P1011NXN2DFB - QorIQ P1 PowerPC e500v2 MPU, 800MHz, 689-TEPBGA | NXP
부품 번호: P1011NXN2DFB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145.5 | $145.50 |
| 10 | $132 | $1,320.00 |
| 100 | $118.5 | $11,850.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92.5 | $92,500.00 |
P1011NXN2DFB 개요
A microprocessor (MPU) is a single-chip CPU that integrates a processing core, cache, memory controller, and peripheral interfaces into one package. QorIQ P1 series parts belong to NXP's Power Architecture communications-processor family; they sit beneath the P2 tier in the QorIQ hierarchy and represent the lowest-power single-core option for Ethernet-attached networking equipment.
Key features of the P1011NXN2DFB include 32 KB I-cache and 32 KB D-cache per core, 256 KB of L2 cache with ECC, a 64-bit DDR2/DDR3 SDRAM memory controller with ECC support, dual triple-speed Ethernet (1/2.5 Gbps capable), a PCIe interface, USB 2.0, two TDM ports, and a Security Engine for protocol acceleration. The 689-TEPBGA package exposes all of these interfaces plus JTAG, GPIO, and SerDes, giving board designers a single SoC for managed industrial gateways.
The P1011 silicon combines a Power Architecture e500v2 super-scalar core clocked up to 800 MHz with hardware accelerators and on-chip SRAM. Compared with the dual-core P1020, P1011 halves the core count but retains the same peripherals and is pin-compatible within the 689-TEPBGA footprint, letting customers scale board designs without changing the PCB.
Typical applications include industrial Ethernet switches, factory-floor protocol gateways, smart-grid substation equipment, networked PLC controllers, and small-form-factor industrial routers. The -40C to +125C operating range and the integrated GbE/PCIe/USB bring-up simplicity also suit outdoor cellular backhaul and SCADA remote terminal units.
When designing with this device, allocate adequate PCB layer count (typically 8-10) for the 689-ball BGA fan-out and follow NXP's reference decoupling scheme (1 uF and 100 nF near each power rail). NXP's QorIQ P1 hardware design checklist should be consulted to validate SerDes reference-clock jitter and DDR3 fly-by routing rules.
드롭인 대체품: P1011NXN2DFB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1011NXE2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1011NSN2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1011NSN2FFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1011NXN2DFB 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 800 MHz |
| 동작 온도 | -40C to +125C |
| 패키지 | 689-TEPBGA II (31x31 mm) |
| 실장 유형 | Surface Mount |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Triple-speed GbE (1/2.5 Gbps) |
| PCIe | PCIe interface |
| USB | USB 2.0 |
| TDM | 2 x TDM ports |
| Silicon Revision | 1.1 |
| Security Engine | Integrated |
| Cache (L1 I + D) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 256 KB with ECC |
| MSL 레벨 | 3 (per JEDEC J-STD-020, large BGA) |
P1011NXN2DFB 689-tepbga ii (31x31 mm) 핀 구성 가이드
P1011NXN2DFB(689-tepbga ii (31x31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1011NXN2DFB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1011NXN2DFB 적합 용도: 7 애플리케이션s: Industrial Ethernet Switch, Smart-Grid Substation Equipment, Networked PLC Controller, Outdoor Cellular / Industrial Router, SCADA Remote Terminal Unit, Edge Protocol Gateway, Compact Industrial Gateway with Cellular Failover.
Industrial Ethernet Switch
The P1011NXN2DFB's integrated triple-speed GbE (1/2.5 Gbps) controllers reduce or eliminate external MAC PHYs in unmanaged and lightly managed industrial switches. Placing the SoC near the front-panel RJ45s keeps MAC-to-PHY traces short and simplifies EMI compliance. The -40C to +125C operating range handles cabinet temperatures in factories and outdoor enclosures. The Security Engine accelerates ACL lookups while the 256 KB L2 cache accelerates packet inspection. Compared with discrete MCU + external GbE implementations, the P1011 collapses the BOM and frees board area for additional ports or SFP cages.
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Smart-Grid Substation Equipment
Substation gateways and protection equipment demand deterministic real-time behaviour and wide temperature tolerance, both of which the P1011NXN2DFB delivers via its Power Architecture e500v2 core and -40C to +125C industrial rating. The DDR2/DDR3 ECC controller protects substation memory against soft errors caused by high-voltage transients, while the integrated Security Engine handles IEC 62351 authentication and message integrity. The PCIe and USB interfaces permit direct attachment of cellular or fibre modules for SCADA backhaul. The architecture lets substation OEMs replace a discrete MCU + DSP pair with a single SoC, simplifying type-test certification.
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Networked PLC Controller
Field-mounted PLCs benefit from the P1011NXN2DFB's single-core 800 MHz performance combined with native GbE and USB host. The Power Architecture core runs deterministic control loops while the Ethernet ports carry PROFINET, EtherNet/IP, or Modbus TCP traffic directly. The 689-TEPBGA II package supports a small 8-layer PCB and the exposed thermal pad dissipates heat in sealed cabinets. Compared with ARM Cortex-A5 designs of similar cost, the e500v2 offers stronger real-time guarantees and a mature ecosystem of industrial protocol stacks.
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Outdoor Cellular / Industrial Router
Outdoor routers mounted on poles or in roadside cabinets operate across the same -40C to +125C range the P1011NXN2DFB supports. The integrated PCIe endpoint connects directly to 4G/5G modem cards or mini-PCIe radios, while the GbE ports feed RJ45 user-side ports. The Security Engine handles IPsec and SSL termination at line rate, removing the need for a separate crypto co-processor. The single Power Architecture core is sufficient for routing and tunnel handling at typical SME throughput, keeping power dissipation well within sealed-envelope budgets.
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SCADA Remote Terminal Unit
SCADA RTUs digitise sensors and forward them over IP networks using protocols such as DNP3 and IEC 60870-5. The P1011NXN2DFB runs the protocol stack natively on the e500v2 core while offloading serial protocols (TDM/HDLC) to its integrated TDM ports, which connect to legacy RS-485 / leased-line links without glue logic. The DDR2/DDR3 controller with ECC keeps the system reliable across remote sites with poor mains quality. Its wide-temperature operation and pin-compatible scaling to the dual-core P1020 make it a strong fit for retrofitting RTU designs as network throughput grows.
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Edge Protocol Gateway
Edge protocol gateways translate between industrial fieldbuses (PROFIBUS, Modbus RTU) and IP-based SCADA systems. The P1011NXN2DFB's combination of TDM, PCIe, USB, GbE and the integrated Security Engine allows a single chip to terminate multiple fieldbus links, run the protocol translation engine, and securely bridge to the cloud. The 800 MHz PowerPC core is more than adequate for protocol parsing while remaining cooler than higher-clock-rate ARM alternatives. The part's longevity with NXP's QorIQ SDK keeps integration costs predictable for industrial OEMs.
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Compact Industrial Gateway with Cellular Failover
Small DIN-rail gateways combine wired GbE connectivity with 4G/5G cellular failover for remote industrial sites. The P1011NXN2DFB hosts GbE for the wired side and uses PCIe lanes to connect a mini-PCIe cellular modem for failover, all within a single chip. USB 2.0 supports local diagnostics or configuration via a thumb drive. Operating over -40C to +125C and integrating a Security Engine for IPsec VPNs, the part delivers a low-BOM industrial gateway that can be installed in ventilated and non-ventilated cabinets alike.
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추천 제품 요약
엔지니어링 참조 데이터: P1011NXN2DFB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1011NXE2HFB | P1011NSN2HFB | P1011NSN2FFB |
|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 1 | 1 | 1 | 1 |
| Maximum Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
주요 차별점
- Pin-compatible upgrade to higher silicon revision (vs P1011NXE2HFB)
- Industrial-extended temperature grade (vs P1011NSN2HFB)
- Single-core simplicity scaling to dual-core (vs P1020NXE2DFB)
설계 노트
Estimated: A 689-TEPBGA II package with exposed thermal slug relies on the PCB top copper pour for heat removal. With the part's worst-case power envelope and a 4-layer board, theta_JA typically lands in the 18-22 C/W range. For sealed industrial cabinet designs running near 125C ambient, design with either a 1.0 mm copper pour spanning at least 25 cm^2 under the slug or use thermal vias on a 1.2 mm pitch to a bottom-side heat-spreader to keep junction rise under 30C.
Use an 8-layer (or 10-layer) stack-up with dedicated ground and power planes adjacent to the outer signal layers. The DDR3 interface must follow fly-by routing with lengths matched within +/-25 ps, and reference-clock SerDes nets require 100 ohm differential impedance with adjacent ground shielding. Decouple every power rail with 1 uF and 100 nF capacitors placed inside the package shadow per NXP's hardware design checklist; longer lead-length ceramics degrade the high-frequency noise floor above 50 MHz.
Many P1011 NXN2 vs NSN2 mix-ups occur when commercial temperature vs industrial temperature grades are ordered against the wrong documentation. Confirm the suffix: NXN2 = -40C to +125C, NSN2 = standard. Also note that despite a shared package, the P1011 and P1020 silicon revision differences can cause SerDes PLL lock issues if the firmware image is mis-paired - always validate with NXP's revision-specific bootloader.
규정 준수 정보
RoHS and REACH declarations for P1011NXN2DFB are not stated in the verified web data; AEC-Q100 does not apply (industrial networking MPU, not automotive grade). Lead-free assembly is assumed based on the BGA package family and NXP's standard packaging practice.
