P1015SSE5FFB - QorIQ P1015 533MHz e500v2 SoC, 561-TEPBGA | NXP
부품 번호: P1015SSE5FFB ✓ 활성P1015SSE5FFB 개요
A QorIQ communications processor is a system-on-a-chip (SoC) that combines one or more Power Architecture CPU cores with high-speed networking peripherals, memory controllers, and security accelerators on a single die. The P1 family sits in NXP's mid-range networking tier, below the P2/P3 multi-core devices, and is used as a control-plane processor in routers, switches, and wireless base stations. The 'QorIQ' name was introduced when Freescale transitioned the PowerQUICC product line to Power Architecture cores.
Key features include a 32-bit PowerPC e500v2 core at 533 MHz, hardware cryptography (SEC 3.x), 32-bit DDR3 with ECC support, integrated three-port GbE switch, two PCI Express controllers, two USB 2.0 controllers (host + device), DUART, eSDHC, SPI, I2C, and TDM interfaces. The 561-TEPBGA package exposes all peripherals and provides ample signal integrity for GbE and PCIe at industrial temperature (0 to 105 C, suffix SE5 indicates 'Standard Temperature, Enhanced security, Rev 1.x, 533 MHz speed bin').
Architecturally, the P1015SSE5FFB uses a single e500v2 core with a 7-stage pipeline, Book-E MMU, and signal-processing extensions. The on-chip SEC block accelerates DES/3DES, AES, SHA-1/2, RSA, and public-key operations, offloading IPsec and TLS tasks from the CPU. The integrated three-port Gigabit Ethernet switch (with classification and QoS hardware) removes the need for an external GbE switch in small-port-count designs, lowering BOM cost for entry-level routers and CPE devices.
Typical applications include industrial routers and gateways, Ethernet switches, network appliances, defense and aerospace embedded computing, smart-grid communications, factory-floor IoT aggregation, and secure VPN concentrators. The device's hardware encryption engine makes it particularly attractive for IPsec tunnel termination in branch-office VPN appliances.
When designing with the P1015SSE5FFB, ensure the 533 MHz speed bin is sufficient for your packet-forwarding workload, and confirm DDR3-800/1066 trace lengths meet the data-sheet routing rules. The 561-TEPBGA package requires multi-layer PCB with buried vias for breakout routing; plan for at least an 8-layer stack-up with controlled-impedance Ethernet and PCIe pairs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives across the QorIQ P1 family, application notes, and practical layout guidance beyond what is found in the bare manufacturer datasheet, helping engineers select the right P1015 speed bin and verify second-source availability.
드롭인 대체품: P1015SSE5FFB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
P1015NSE5FFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1015NXN5FFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1015PSE5FFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1015SSE5FFB 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P1 family |
| Part Status | Active |
| Core Processor | PowerPC e500v2 |
| Number of Cores / Width | 1 Core / 32-Bit |
| Core Speed | 533 MHz |
| L2 Cache | 256 KB |
| Integrated Peripherals | 3-port GbE switch, DDR3 controller with ECC, 2x PCIe, 2x USB 2.0, SEC 3.x, TDM, DUART, SPI, I2C, eSDHC, GPIO |
| Security Engine (SEC) | SEC 3.x (DES/3DES/AES/SHA/RSA) |
| Memory Controller | 32-bit DDR3 with ECC, up to DDR3-1066 |
| Ethernet | 3-port Gigabit Ethernet switch with classification |
| USB | 2x USB 2.0 (Host + Device) |
| PCIe | 2x PCIe controllers |
| TDM / Serial Interfaces | TDM, DUART, SPI, I2C, eSDHC |
| 패키지 / 케이스 | 561-TEPBGA (23 mm x 23 mm) |
| Supplier Device Package | 561-TEPBGA I |
| Packaging | Tray |
| 동작 온도 | 0 C to +105 C (Standard Temperature grade) |
| Lead Free | Lead Free |
| RoHS 상태 | RoHS Compliant |
| 실장 유형 | Surface Mount (BGA) |
P1015SSE5FFB 561-tepbga i 핀 구성 가이드
P1015SSE5FFB(561-tepbga i 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1015SSE5FFB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1015SSE5FFB 적합 용도: 6 애플리케이션s: Industrial Routers and Gateways, Ethernet Switch / Smart Switch, Defense / Aerospace Embedded Computing, Smart-Grid Communications / Substation Gateway, Factory-Floor IoT Aggregation Gateway, Secure VPN Concentrator / Branch Office Firewall.
Industrial Routers and Gateways
The P1015SSE5FFB is well matched to industrial router and small-office gateway designs because its integrated 3-port Gigabit Ethernet switch removes the need for an external GbE switch IC, while the SEC 3.x block accelerates IPsec and TLS termination. The 533 MHz e500v2 core delivers sufficient throughput for branch-office VPN appliances handling up to ~200 Mbps encrypted traffic. Pair the processor with DDR3-1066 (1 GB typical) for routing tables and connection-tracking memory, and leverage the two PCIe lanes for a Wi-Fi or LTE modem module via Mini-PCIe.
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Ethernet Switch / Smart Switch
As the management and control-plane CPU of a small L2/L3 Ethernet switch, the P1015SSE5FFB runs routing daemons, SNMP, and CLI while external GbE switch ASICs handle line-rate forwarding. Its DUART and TDM interfaces provide console and serial-management connectivity; SPI and I2C connect to SFP/QSFP transceivers and CPLDs. The 561-TEPBGA's high pin count (561) gives ample GPIO and SerDes lanes for multi-port designs, and the 256 KB L2 cache speeds up routing-table lookups for small business networks under 10k routes.
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Defense / Aerospace Embedded Computing
The P1015SSE5FFB's 0 to +105 C operating range, lead-free RoHS-compliant construction, and long-life-cycle NXP product support make it a strong fit for defense and aerospace embedded systems. The SEC 3.x engine accelerates Type-1-class encryption algorithms for secure tactical networks, and the Power Architecture ecosystem provides long-term software support via VxWorks, INTEGRITY, and Green Hills INTEGRITY-178 tuMP. Designers can use the 561-TEPBGA's industrial temperature bin and rugged PCB stack-up to meet MIL-STD-810 vibration and thermal requirements.
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Smart-Grid Communications / Substation Gateway
For substation gateways and intelligent electronic devices (IEDs), the P1015SSE5FFB's combination of GbE, TDM, and SEC 3.x provides IEC 61850-3 protocol support with hardware-accelerated authentication and encryption. The integrated peripherals reduce BOM cost compared to discrete CPU + external switch designs, and the industrial temperature rating supports substation environmental specs. Pair the processor with an IEEE 1588v2 TCXO for sub-microsecond PTP timing required by IEC 61850-9-3 process-bus synchronization.
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Factory-Floor IoT Aggregation Gateway
Factory-floor IoT aggregation gateways use the P1015SSE5FFB to bridge Modbus/TCP, PROFINET, EtherNet/IP, and OPC-UA fieldbuses into MQTT or cloud protocols over LTE/5G backhaul. The 533 MHz e500v2 core plus SEC 3.x engine handles TLS 1.2/1.3 handshakes for hundreds of simultaneous sensor connections, while the integrated 3-port GbE switch isolates fieldbus and uplink networks. The industrial temperature rating and lead-free BGA package suit dusty and vibration-prone factory environments, and the Power Architecture ecosystem provides long-life Yocto Linux support.
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Secure VPN Concentrator / Branch Office Firewall
The P1015SSE5FFB's SEC 3.x engine accelerates IPsec AES-256-GCM and SHA-2 to enable a 533 MHz QorIQ part to terminate ~200-400 Mbps of IPsec tunnels in a small-office firewall or VPN concentrator. The 561-TEPBGA exposes enough SerDes lanes for a GbE WAN plus four GbE LAN ports, and the SEC engine offloads key generation and certificate processing from the main CPU. Pair with 1 GB DDR3-1066 for SA table storage, and use the integrated 3-port GbE switch to collapse WAN/LAN/DMZ into one BGA without external switch silicon.
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추천 제품 요약
엔지니어링 참조 데이터: P1015SSE5FFB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1015NSE5FFB | P1015NXN5FFB | P1015PSE5FFB |
|---|---|---|---|---|
| Package | 561-TEPBGA (23x23 mm) | 561-TEPBGA (23x23 mm) - same | 561-TEPBGA (23x23 mm) - same | 561-TEPBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 533 MHz | 667 MHz | 667 MHz | 800 MHz |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB |
| DDR3 Controller | 32-bit, ECC, DDR3-1066 | 32-bit, ECC, DDR3-1066 | 32-bit, ECC, DDR3-1066 | 32-bit, ECC, DDR3-1066 |
| Integrated GbE Switch | 3-port | 3-port | 3-port | 3-port |
| PCIe / USB | 2x PCIe, 2x USB 2.0 | 2x PCIe, 2x USB 2.0 | 2x PCIe, 2x USB 2.0 | 2x PCIe, 2x USB 2.0 |
| Security Engine | SEC 3.x | SEC 3.x | SEC 3.x | SEC 3.x |
| Operating Temperature | 0 to +105 C | 0 to +105 C | 0 to +105 C | 0 to +105 C |
주요 차별점
- Lowest-cost 533 MHz speed bin in the QorIQ P1 family (vs P1015PSE5FFB)
- Pin-compatible upgrade path to higher speed bins (vs P1015NSE5FFB)
- Integrated 3-port GbE switch eliminates external switch IC (vs P1015NXN5FFB)
설계 노트
The 561-TEPBGA (23x23 mm, 1 mm pitch) requires at least an 8-layer PCB with buried/micro vias for signal breakout. Use a 1-4-1-4-1-4-1 stack-up so DDR3/PCIe/GbE SerDes pairs route on inner layers with continuous reference planes. Per NXP hardware spec, DDR3 trace length matching must be within 25 mils byte-to-byte and within 50 mils byte-to-byte across the 32-bit bus. Differential SerDes pairs (GbE RGMII, PCIe) must be 85-ohm differential and routed over an unbroken ground plane.
Estimated: at 533 MHz core, 1.0 V core supply, the P1015SSE5FFB dissipates approximately 3.5-4.5 W typical (computing = V * I = 1.0 V * ~4 A). With 561-TEPBGA theta_JA ~12 C/W on a JEDEC 8-layer test board, junction-to-ambient rise is roughly 50-55 C at typical power. Above 65 C ambient, add thermal vias under the BGA and ensure the PCB's copper-pour area around the package is at least 10 cm squared for industrial-temperature operation. For sealed enclosures, design for 1 m/s airflow or a small heatsink.
Avoid the common pitfall of routing DDR3 reference voltage (VREF) and VTT termination outside the proximity of the memory controller pins - VTT termination must be placed within 500 mils of the DRAM DQ/DQS lines per NXP AN4321. Do not omit the POR (Power-On-Reset) hardware strap configuration resistors on the ASLEEP, PORESET, and HRESET pins, or the part will fail to boot. Finally, ensure boot-source configuration resistors are correct (RCW = Reset Configuration Word) - a single bit error in the RCW causes silent boot failure.
규정 준수 정보
RoHS-compliant and lead-free per Freescale/NXP datasheet. AEC-Q100 not applicable - this is a communications processor, not an automotive-grade MCU. Operating temperature 0 to +105 C is standard industrial grade; for extended temperature (-40 to +105 C) check NXP's ordering options.
