P1021NXE2HFB - QorIQ Dual-Core 800MHz SoC | NXP
부품 번호: P1021NXE2HFB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $158.66 | $158.66 |
| 10 | $149.5 | $1,495.00 |
| 100 | $138.2 | $13,820.00 |
| 500 | $125.4 | $62,700.00 |
| 1,000 | $112.8 | $112,800.00 |
P1021NXE2HFB 개요
A QorIQ communications processor is a system-on-chip (SoC) that integrates one or more Power Architecture CPU cores with networking peripherals, security engines, and high-speed interfaces on a single die. The QorIQ P1 platform sits in NXP's networking hierarchy above single-core P1011/P1012 devices and below the higher-tier P1020/P2020 multi-core parts, serving as the bridge between entry-level microcontrollers and full multiprocessor networking SoCs.
Key features include dual 32-bit e500v2 cores at 800MHz, integrated DDR2/DDR3 memory controller with ECC, three Gigabit Ethernet interfaces, PCIe and USB 2.0 connectivity, hardware-accelerated SEC security, and the QUICC Engine for protocol offload. The 45nm process technology keeps typical power dissipation low for a dual-core networking device, while the 31x31mm TEPBGA II package provides the thermal headroom and signal-integrity escape routing required for 800MHz operation.
Typical applications include industrial gateways, network-attached storage (NAS), enterprise router line cards, defense and aerospace embedded networking, telecom control-plane processors, and secure VPN appliances. The combination of dual cores, integrated encryption, and the QUICC Engine makes the P1021 particularly suited to multi-protocol packet processing where deterministic throughput is required.
When designing with this device, plan thermal management around the TEPBGA II 31x31mm land pattern: a minimum 8-layer PCB with stitched ground vias beneath the package is recommended for the 800MHz speed grade. The NXP P1021 product family datasheet contains validated reference schematics and BSDL files for production integration.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate availability and end-of-life risk before committing to a new design.
드롭인 대체품: P1021NXE2HFB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P1021NXE2HFB (동일 폼 팩터 및 풋프린트) — 차이점: USB, Ethernet, Mounting Type, Operating Temperature, Memory Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1021NSE2HFB
✅ 드롭인✓ 재고 있음
$98.75 / 개
데이터시트 보기 →P1021NXN2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1012NXE2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1011NXN2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1021PSE2FDQAA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1012NSE2HFB
✅ 드롭인✓ 재고 있음
$52.75 / 개
데이터시트 보기 →P1021NXE2HFB 최대 정격 & 전기적 특성
| Part Number | P1021NXE2HFB |
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Core Frequency (Max) | 800 MHz |
| 데이터 버스 폭 | 32-bit |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 3x Gigabit Ethernet (GbE) |
| PCIe | Yes |
| USB | USB 2.0 |
| Security Engine (SEC) | Yes (hardware-accelerated) |
| QUICC Engine (QE) | Yes, revision r1.1 |
| 패키지 | 689-TEPBGA II (31x31 mm) |
| 동작 온도 | -40C to +125C (industrial/extended) |
| Process Technology | 45 nm |
| Speed Bin | 800/400/667 MHz |
| 수명 주기 상태 | End of Life (per NXP product page) |
| RoHS | Compliant (per distributor listings) |
P1021NXE2HFB 689-tepbga ii (31x31 mm) 핀 구성 가이드
P1021NXE2HFB(689-tepbga ii (31x31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1021NXE2HFB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1021NXE2HFB 적합 용도: 6 애플리케이션s: Industrial Secure Router Gateway, Network-Attached Storage (NAS) Controller, Defense and Aerospace Embedded Networking, Telecom Control-Plane Processor, VPN and Secure Appliance, Industrial Automation Controller.
Industrial Secure Router Gateway
The P1021NXE2HFB's dual e500v2 cores at 800MHz, three Gigabit Ethernet MACs, and hardware SEC engine make it an ideal control-and-data plane host for industrial router gateways. With one core handling Linux routing/control and the other managing encrypted VPN throughput via the SEC, the SoC sustains line-rate IPSec on multiple GbE ports. The -40C to +125C operating range supports deployment in outdoor cabinets and factory floors without additional thermal conditioning, while the QUICC Engine r1.1 offloads legacy protocol framing.
추천
Network-Attached Storage (NAS) Controller
Dual 800MHz e500v2 cores provide the parallelism needed for NAS controllers running RAID, file-system, and network-stack workloads simultaneously. The integrated DDR2/DDR3 controller with ECC supports up to 1GB or more of attached DRAM for caching, while three GbE ports enable link-aggregation or dual-network segmentation. The hardware SEC engine accelerates AES/SHA for encrypted filesystems, and the 45nm process keeps SoC power low enough for fanless NAS enclosures using only TEPBGA II heatsink copper pours.
추천
Defense and Aerospace Embedded Networking
The P1021NXE2HFB's extended -40C to +125C temperature grade and NXP's long-term QorIQ software support make it a candidate for defense and aerospace networking subsystems. Dual cores handle partitioned secure and non-secure processing, while the SEC engine provides FIPS-grade cryptography for tactical radios and UAV datalinks. The TEPBGA II 31x31mm package supports ruggedized PCB stacks with 8+ layer stack-ups required for high-speed SERDES signal integrity at 800MHz.
추천
Telecom Control-Plane Processor
Telecom control-plane tasks such as OSPF, BGP, RADIUS, and management-plane encryption demand deterministic packet processing rather than raw throughput. The P1021NXE2HFB delivers this through QUICC Engine r1.1 hardware offload of HDLC, PPP, and ATM framing, freeing the dual e500v2 cores to run the control-plane OS. DDR2/DDR3 ECC protects routing tables from soft errors, and the PCIe interface connects to DSP or framer companion chips for line-card aggregation.
추천
VPN and Secure Appliance
The hardware SEC engine on the P1021NXE2HFB accelerates AES, 3DES, SHA, and public-key operations for VPN concentrators, leaving the dual e500v2 cores free to handle tunnel management, IKE, and routing. Three Gigabit Ethernet ports support WAN/LAN/DMZ segmentation in a single appliance, while DDR3 ECC protects against memory-bit errors in always-on security gateways. The QUICC Engine provides legacy protocol termination for hybrid IP/legacy WAN deployments.
추천
Industrial Automation Controller
Factory-floor controllers benefit from the P1021NXE2HFB's dual-core isolation, where one e500v2 core runs deterministic real-time tasks (PROFINET, EtherCAT bridging via QUICC Engine) and the other runs Linux-based HMI/management workloads. The extended -40C to +125C temperature range tolerates cabinet mounting near motors and drives, while DDR3 ECC counters alpha-particle-induced upsets in always-on installations. PCIe and USB 2.0 enable expansion to industrial I/O modules and HMI touchscreens.
추천
추천 제품 요약
엔지니어링 참조 데이터: P1021NXE2HFB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1021NSE2HFB | P1021NXN2HFB | P1012NXE2HFB | P1011NXN2HFB | P1021PSE2FDQAA | P1012NSE2HFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Architecture | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 single-core | PowerPC e500v2 single-core | PowerPC e500v2 dual-core | PowerPC e500v2 single-core |
| Core Frequency (Max) | 800 MHz | 667 MHz (-17%) | 800 MHz | 800 MHz (single-core) | 800 MHz (single-core) | 667 MHz (-17%) | 667 MHz (single-core) |
| QUICC Engine | QE r1.1 | QE r1.1 | QE r1.1 | QE r1.1 | QE r1.1 | QE r1.1 | QE r1.1 |
| Security Engine | Yes (SEC) | Yes (SEC) | Yes (SEC, variant) | Yes (SEC) | Reduced (N2 subset) | Yes (SEC) | Yes (SEC) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL | EOL |
주요 차별점
- Highest dual-core frequency in QorIQ P1 EOL family (vs P1021NSE2HFB)
- Dual-core architecture for partitioned workloads (vs P1012NXE2HFB)
- Full SEC engine for hardware cryptography (vs P1011NXN2HFB)
설계 노트
The 689-TEPBGA II 31x31mm package requires an 8-layer (minimum) PCB stack-up with continuous ground planes beneath the BGA array. Place stitched ground vias on a 1.0mm pitch directly under the thermal balls to provide both thermal dissipation and a low-impedance return path for the DDR2/DDR3 and SERDES signals. Reference the NXP P1021 hardware specification for the exact ball-map escape routing recommendations; deviations from the reference stack-up may cause SI issues at 800MHz.
Estimated: at dual-core 800MHz full-load operation, the P1021NXE2HFB dissipates approximately 5-7W typical per NXP QorIQ P1 family data. With the TEPBGA II thermal resistance in the 4-6 C/W range to top-of-package, attach a small clip-on heatsink or coin and ensure 200+ LFM airflow in fanless industrial enclosures. Derate by 10% if the SEC and QE engines are simultaneously stressed.
DDR2/DDR3 routing on the P1021NXE2HFB must follow the write/read length-matching rules in the P1021 reference manual; data-byte groups must be matched within 25 mils and the address/command group within 50 mils to the controller. Use 100-ohm differential impedance for the SERDES lanes to the PCIe and SGMII interfaces. Do not route GbE signals across reference-plane splits; place ground voids only where explicitly allowed by the datasheet.
The P1021NXE2HFB requires a multi-rail supply (typically 1.0V core, 1.5V/1.8V DDR, 2.5V Ethernet, 3.3V I/O). Use NXP-recommended PMIC sequencing to bring rails up in the order specified by the reference manual; incorrect sequencing can latch-up the device. Place 10uF ceramic decoupling within 5mm of each BGA power/ground ball pair and bulk 220uF polymer near the package corners.
규정 준수 정보
RoHS and lead-free confirmed via distributor listings; REACH and halogen-free status not explicitly stated in the verified web data and marked unknown. AEC-Q100 not applicable - this is an industrial/defense networking SoC, not an automotive-qualified part.
