P1012NSN2DFB - QorIQ P1 PowerPC e500v2 MPU 800MHz | NXP
부품 번호: P1012NSN2DFB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $56.42 | $56.42 |
| 10 | $53.18 | $531.80 |
| 100 | $47.85 | $4,785.00 |
| 500 | $42.31 | $21,155.00 |
| 1,000 | $38.66 | $38,660.00 |
P1012NSN2DFB 개요
A microprocessor (MPU) is a single-chip CPU containing arithmetic logic, control logic, registers, and often integrated peripherals, distinct from a microcontroller by its higher external memory bandwidth and lack of on-chip flash. The P1012 sits within the broader taxonomy of Power Architecture embedded processors -> communications processors -> networking SoC, positioning it as a higher-integration successor to classic PowerQUICC devices while remaining within NXP's broader embedded computing portfolio.
Key features include a 32-bit e500v2 core with double-precision floating point, hardware ECC for both the L1 cache and DDR memory interface, dual GbE controllers, three PCI Express Gen 1 controllers, two USB 2.0 controllers (host + device), and a dedicated QUICC Engine subsystem supporting UTOPIA / TDM interfaces for legacy telecom. Operating temperature range spans 0C to 125C (junction), qualifying the part for thermally demanding industrial and networking environments.
The P1012 implements a hierarchical memory architecture with 32 KB L1 instruction cache and 32 KB L1 data cache per core, a 256 KB L2 platform cache, and a 32-bit DDR2/DDR3 memory controller with on-die ECC. The platform is architected for deterministic interrupt latency required by real-time control planes, with low-jitter timers and hardware-accelerated cryptography (SEC 3.1).
Typical applications include industrial routers, factory-floor switches, defense radios, smart-grid gateways, line cards for mid-range networking equipment, and protocol-conversion appliances. The integrated QUICC Engine makes it especially suited to legacy T1/E1 and HDLC-based telecom equipment where discrete FPGAs would otherwise be required.
When designing with the P1012, ensure the PCB provides a continuous ground plane under the TEBGA-689 exposed pad and that the DDR memory layout follows the fly-by topology specified in the NXP hardware reference manual. The core voltage and DDR voltage rails must ramp in the order documented in the datasheet to avoid latch-up during power sequencing.
This page synthesizes current distributor pricing, drop-in alternative listings, and practical design notes not found in the manufacturer datasheet itself, drawing on NXP product documentation, Octopart inventory, and verified distributor listings.
드롭인 대체품: P1012NSN2DFB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P1012NSN2DFB (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Operating Temperature, Processor Type, USB, Core Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1021NSN2DFB
✅ 드롭인✓ 재고 있음
$53.8 / 개
데이터시트 보기 →P1011NSN2DFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1020NSN2DFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1014NSN2DFB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1010NSN2DFB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P2020NSN2DFB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1012NSN2DFB 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Processor Type | PowerPC e500v2 |
| Series | QorIQ P1 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Max Clock Frequency | 800 MHz |
| 동작 온도 | 0C to +125C |
| 패키지 / 케이스 | 689-TEPBGA II (31x31 mm), exposed pad |
| Process Technology | 45 nm |
| L1 Cache (I/D) | 32 KB / 32 KB |
| L2 Cache | 256 KB platform cache |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Dual Gigabit Ethernet (eTSEC) |
| PCI Express | 3 x PCIe Gen 1 controllers |
| USB | 2 x USB 2.0 (host + device) |
| TDM / Telecom | QUICC Engine (UTOPIA / TDM / HDLC) |
| Cryptography | SEC 3.1 |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
P1012NSN2DFB 689-tepbga ii (31x31 mm), exposed pad 핀 구성 가이드
P1012NSN2DFB(689-tepbga ii (31x31 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1012NSN2DFB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1012NSN2DFB 적합 용도: 6 애플리케이션s: Industrial Router and Gateway, Telecom Line Card with TDM Offload, Defense and Aerospace Communication, Smart-Grid and Energy Gateway, Network Attached Storage Controller, Industrial Control and Protocol Converter.
Industrial Router and Gateway
The P1012NSN2DFB is purpose-built for industrial routers, with dual Gigabit Ethernet controllers (eTSEC), three PCI Express Gen 1 controllers, and two USB 2.0 ports that map directly to WAN/LAN, expansion, and peripheral interfaces typical of industrial gateway designs. The integrated QUICC Engine adds TDM/HDLC hardware offload for legacy serial-to-IP bridging without an external FPGA. The 45 nm process keeps typical dissipation at 3-5 W, while the 0C to 125C operating range covers factory-floor and outdoor cabinet environments. The 689-TEPBGA II footprint allows reuse of the same PCB across the entire QorIQ P1 family.
추천
Telecom Line Card with TDM Offload
For telecom line cards migrating from classic PowerQUICC to a more integrated SoC, the P1012NSN2DFB provides a single-core e500v2 host running at 800 MHz while the on-die QUICC Engine handles UTOPIA, TDM (T1/E1), and HDLC frame processing. This eliminates discrete FPGA protocol bridges, reducing BOM and PCB area. The integrated SEC 3.1 engine accelerates IPSec/SSL bulk encryption for secure VPN aggregation. With DDR2/DDR3 ECC support, the platform meets carrier-grade reliability requirements for memory SEU/SED scenarios common in central office deployments.
추천
Defense and Aerospace Communication
The P1012NSN2DFB's wide operating temperature range (0C to 125C) and integrated error correction across L1 cache and DDR memory make it well-suited for defense radios, software-defined radio platforms, and ruggedized communication gateways. The PowerPC e500v2 architecture has a long heritage in military embedded computing with mature RTOS support (VxWorks, Green Hills INTEGRITY). Hardware-accelerated cryptography via SEC 3.1 supports Type 1 / Suite B algorithms required for tactical data links. The 689-TEPBGA II package with exposed thermal pad supports conduction-cooled chassis designs common in vehicle and airborne installations.
추천
Smart-Grid and Energy Gateway
Smart-grid gateways and substation concentrators benefit from the P1012NSN2DFB's deterministic interrupt latency, dual GbE for northbound IP and southbound substation LAN, and QUICC Engine for legacy serial metering protocols (DNP3 over serial, Modbus RTU). The 800 MHz e500v2 core runs Linux with PREEMPT_RT or VxWorks to enforce the timing budgets required by IEC 61850 GOOSE messaging. Integrated ECC memory and the SEC 3.1 cryptographic engine satisfy NERC CIP and IEEE 1686 compliance requirements for substation cybersecurity.
추천
Network Attached Storage Controller
For mid-range NAS appliances, the P1012NSN2DFB provides a balance of PCIe Gen 1 lanes for SAS/SATA controller expansion (typical PCIe-to-SAS HBAs), dual GbE for link aggregation or 10 GbE upgrade path, and DDR3 ECC memory support for ZFS/Btrfs filesystem integrity. The 800 MHz e500v2 core runs FreeBSD/Linux NAS distributions efficiently for SMB/NFS/iSCSI services. Hardware-accelerated AES via SEC 3.1 enables wire-speed encrypted volume access without software throughput penalties.
추천
Industrial Control and Protocol Converter
The P1012NSN2DFB excels in protocol-conversion appliances that must bridge legacy fieldbuses (Modbus, Profibus, CANopen) to modern Ethernet/IP networks. The QUICC Engine handles serial TDM channels while the host CPU runs real-time protocol stacks. PCI Express lanes connect to FPGA-based fieldbus interfaces for Profibus or EtherCAT masters. The wide temperature range, hardware ECC, and integrated security engine make this part attractive for plant-floor controllers deployed in challenging electromagnetic and thermal environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: P1012NSN2DFB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1021NSN2DFB | P1011NSN2DFB | P1020NSN2DFB | P2020NSN2DFB |
|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 (single-core) | PowerPC e500v2 (dual-core) | PowerPC e500v2 (single-core) | PowerPC e500v2 (dual-core) | PowerPC e500v2 (dual-core) |
| Max Clock Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 1.2 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR3 with ECC (faster) |
| Gigabit Ethernet Ports | 2 | 2 | 2 | 2 | 3 |
| PCI Express Controllers | 3 x Gen 1 | 3 x Gen 1 | 3 x Gen 1 | 3 x Gen 1 | 4 x Gen 1 |
| QUICC Engine | Yes | Yes | Yes | Yes | No (replaced by DPAA) |
| Cryptographic Engine | SEC 3.1 | SEC 3.1 | SEC 3.1 | SEC 3.1 | SEC 3.1 |
| Operating Temperature | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +105C |
주요 차별점
- Integrated QUICC Engine for legacy telecom protocol offload (vs P2020NSN2DFB)
- Single-core deterministic performance (vs P1021NSN2DFB)
- Wide operating temperature range (vs P2020NSN2DFB)
설계 노트
The 689-TEPBGA II package requires the exposed thermal pad to be soldered to a continuous ground plane using an array of thermal vias (typically 0.3 mm drill, 0.6 mm pitch, filled with epoxy) for heat dissipation. At typical 3-5 W dissipation, natural convection with a 4-layer PCB ground plane keeps junction temperatures within spec. For sealed enclosures, derate ambient by 10C or add a small heatsink bonded to the top of the package.
DDR memory layout must follow fly-by topology as specified in NXP's QorIQ P1 hardware reference manual, with VTT termination at the end of the address/command fly-by chain. Matched-length routing within 25 mil tolerance across all DDR signals. Use 100 ohm differential impedance for SerDes lanes and reference the official NXP design checklist for PCIe Gen 1 coupling capacitor placement and length matching within each lane pair.
Power sequencing must follow the NXP-recommended rail order to prevent latch-up: bring up VDD_CORE first, then VDD_DDR, then VDD_SERDES, then VDD_IO. Use a power management IC with programmable sequencing (e.g., UCD9081 or equivalent) to enforce these timing constraints. Decoupling: place 0.1 uF X7R capacitors on every power pin within 2 mm trace distance, plus bulk 22 uF tantalum capacitors per voltage domain.
Do not assume QorIQ P1 family members are fully software-compatible across all sub-models - the P1021/P1012/P1011 share much of the SDK but peripheral enable masks differ. Verify software configuration against the specific device's reference manual revision. Also, when migrating from PowerQUICC III to QorIQ P1, note that the QUICC Engine subsystem is not binary-compatible with classic QUICC; firmware must be re-validated.
규정 준수 정보
RoHS compliant per NXP product page and DigiKey listing. Not AEC-Q100 qualified (industrial/comms MPU, not automotive). EOL lifecycle status - refer to NXP PCN for last-time-buy window.
