N25Q064A13EF8A0E - 64Mb SPI NOR Flash 108MHz | Micron
MPN: N25Q064A13EF8A0E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.95 | $395.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.2 | $3,200.00 |
Drop-in alternatives for N25Q064A13EF8A0E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
N25Q064A13EF8A0F
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
MT25QL064ABB8E12-0AAT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
N25Q064A13EF8A0E
β Drop-Inβ In Stock
$3.2 / Unit
View Datasheet βW25Q64JVZPIQ
β Drop-Inπ Reference alternative (not in catalog)
MT25QL064ABB8ESF-0AAT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
N25Q064A13EF8A0E Maximum Ratings & Electrical Characteristics
| Memory Size | 64 Mb (8 MB) |
| Memory Type | NOR Flash |
| Interface | SPI - Multiple I/O (Standard, Dual, Quad) |
| Maximum Clock Frequency | 108 MHz |
| Supply Voltage | 3 V |
| Technology | 65 nm NOR |
| Package | 8-VDFPN (MLP8) 8 x 6 mm |
| Mounting Type | Surface Mount |
| Grade | Automotive |
| XIP Mode | Yes (Execute-In-Place, confirmation-bit activated) |
| Program/Erase Suspend | Yes |
| Power-Down / Reset | AC reset specifications per datasheet |
| Packaging | Tray |
N25Q064A13EF8A0E Pin Configuration
| Pin 1 | S# β Chip select (active low) |
| Pin 2 | DQ1 / SO β Serial data output / DQ1 in multiple I/O modes |
| Pin 3 | W# / DQ0 β Write protect (active low) / DQ0 in multiple I/O modes |
| Pin 4 | HOLD# / DQ3 β Hold (active low) / DQ3 in multiple I/O modes |
| Pin 5 | VSS β Ground |
| Pin 6 | VCC β 3 V power supply |
| Pin 7 | C β Serial clock input |
| Pin 8 | DQ2 β DQ2 in quad I/O modes |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
N25Q064A13EF8A0E is suitable for 6 applications: Embedded BIOS / Boot Code Storage, Automotive Telematics and Infotainment, Networking Equipment Boot Storage, FPGA Configuration Storage, Industrial Control and Automation Modules, Consumer and IoT Hub Firmware Storage.
Embedded BIOS / Boot Code Storage
The N25Q064A13EF8A0E stores BIOS and boot firmware in embedded x86 and ARM controllers, where its 64 Mb density comfortably holds compressed UEFI images and its 108 MHz quad-I/O SPI interface shortens boot fetch time versus 33-50 MHz single-I/O parts. In XIP mode, confirmed via the datasheet's confirmation-bit settings, the processor executes startup code directly from the array, removing the need for code-shadowing RAM during early boot. Place it on the SPI bus behind a level-matched 3 V rail with 0.1 uF decoupling at VCC, and keep clock-to-data trace skew tight to sustain quad read rates at full speed.
Recommended
Automotive Telematics and Infotainment
Distributor listings classify the N25Q064A13EF8A0E as automotive grade, making it well suited for telematics control units, infotainment boot storage, and gateway modules where code retention and AEC-level quality expectations apply. The 65 nm NOR cell technology provides reliable nonvolatile retention across the automotive temperature envelope, and the 8 x 6 mm VDFPN package fits dense ECUs. Designers should honor the datasheet's power-up/power-down requirements and AC reset specifications, since automotive supply transients can otherwise leave the device in an indeterminate state; the documented rescue sequence protects array integrity during power-loss events.
Recommended
Networking Equipment Boot Storage
Routers, switches, and base-station cards use the N25Q064A13EF8A0E to hold bootloaders and golden firmware images. The quad-I/O SPI interface at 108 MHz delivers the read bandwidth needed for fast POST and image decompression, while program/erase suspend lets the CPU interrupt a background firmware update to service interrupts without stalling the system. The 8 MB capacity typically accommodates dual-slot redundancy schemes. Layout-wise, series resistors of 22-33 ohm on SPI lines control ringing at 108 MHz, and the exposed pad should be soldered to a solid ground pour for signal-integrity grounding.
Recommended
FPGA Configuration Storage
The N25Q064A13EF8A0E serves as the master-configuration bitstream memory for FPGAs supporting quad-SPI load modes. Its 64 Mb capacity holds multiple configuration images or one large mid-range FPGA bitstream with margin, and 108 MHz quad reads reduce configuration time to the millisecond range, satisfying fast-power-up system requirements. XIP support additionally allows soft-processor code to run directly from the same device. Verify the datasheet's XIP confirmation-bit entry sequence against the FPGA vendor's configuration controller, and account for the documented power-up timing so the FPGA never clocks the device before it is ready.
Recommended
Industrial Control and Automation Modules
PLCs, motor-drive controllers, and I/O modules use the N25Q064A13EF8A0E for parameter storage, firmware, and calibration tables. The 65 nm NOR technology provides the nonvolatile integrity required in electrically noisy industrial environments, and the automotive-grade classification adds margin over commercial-grade alternatives. Program/erase suspend is particularly valuable here: a logging or parameter-write operation can be suspended so the real-time control loop keeps executing, meeting deterministic response requirements. The industrial temperature environment and wide 3 V supply operation simplify integration into 3.3 V control boards without level shifting.
Recommended
Consumer and IoT Hub Firmware Storage
Smart-home hubs, set-top boxes, and IoT gateways store bootloader plus application firmware on the N25Q064A13EF8A0E. The 8 MB density supports OTA dual-bank schemes - download the new image to a spare region, verify, then swap - and the 108 MHz quad-SPI read keeps boot-to-application time short, which users perceive as instant-on behavior. The compact 8 x 6 mm exposed-pad package suits miniaturized hub PCBs. Evaluate the Winbond W25Q64JV WSON-8 cross-brand alternative for cost-driven consumer BOMs, but budget engineering time for command-set and XIP firmware revalidation before dual-sourcing.
Recommended
Recommended Products Summary
Engineering reference data for N25Q064A13EF8A0E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | N25Q064A13EF8A0F | MT25QL064ABB8E12-0AAT | N25Q064A13EF8A0E (Alliance Memory) | W25Q64JVZPIQ |
|---|---|---|---|---|---|
| Package | 8-VDFPN (MLP8) 8 x 6 mm | 8-VDFPN (MLP8) 8 x 6 mm - same | 8-VDFPN (MLP8) 8 x 6 mm - same | 8-VDFPN (MLP8) 8 x 6 mm - same | WSON-8 8 x 6 mm - same footprint |
| Brand | Micron Technology | Micron Technology | Micron Technology | Alliance Memory (Micron second source) | Winbond |
| Memory Size | 64 Mb (8 MB) | 64 Mb | 64 Mb | 64 Mb | 64 Mb |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 133 MHz |
| Supply Voltage | 3 V | 3 V | 3 V | 3 V | 2.7-3.6 V |
| Multiple I/O (Dual/Quad SPI) | Yes | Yes | Yes | Yes | Yes |
| XIP Mode Entry | Confirmation-bit setting (Micron scheme) | Same (Micron scheme) | Micron scheme (verify deltas) | Same (Micron scheme) | Winbond scheme - differs, firmware change needed |
| Grade / Qualification | Automotive | Different temperature grade | [DATA_NEEDED] | Automotive | [DATA_NEEDED] |
| Technology | 65 nm NOR | 65 nm NOR | MT25Q generation NOR (newer node) | 65 nm NOR | Winbond generation NOR |
Key Differentiators
- 108 MHz multiple-I/O SPI with Micron-native XIP (vs W25Q64JVZPIQ)
- Identical-part-number second source availability (vs MT25QL064ABB8E12-0AAT)
- Automotive-grade classification on 65 nm NOR (vs W25Q64JVZPIQ)
Design Notes
At 108 MHz SPI operation, treat the quad-I/O bus as a controlled signal path: keep SCLK-to-DQ trace length mismatch under ~5 mm and add 22-33 ohm series resistors on clock and data lines to damp reflections on typical FR-4. The DQ2 line (pin 8) and DQ3/HOLD# line (pin 4) are unused in legacy single-I/O systems - bias them with weak pull-ups so they never float during power-up, or the device may misread mode-entry sequences during XIP activation.
The datasheet devotes explicit sections to power-up/power-down requirements and power-loss rescue sequences - follow them. Provide monotonic 3 V rail ramp-up; a non-monotonic or slow-rising supply can leave the internal state machine in an invalid state at boot. Estimated: with 0.1 uF ceramic at VCC plus a 10 uF bulk capacitor, supply ripple at the package stays within typical SPI Flash noise margins; verify against the datasheet VCC ramp specification (not restated here) rather than this estimate.
XIP entry and termination require specific confirmation-bit settings, and terminating XIP after a controller plus memory reset follows a separate documented sequence - firmware that resets the SPI controller without running the termination sequence can leave the device locked in XIP mode with a reduced command set. Similarly, WP# (pin 3) is multiplexed with DQ0: grounding it for write protection disables the DQ0 role, breaking SPI communication. During second-sourcing to Winbond W25Q64, remember the command sets differ - validate all firmware paths, not just read/program.
The exposed pad of the 8-VDFPN (8 x 6 mm) package is the primary ground connection - connect it to a solid ground pour with an array of thermal vias, not just to pin 5 (VSS). Trailing thermal reliefs under the pad degrade both grounding and signal return paths at 108 MHz. Place the 0.1 uF decoupling capacitor within 2 mm of pin 6 (VCC). If your assembler struggles with the exposed-pad DFN void rate, specify X-ray inspection in the assembly traveler for automotive builds.
Compliance Information
Distributor listings (Mouser, DigiKey) classify the part as automotive grade; detailed RoHS/REACH/AEC-Q100 status must be confirmed from the Micron compliance documents on the official part-detail page.
