Frame Buffer
The MT48LC4M32B2B5-7G's 128 Mbit density and wide x32 data bus make it an ideal frame buffer for low-resolution TFT LCD controllers in laser printers, POS terminals, and industrial HMIs. With 143 MHz clock and 5.5 ns access time, it sustains a peak bandwidth of 572 MB/s which exceeds the requirements of typical QVGA/WVGA panels. The 3.3 V LVTTL interface connects directly to common LCD controllers without level shifting, simplifying PCB layout. The four-bank architecture supports concurrent display refresh and CPU draw operations, eliminating visible tearing. Alliance Memory AS4C4M32S-6BIN is a recommended second-source for new designs as the Micron part is NRND.
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32-bit Microcontroller External Memory
The MT48LC4M32B2B5-7G is a natural memory companion for 32-bit microcontrollers with external memory bus interfaces, including Microchip PIC32MZ, STMicroelectronics STM32, and NXP i.MX RT series. The x32 data width matches the MCU bus directly, eliminating bus-width multiplexing. At 143 MHz the SDRAM exceeds typical MCU external bus speeds (typically 90-120 MHz), leaving headroom. The 3.3 V interface is directly compatible with most MCU I/O banks without external transceivers. STMicroelectronics officially supports the MT48LC4M32B2B5 on STM32H750B-DK and STM32MP1 discovery boards, with STM32Cube firmware examples available.
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Networking Line Card Packet Buffer
In networking line cards and DSLAMs, the MT48LC4M32B2B5-7G serves as a packet buffer or descriptor store where moderate density and deterministic latency matter more than peak throughput. The four-bank concurrent operation enables simultaneous ingress packet writes and egress descriptor reads without contention. SDRAM's simplicity compared to DDR2/3 reduces board complexity and BOM cost in designs where 1-2 Gbps aggregate bandwidth suffices. The 90-ball VFBGA keeps the layout compact for high-density line cards. For new designs, ISSI IS42S32400J-6BL provides an active second source with compatible timing.
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Industrial Camera Image Buffer
The MT48LC4M32B2B5-7G provides temporary frame storage between image sensors and image signal processors in industrial machine-vision cameras. Its 128 Mbit capacity holds multiple raw Bayer frames, enabling burst capture at sensor data rates up to 572 MB/s. The wide x32 bus eliminates pixel-data demultiplexing on the ISP side. SDRAM's predictable refresh behavior (64 ms auto-refresh, 4096 rows) is acceptable for still-frame and slow-motion imaging, though DDR2 is preferred for high-frame-rate 4K pipelines. The commercial 0 C to +70 C temperature range suits factory-floor enclosures.
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Set-Top Box and Consumer AV Buffer
In set-top boxes and consumer audio/video equipment, the MT48LC4M32B2B5-7G provides cost-effective buffering for transport stream de-multiplexing and audio sample storage. The 3.3 V LVTTL interface is directly compatible with legacy MPEG decoders and audio DACs that lack 1.8 V SSTL support. SDRAM's mature ecosystem means reference designs and validated timing are abundant, accelerating time-to-market. The four-bank architecture allows simultaneous video decode and audio rendering without bus contention. The NRND status requires a long-term supply plan - Alliance Memory's AS4C4M32S family is purpose-built for this scenario.
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FPGA Soft-Processor Main Memory
The MT48LC4M32B5-7G serves as main memory for FPGA soft-core processors such as Altera Nios II, Xilinx MicroBlaze, and Lattice Mico32 in development kits and low-volume embedded systems. The 128 Mbit capacity supports real-time operating systems and frame buffers, while the 143 MHz clock rate keeps pace with typical soft-core 100-150 MHz operation. SDRAM controllers are available as free IP cores from all major FPGA vendors, eliminating the need to design a custom memory interface. The 90-ball VFBGA is footprint-compatible with Altera Cyclone and Xilinx Spartan evaluation boards. Designers should verify pin compatibility before substituting speed grades.
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추천 제품 요약
엔지니어링 참조 데이터: MT48LC4M32B2B5-7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT48LC4M32B2B5-6A | MT48LC4M32B2B5-7 IT:G | MT48LC4M32B2B5-6 | IS42S32400J-6BL | AS4C4M32S-6BIN |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | ISSI | Alliance Memory |
| Package | 90-ball VFBGA (8x13 mm) | 90-ball VFBGA (8x13 mm) - same | 90-ball VFBGA (8x13 mm) - same | 90-ball VFBGA (8x13 mm) - same | 90-ball VFBGA - same | 90-ball VFBGA - same |
| Density | 128 Mbit (4M x 32) | 128 Mbit (4M x 32) | 128 Mbit (4M x 32) | 128 Mbit (4M x 32) | 128 Mbit (4M x 32) | 128 Mbit (4M x 32) |
| Max Clock Frequency | 143 MHz (CL3) | 166 MHz (CL3) | 143 MHz (CL3) | 166 MHz (CL2) | 166 MHz (CL3) | 166 MHz (CL3) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active | Active |
| Packaging Format | Tape & Reel (-G) | Tray / Tape & Reel | Tray (-IT) | Tray / Tape & Reel | Tray | Tray (industrial) |
주요 차별점
- Established reference design footprint on STMicroelectronics STM32 boards (vs IS42S32400J-6BL)
- Active long-term supply commitment for EOL'd Micron 60-series SDRAM (vs MT48LC4M32B2B5-7G (NRND))
- Industrial temperature option in same VFBGA-90 package (vs MT48LC4M32B2B5-7 IT:G)
- Faster 166 MHz CL3 speed grade in same package (vs MT48LC4M32B2B5-6A)
설계 노트
Follow Micron TN-48-05 layout guidelines for SDRAM: matched-length traces for CLK, CKE, CS, RAS, CAS, WE within +/- 25 ps, and matched-length DQ/DQS groups within +/- 50 ps. Use a 4-layer PCB with a dedicated ground plane under the VFBGA-90 footprint to control characteristic impedance near 50 ohms. Place 0.1 uF + 10 uF decoupling within 3 mm of each VDD/VDDQ ball pair. Avoid routing signals beneath the BGA - the via fanout must exit on the top layer or via dedicated inner signal layers with continuous reference planes.
Estimated: At 143 MHz clock and 32-bit wide continuous reads, peak transient current on the 3.3 V rail can reach 175 mA. Provide a local 10 uF X5R ceramic bulk capacitor in addition to per-pin 0.1 uF decoupling to suppress VDD collapse during bank activation. Keep the 3.3 V analog supply separate from digital 3.3 V logic where possible - use a ferrite bead and star-ground routing to isolate SDRAM VDDQ/VDD from noisy digital rails.
The 90-ball VFBGA has a fine 0.8 mm ball pitch - use microvia (laser-drilled) stack-up rather than through-hole vias on the fanout to avoid stub-induced reflections at 143 MHz. Series-dampening resistors (22-33 ohms) on the CLK, command, and address lines are optional but recommended when the controller-to-SDRAM trace length exceeds 50 mm. DQM0-DQM3 must be tied to logic-low if byte masking is not used; do not float these pins.
Do not skip the 64 ms auto-refresh cycle during long idle periods - loss of refresh will corrupt DRAM contents within tens of milliseconds. Ensure CKE is asserted before the first command after power-up and that the 200 us power-on sequence (plus 1 refresh cycle) is observed before issuing MODE REGISTER SET. Never apply clocks while VDD is below 3.0 V - this can latch the part in an undefined state. The NRND status means last-time-buy windows may close without notice - qualify a second source immediately.
규정 준수 정보
RoHS compliant per Micron product page. Not AEC-Q100 qualified - the part is intended for commercial/industrial embedded use. Lifecycle is NRND per Micron's 60-series SDRAM end-of-life announcement.
