MTFC128GAVATTC-AIT-TR - 1Tbit UFS 3.1 SLC NAND Flash | Micron
부품 번호: MTFC128GAVATTC-AIT-TR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.75 | $387.50 |
| 100 | $35.2 | $3,520.00 |
| 500 | $31.8 | $15,900.00 |
| 1,000 | $28.95 | $28,950.00 |
MTFC128GAVATTC-AIT-TR 개요
A Universal Flash Storage (UFS) device is a JEDEC-standardized embedded non-volatile memory that integrates a NAND flash array with an on-die controller, presenting a high-speed serial interface to the host. UFS belongs to the broader category of managed NAND solutions, sitting between raw NAND (which requires an external controller) and full eMMC (its parallel-interface predecessor). UFS 3.1 specifically doubles the per-lane throughput of UFS 2.1, making it the preferred boot + bulk-storage medium in modern smartphones, automotive infotainment heads, and ADAS platforms.
Key features of the MTFC128GAVATTC-AIT-TR include sequential read performance tuned for UFS 3.1 HS-Gear4 lanes, integrated LDPC error correction, deep power-down and hibernation modes for low standby current, and a wide industrial operating temperature range. The device supports a 2.4 V to 2.7 V supply range and a reference clock of 38.4 MHz. The 153-LFBGA package provides a compact footprint suitable for mobile and space-constrained embedded designs.
Architecturally, the part uses Micron's 96-layer (or generation-equivalent) 3D SLC NAND array with a dedicated flash controller that handles wear-leveling, bad-block management, and thermal throttling. Compared with planar MLC/TLC UFS, the SLC variant delivers higher endurance, lower bit-error rate, and faster write latency, at the cost of lower density per die.
Typical applications include automotive infotainment and telematics systems, industrial IoT gateways with on-board storage, AI edge inference modules logging sensor data, ruggedized handhelds, and high-end smartphone boot + data partitions where SLC endurance is preferred. The industrial temperature grade also suits outdoor surveillance and factory-floor equipment.
When designing in this UFS device, ensure the host processor's UFS host interface (typically MIPI M-PHY + UniPro) supports the 3.1 revision and that PCB routing preserves the 90-ohm differential impedance of the HS-Gear lanes. Decoupling caps should be placed close to the VCC balls and a clean 38.4 MHz reference clock must be provided.
This page synthesizes Micron distributor pricing, true drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet summary, helping engineers shortlist, qualify, and source the right UFS 3.1 device in days rather than weeks.
드롭인 대체품: MTFC128GAVATTC-AIT-TR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MTFC128GAVATTC-AIT-TR (동일 폼 팩터 및 풋프린트) — 차이점: Memory Type, Package, Automotive Qualification, Memory Size, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MTFC128GAVATTC-AAT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFC256GAVATTC-AIT
✅ 드롭인✓ 재고 있음
$51.2 / 개
데이터시트 보기 →MTFC128GAZAQJP-AIT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFC256GAVATTC-AAT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFC128GAVATTC-AIT
✅ 드롭인✓ 재고 있음
$13.6 / 개
데이터시트 보기 →MTFC128GAVATTC-AIT-TR 최대 정격 & 전기적 특성
| 메모리 유형 | Non-Volatile FLASH - NAND (SLC) |
| Storage Standard | UFS 3.1 |
| 메모리 크기 | 1 Tbit (128 GB) |
| Memory Organization | 128G x 8 |
| 인터페이스 유형 | UFS (MIPI M-PHY + UniPro) |
| Clock Frequency | 38.4 MHz (reference clock) |
| 공급 전압 | 2.4 V to 2.7 V |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 153-LFBGA (11.5 x 13 mm) |
| 실장 유형 | Surface Mount |
| Supply Configuration | Tape and Reel (TR) |
| Sector Size / ECC | Integrated LDPC ECC |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
MTFC128GAVATTC-AIT-TR 153-lfbga (11.5 x 13 mm) 핀 구성 가이드
MTFC128GAVATTC-AIT-TR(153-lfbga (11.5 x 13 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MTFC128GAVATTC-AIT-TR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MTFC128GAVATTC-AIT-TR 적합 용도: 6 애플리케이션s: Automotive Infotainment Storage, Industrial IoT Gateway Storage, Edge AI Inference Module, Ruggedized Handheld / Field Computer, Outdoor Surveillance NVR / Edge Recorder, High-End Smartphone Boot + Data Partition.
Automotive Infotainment Storage
The MTFC128GAVATTC-AIT-TR's UFS 3.1 interface (MIPI M-PHY HS-Gear4, ~23.2 Gbps per lane) and 128 GB SLC density make it a strong fit for in-cabin infotainment boot partitions and map/telemetry caches. SLC endurance (typically 60k-100k P/E cycles) outlasts TLC in write-heavy log paths such as dashcam loops and OTA staging areas. The 153-LFBGA footprint routes cleanly under BGA fanout, and the 2.5 V supply simplifies PMIC co-design. Note: AEC-Q100 programs require the AAT variant, but the AIT-TR suits non-automotive fleet telematics that still demand industrial temperature grade.
추천
Industrial IoT Gateway Storage
Industrial IoT gateways stream sensor data continuously and need storage that survives wide temperature swings and constant writes. The MTFC128GAVATTC-AIT-TR's -40C to +85C industrial temperature range, SLC endurance, and UFS 3.1 throughput (~2.4 GB/s sequential read) provide reliable local buffering before backhaul transmission. The 153-LFBGA is footprint-compatible with most IoT SoM designs that pair a host AP with managed NAND. Deep power-down modes drop standby current below 1 mA, critical for solar- or battery-powered edge nodes.
추천
Edge AI Inference Module
Edge AI inference modules running CNNs on video or audio streams need to load multi-hundred-MB model weights quickly at boot and write inference metadata continuously. The MTFC128GAVATTC-AIT-TR delivers UFS 3.1 HS-Gear4 sequential read speeds (~2.3 GB/s), enabling sub-second model load times for 128 GB of weights or cache. SLC's high endurance handles the constant write traffic from event logs and feature captures. The 11.5 x 13 mm BGA fits beneath heat-spreader lids on compact SoMs used in smart-camera and acoustic-AI designs.
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Ruggedized Handheld / Field Computer
Ruggedized handhelds used by field-service technicians, military, and emergency responders need storage tolerant of shock, vibration, and wide temperature cycles. The MTFC128GAVATTC-AIT-TR's soldered 153-LFBGA package eliminates the connector reliability issues of microSD cards, and its industrial -40C to +85C range covers arctic-to-desert field conditions. UFS 3.1's deep power-down plus SLC's predictable write latency translate to longer battery life and faster app launch in the field.
추천
Outdoor Surveillance NVR / Edge Recorder
Outdoor network video recorders and edge-camera recorders require storage that survives -40C winters and continuous HD-stream writes. The MTFC128GAVATTC-AIT-TR's SLC endurance and industrial temperature grade suit write-once-read-many surveillance workloads better than TLC alternatives. UFS 3.1's HS-Gear lanes accept multi-stream 4K ingest without frame drops, and the 128 GB capacity typically retains 7-14 days of rolling HD footage at standard bitrates.
추천
High-End Smartphone Boot + Data Partition
Premium smartphones that boot Android and host user data partitions benefit from UFS 3.1's sequential throughput; the MTFC128GAVATTC-AIT-TR's 128 GB SLC tier is particularly attractive for security-sensitive enterprise handsets where SLC's lower bit-error rate enables faster secure-erase and longer data-retention guarantees. The 153-LFBGA integrates under the SoC's PMIC footprint, and the 2.5 V supply aligns with mainstream smartphone PMICs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MTFC128GAVATTC-AIT-TR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MTFC128GAVATTC-AAT | MTFC256GAVATTC-AIT | MTFC128GAZAQJP-AIT | MTFC256GAVATTC-AAT | MTFC128GAVATTC-AIT |
|---|---|---|---|---|---|---|
| Package | 153-LFBGA (11.5x13 mm) | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same |
| Brand | Micron Technology | Micron Technology - same | Micron Technology - same | Micron Technology - same | Micron Technology - same | Micron Technology - same |
| Density | 128 GB | 128 GB | 256 GB (+100%) | 128 GB | 256 GB (+100%) | 128 GB |
| Temperature Grade | Industrial (-40C to +85C) | Automotive (-40C to +105C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Automotive (-40C to +105C) | Industrial (-40C to +85C) |
| AEC-Q100 Qualified | No | Yes | No | No | Yes | No |
| NAND Type | SLC | SLC | SLC | SLC | SLC | SLC |
| Interface | UFS 3.1 | UFS 3.1 | UFS 3.1 | UFS 3.1 | UFS 3.1 | UFS 3.1 |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
주요 차별점
- Industrial temperature grade at non-automotive price point (vs MTFC128GAVATTC-AAT)
- Tape-and-reel packaging for high-volume SMT (vs MTFC128GAVATTC-AIT (tray))
- SLC endurance vs typical TLC UFS alternatives (vs Generic TLC UFS 3.1)
설계 노트
Route the MIPI M-PHY HS-Gear4 differential pairs (REF_CLK_P/N and the two TX/RX lanes) with controlled 90-ohm differential impedance on the top layer, keeping length matching within 0.13 mm (5 mil). Place the 153-LFBGA on a microvia-in-pad stackup so the center balls (VCC, VCCQ) bond directly to inner power planes. Reference the Micron managed-NAND mechanical drawing for ball A1 orientation; mis-orientation is the most common prototype-build error.
UFS 3.1 devices draw substantial inrush current (up to 1 A peak) during HS-Gear initialization. Place a 10 uF X7R ceramic plus 1 uF X7R decoupling capacitor within 2 mm of each VCC ball pair. Source the 2.5 V rail from a PMIC LDO with at least 100 mV headroom above the dropout at full load to prevent link-training failures. Add bulk tantalum or polymer capacitance (>= 47 uF) on the rail to absorb burst writes.
The 38.4 MHz reference clock must meet MIPI M-PHY jitter specifications (typically < 5 ps RMS). A noisy reference clock directly translates to UPI/UFS link errors and degraded sequential throughput. Use a dedicated clock generator or PLL rather than sharing the SoC's general-purpose oscillator. Maintain a clock island isolated from switching-power loops on the PCB.
Estimated: at sustained 1 GB/s write throughput, the 153-LFBGA dissipates approximately 1.5 W internally. With a typical theta_JA of 28 C/W on a 4-layer JEDEC test board, junction temperature rise is ~42 C above ambient. For enclosed industrial housings with 60 C ambient, consider a thermal pad under the package lid or a copper coin in the PCB stack-up to keep Tj below 105 C.
Do NOT assume the host's UFS controller can drive UFS 3.1 if it was qualified for UFS 2.1 - verify the controller IP revision explicitly. Do not mix UFS descriptor-table revisions between MTFC128GAVATTC and MPNs from other firmware generations on the same PCB; the host boot ROM may mis-handle the LUN topology. Always validate with Micron's UFS Sample Application Note before committing the layout.
규정 준수 정보
RoHS and REACH compliant per Micron product page. The AIT suffix denotes industrial temperature grade (-40C to +85C) and is NOT AEC-Q100 qualified. For automotive applications, choose the AAT variant. Halogen-free status not explicitly stated in the verified data.
