N25Q064A13EF8A0E - 64Mb SPI NOR Flash 108MHz | Micron
부품 번호: N25Q064A13EF8A0E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.95 | $395.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.2 | $3,200.00 |
N25Q064A13EF8A0E 개요
A serial NOR Flash is a nonvolatile memory device that stores code and data and is read over a serial bus (SPI) using a memory-mapped execute-in-place (XIP) model. In the system hierarchy, NOR Flash occupies the code-storage tier between boot ROM and DRAM/NAND mass storage, providing random access for direct code execution without copying to RAM first.
Key features of the N25Q064A13EF8A0E include 64 Mb density, 108 MHz SPI operation in standard, dual, and quad I/O modes, and an automotive-grade temperature profile. The multiple I/O architecture reduces instruction overhead and improves effective read bandwidth compared to single-I/O SPI Flash, accelerating boot times in embedded processors. The exposed-pad DFN package provides good thermal and electrical grounding and a compact 8 x 6 mm footprint.
Technically, the device uses 65 nm NOR floating-gate technology with sector and block erase organization, program/erase suspend capability, and XIP modes that allow the host controller to execute code directly from the Flash array. Power-up and power-down behavior, rescue sequences, and AC reset specifications are fully documented in the manufacturer datasheet to ensure deterministic system startup.
Typical applications include BIOS/code storage in embedded x86 and ARM systems, boot firmware for networking equipment, automotive telematics and infotainment modules, and FPGA configuration storage where quad-SPI read bandwidth shortens configuration time.
Design consideration: keep SPI trace lengths short and matched for quad-I/O operation at 108 MHz, and verify power-up timing against the datasheet power-up requirements to avoid false device lockout states.
This page synthesizes distributor pricing, verified drop-in alternatives, pinout data, and practical design notes in one place - information not consolidated in the manufacturer datasheet alone.
드롭인 대체품: N25Q064A13EF8A0E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: N25Q064A13EF8A0E (동일 폼 팩터 및 풋프린트) — 차이점: Interface, Memory Type, Package, Packaging, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
N25Q064A13EF8A0F
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1.38 / 개
데이터시트 보기 →MT25QL064ABB8E12-0AAT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
N25Q064A13EF8A0E
✅ 드롭인✓ 재고 있음
$3.2 / 개
데이터시트 보기 →W25Q64JVZPIQ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT25QL064ABB8ESF-0AAT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
N25Q064A13EF8A0E 사양
| 메모리 크기 | 64 Mb (8 MB) |
| 메모리 유형 | NOR Flash |
| 인터페이스 | SPI - Multiple I/O (Standard, Dual, Quad) |
| 최대 클록 주파수 | 108 MHz |
| 공급 전압 | 3 V |
| Technology | 65 nm NOR |
| 패키지 | 8-VDFPN (MLP8) 8 x 6 mm |
| 실장 유형 | Surface Mount |
| Grade | Automotive |
| XIP Mode | Yes (Execute-In-Place, confirmation-bit activated) |
| Program/Erase Suspend | Yes |
| Power-Down / Reset | AC reset specifications per datasheet |
| Packaging | Tray |
N25Q064A13EF8A0E 핀 구성
| 핀 1 | S# — Chip select (active low) |
| 핀 2 | DQ1 / SO — Serial data output / DQ1 in multiple I/O modes |
| 핀 3 | W# / DQ0 — Write protect (active low) / DQ0 in multiple I/O modes |
| 핀 4 | HOLD# / DQ3 — Hold (active low) / DQ3 in multiple I/O modes |
| 핀 5 | VSS — Ground |
| 핀 6 | VCC — 3 V power supply |
| 핀 7 | C — Serial clock input |
| 핀 8 | DQ2 — DQ2 in quad I/O modes |
일반적인 애플리케이션
N25Q064A13EF8A0E 적합 용도: 6 애플리케이션s: Embedded BIOS / Boot Code Storage, Automotive Telematics and Infotainment, Networking Equipment Boot Storage, FPGA Configuration Storage, Industrial Control and Automation Modules, Consumer and IoT Hub Firmware Storage.
Embedded BIOS / Boot Code Storage
The N25Q064A13EF8A0E stores BIOS and boot firmware in embedded x86 and ARM controllers, where its 64 Mb density comfortably holds compressed UEFI images and its 108 MHz quad-I/O SPI interface shortens boot fetch time versus 33-50 MHz single-I/O parts. In XIP mode, confirmed via the datasheet's confirmation-bit settings, the processor executes startup code directly from the array, removing the need for code-shadowing RAM during early boot. Place it on the SPI bus behind a level-matched 3 V rail with 0.1 uF decoupling at VCC, and keep clock-to-data trace skew tight to sustain quad read rates at full speed.
추천
Automotive Telematics and Infotainment
Distributor listings classify the N25Q064A13EF8A0E as automotive grade, making it well suited for telematics control units, infotainment boot storage, and gateway modules where code retention and AEC-level quality expectations apply. The 65 nm NOR cell technology provides reliable nonvolatile retention across the automotive temperature envelope, and the 8 x 6 mm VDFPN package fits dense ECUs. Designers should honor the datasheet's power-up/power-down requirements and AC reset specifications, since automotive supply transients can otherwise leave the device in an indeterminate state; the documented rescue sequence protects array integrity during power-loss events.
추천
Networking Equipment Boot Storage
Routers, switches, and base-station cards use the N25Q064A13EF8A0E to hold bootloaders and golden firmware images. The quad-I/O SPI interface at 108 MHz delivers the read bandwidth needed for fast POST and image decompression, while program/erase suspend lets the CPU interrupt a background firmware update to service interrupts without stalling the system. The 8 MB capacity typically accommodates dual-slot redundancy schemes. Layout-wise, series resistors of 22-33 ohm on SPI lines control ringing at 108 MHz, and the exposed pad should be soldered to a solid ground pour for signal-integrity grounding.
추천
FPGA Configuration Storage
The N25Q064A13EF8A0E serves as the master-configuration bitstream memory for FPGAs supporting quad-SPI load modes. Its 64 Mb capacity holds multiple configuration images or one large mid-range FPGA bitstream with margin, and 108 MHz quad reads reduce configuration time to the millisecond range, satisfying fast-power-up system requirements. XIP support additionally allows soft-processor code to run directly from the same device. Verify the datasheet's XIP confirmation-bit entry sequence against the FPGA vendor's configuration controller, and account for the documented power-up timing so the FPGA never clocks the device before it is ready.
추천
Industrial Control and Automation Modules
PLCs, motor-drive controllers, and I/O modules use the N25Q064A13EF8A0E for parameter storage, firmware, and calibration tables. The 65 nm NOR technology provides the nonvolatile integrity required in electrically noisy industrial environments, and the automotive-grade classification adds margin over commercial-grade alternatives. Program/erase suspend is particularly valuable here: a logging or parameter-write operation can be suspended so the real-time control loop keeps executing, meeting deterministic response requirements. The industrial temperature environment and wide 3 V supply operation simplify integration into 3.3 V control boards without level shifting.
추천
Consumer and IoT Hub Firmware Storage
Smart-home hubs, set-top boxes, and IoT gateways store bootloader plus application firmware on the N25Q064A13EF8A0E. The 8 MB density supports OTA dual-bank schemes - download the new image to a spare region, verify, then swap - and the 108 MHz quad-SPI read keeps boot-to-application time short, which users perceive as instant-on behavior. The compact 8 x 6 mm exposed-pad package suits miniaturized hub PCBs. Evaluate the Winbond W25Q64JV WSON-8 cross-brand alternative for cost-driven consumer BOMs, but budget engineering time for command-set and XIP firmware revalidation before dual-sourcing.
추천
추천 제품 요약
엔지니어링 참조 데이터: N25Q064A13EF8A0E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | N25Q064A13EF8A0F | MT25QL064ABB8E12-0AAT | N25Q064A13EF8A0E (Alliance Memory) | W25Q64JVZPIQ |
|---|---|---|---|---|---|
| Package | 8-VDFPN (MLP8) 8 x 6 mm | 8-VDFPN (MLP8) 8 x 6 mm - same | 8-VDFPN (MLP8) 8 x 6 mm - same | 8-VDFPN (MLP8) 8 x 6 mm - same | WSON-8 8 x 6 mm - same footprint |
| Brand | Micron Technology | Micron Technology | Micron Technology | Alliance Memory (Micron second source) | Winbond |
| Memory Size | 64 Mb (8 MB) | 64 Mb | 64 Mb | 64 Mb | 64 Mb |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 133 MHz |
| Supply Voltage | 3 V | 3 V | 3 V | 3 V | 2.7-3.6 V |
| Multiple I/O (Dual/Quad SPI) | Yes | Yes | Yes | Yes | Yes |
| XIP Mode Entry | Confirmation-bit setting (Micron scheme) | Same (Micron scheme) | Micron scheme (verify deltas) | Same (Micron scheme) | Winbond scheme - differs, firmware change needed |
| Technology | 65 nm NOR | 65 nm NOR | MT25Q generation NOR (newer node) | 65 nm NOR | Winbond generation NOR |
주요 차별점
- 108 MHz multiple-I/O SPI with Micron-native XIP (vs W25Q64JVZPIQ)
- Identical-part-number second source availability (vs MT25QL064ABB8E12-0AAT)
- Automotive-grade classification on 65 nm NOR (vs W25Q64JVZPIQ)
설계 노트
At 108 MHz SPI operation, treat the quad-I/O bus as a controlled signal path: keep SCLK-to-DQ trace length mismatch under ~5 mm and add 22-33 ohm series resistors on clock and data lines to damp reflections on typical FR-4. The DQ2 line (pin 8) and DQ3/HOLD# line (pin 4) are unused in legacy single-I/O systems - bias them with weak pull-ups so they never float during power-up, or the device may misread mode-entry sequences during XIP activation.
The datasheet devotes explicit sections to power-up/power-down requirements and power-loss rescue sequences - follow them. Provide monotonic 3 V rail ramp-up; a non-monotonic or slow-rising supply can leave the internal state machine in an invalid state at boot. Estimated: with 0.1 uF ceramic at VCC plus a 10 uF bulk capacitor, supply ripple at the package stays within typical SPI Flash noise margins; verify against the datasheet VCC ramp specification (not restated here) rather than this estimate.
XIP entry and termination require specific confirmation-bit settings, and terminating XIP after a controller plus memory reset follows a separate documented sequence - firmware that resets the SPI controller without running the termination sequence can leave the device locked in XIP mode with a reduced command set. Similarly, WP# (pin 3) is multiplexed with DQ0: grounding it for write protection disables the DQ0 role, breaking SPI communication. During second-sourcing to Winbond W25Q64, remember the command sets differ - validate all firmware paths, not just read/program.
The exposed pad of the 8-VDFPN (8 x 6 mm) package is the primary ground connection - connect it to a solid ground pour with an array of thermal vias, not just to pin 5 (VSS). Trailing thermal reliefs under the pad degrade both grounding and signal return paths at 108 MHz. Place the 0.1 uF decoupling capacitor within 2 mm of pin 6 (VCC). If your assembler struggles with the exposed-pad DFN void rate, specify X-ray inspection in the assembly traveler for automotive builds.
규정 준수 정보
Distributor listings (Mouser, DigiKey) classify the part as automotive grade; detailed RoHS/REACH/AEC-Q100 status must be confirmed from the Micron compliance documents on the official part-detail page.
