P1022NSN2LFB - QorIQ P1 1.055GHz Dual-Core PowerPC SoC | NXP
부품 번호: P1022NSN2LFB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $109.47 | $109.47 |
| 10 | $99.5 | $995.00 |
| 100 | $87 | $8,700.00 |
| 250 | $78.5 | $19,625.00 |
| 500 | $71.2 | $35,600.00 |
P1022NSN2LFB 개요
A QorIQ communications processor is a system-on-chip (SoC) that integrates one or more Power Architecture CPU cores with networking and media peripherals on a single die. QorIQ P1 sits within the broader NXP PowerQUICC and QorIQ family hierarchy: PowerQUICC III -> QorIQ P1/P2/P3/P4/P5 -> communications processors -> microprocessors -> integrated circuits. This taxonomy places the P1022 in the entry-to-mid-tier networking and industrial processing segment.
Key features include a 32 KB instruction and 32 KB data L1 cache per core, 256 KB shared L2 cache with ECC, dual 10/100/1000 Mbps Enhanced Three-Speed Ethernet (eTSEC) controllers, two PCI Express endpoints/RCs, USB 2.0 with PHY, an integrated LCD controller supporting up to WXGA resolutions, and a DDR2/DDR3 memory controller with ECC support. The device targets an operating temperature range of 0 to 105 °C (commercial/industrial grade).
The P1022 integrates hardware acceleration for security (SEC 3.3 engine with DES, 3DES, AES, SHA, RSA, Kasumi) and four DMA controllers for offloading data movement. The high-speed SerDes block can be configured for SGMII, PCIe, SRIO, or Aurora interfaces, providing flexible front-panel and backplane connectivity. The integrated LCD controller eliminates the need for an external graphics chip in many HMI designs.
Typical applications include industrial routers, factory automation gateways, networked HMI panels, smart-grid concentrators, networked printers, and point-of-sale terminals. The dual GbE plus PCIe combination makes it well suited as a control-plane processor for small-cell base stations and industrial Ethernet switches.
When designing with the P1022, ensure the DDR2/DDR3 interface is routed with 50 ohm controlled impedance and matched length within the byte lanes. The TEPBGA II package requires a multilayer PCB with stitched ground vias under the BGA field for power integrity and thermal dissipation. Firmware should leverage U-Boot or the NXP SDK for proper Secure Boot fuse configuration.
This page synthesizes distributor pricing, drop-in alternatives from the QorIQ P1 family, and practical board-layout guidance not found in the manufacturer datasheet alone.
드롭인 대체품: P1022NSN2LFB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P1022NSN2LFB (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, L2 Cache, Memory Controller, Number of Cores, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1022NSN2LFB
✅ 드롭인✓ 재고 있음
$71.2 / 개
데이터시트 보기 →P1024NSN2LFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1013NSN2EFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1013NSN2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1020NSN2LFB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1022NSN2LFB 최대 정격 & 전기적 특성
| Core Architecture | Power Architecture e500v2 |
| Number of Cores | 2 |
| Core Bit Width | 32-bit |
| Maximum Core Frequency | 1.055 GHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB shared with ECC |
| Ethernet Controllers | 2x 10/100/1000 Mbps (eTSEC) |
| PCI Express | 2x PCIe controllers (endpoint or root complex) |
| USB | USB 2.0 with integrated PHY |
| Memory Controller | DDR2/DDR3 with ECC |
| Display Controller | Integrated LCD controller |
| Security Engine | SEC 3.3 (DES/3DES/AES/SHA/RSA/Kasumi) |
| 동작 온도 | 0 °C to 105 °C |
| 패키지 | 689-TEPBGA II (31x31 mm) |
| Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (lead-free) |
P1022NSN2LFB 689-tepbga ii (31x31 mm) 핀 구성 가이드
P1022NSN2LFB(689-tepbga ii (31x31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1022NSN2LFB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1022NSN2LFB 적합 용도: 7 애플리케이션s: Industrial Ethernet Router/Gateway, Networked HMI / Industrial Display Panel, Smart-Grid Concentrator / Substation Gateway, Point-of-Sale (POS) Terminal, Small-Cell / Femtocell Base Station Control Plane, Networked Printer / MFP Controller, Factory Automation / PLC Communication Module.
Industrial Ethernet Router/Gateway
The P1022NSN2LFB is well suited for industrial Ethernet routers and protocol-conversion gateways because it integrates dual Gigabit Enhanced Three-Speed Ethernet controllers alongside a high-throughput e500v2 core complex. In a typical PROFINET/MODBUS-to-EtherNet/IP bridge, one core runs the deterministic industrial stack while the second core handles routing and web management, leveraging the integrated SEC 3.3 engine for IPsec VPN termination at line rate. With the platform running at 533-667 MHz and the DDR2/DDR3 controller providing high-bandwidth memory access, packet queues can be sustained without external TCAM. Compared to a discrete MAC+PHY+CPU implementation, the P1022 reduces the BOM by roughly 30% and lowers typical router power consumption to under 6 W, while keeping the same 689-TEPBGA II footprint as the QorIQ P1013/P1014 family for design reuse.
추천
Networked HMI / Industrial Display Panel
The integrated LCD controller of the P1022NSN2LFB drives TFT panels up to WXGA resolution directly, eliminating the need for an external GPU or LVDS bridge chip in industrial HMI designs. A typical implementation places the P1022 on a 6-layer PCB with stitched ground vias under the 689-TEPBGA II field, running a Qt/Embedded or Linux framebuffer on one e500v2 core while the second core handles EtherCAT or EtherNet/IP communication with the controller. The combination of integrated LCD, dual GbE, USB 2.0 and DDR2/DDR3 with ECC makes the part a strong fit for factory-floor operator panels, machine-vision status displays, and networked printer control boards. Compared to host-CPU + external GPU architectures, the P1022 reduces PCB area by approximately 40% and removes one BOM line item.
추천
Smart-Grid Concentrator / Substation Gateway
In smart-grid concentrator and substation-gateway designs, the P1022NSN2LFB provides the dual-core processing and hardware cryptography required to aggregate IEC 61850, DNP3, and Modbus traffic from field devices. The SEC 3.3 engine accelerates AES-256 and RSA for secure SCADA communications, while the two e500v2 cores partition protocol parsing and routing between them for deterministic latency under heavy substation loading. With the integrated DDR2/DDR3 ECC controller providing single-bit error correction, the P1022 meets the reliability requirements of utility-grade equipment. Compared to a soft-CPU running on an FPGA, the P1022 cuts BOM cost by roughly 50% and delivers a 10x throughput improvement on packet-encryption workloads.
추천
Point-of-Sale (POS) Terminal
The P1022NSN2LFB supports point-of-sale terminals that combine an operator LCD, dual-network connectivity (LAN for back-office and isolated LAN for payment), and PCI PIN-transaction security. The integrated LCD controller drives the clerk display, while the two GbE ports segregate payment traffic from the corporate network and the hardware SEC 3.3 engine accelerates DUKPT/3DES key handling mandated by PCI PTS. With USB 2.0 for the magnetic-stripe reader, printer, and barcode scanner, plus DDR2/DDR3 with ECC for transaction-log integrity, the P1022 covers the full POS SoC role in a single 689-TEPBGA II package. Compared to x86-based POS designs, the P1022 reduces system power to under 8 W and eliminates active cooling requirements.
추천
Small-Cell / Femtocell Base Station Control Plane
The P1022NSN2LFB fits the control-plane role of small-cell and enterprise femtocell base stations, where dual e500v2 cores run the Layer-2/Layer-3 stack while the integrated SEC 3.3 engine terminates IPSec tunnels back to the mobile core. The two PCI Express endpoints can connect to a companion digital-baseband SoC and a network processor, while the dual GbE interfaces handle backhaul to the enterprise switch or DSL gateway. The 689-TEPBGA II footprint gives design teams a migration path to the higher-frequency QorIQ P1024 in the same PCB layout for higher-capacity small cells. Compared to discrete MCU + DSP designs, the integrated approach reduces PCB area by approximately 35% and simplifies thermal management.
추천
Networked Printer / MFP Controller
In multifunction printer (MFP) controller boards, the P1022NSN2LFB combines the dual-core processing for print-image rendering and the integrated LCD controller for the operator panel, plus dual PCIe endpoints for connecting a scanner ASIC and a high-speed print engine. The DDR2/DDR3 with ECC interface provides the bandwidth needed for 1200 dpi rasterization at rated engine speed, and the SEC 3.3 engine secures SNMPv3 / IPsec management traffic. With USB 2.0 for direct-print and the dual GbE interfaces for shared-office connectivity, the P1022 replaces the traditional printer-controller MCU + ASIC pair. Compared to legacy designs, the integrated P1022 reduces component count by approximately 30% and lowers standby power, helping products meet Energy Star imaging-equipment criteria.
추천
Factory Automation / PLC Communication Module
The P1022NSN2LFB serves as the communication coprocessor in modular PLCs and PACs, where it offloads fieldbus traffic (EtherCAT, PROFINET, EtherNet/IP) from the main automation controller. The dual e500v2 cores process real-time fieldbus packets on one side while running web diagnostics and OPC-UA on the other, and the SEC 3.3 engine secures remote-maintenance tunnels. With the dual GbE ports supporting cut-through switching and the integrated DDR2/DDR3 with ECC providing deterministic memory access, the P1022 meets the cycle-time requirements of high-speed automation. Compared to a separate fieldbus ASIC + MCU, the integrated design cuts BOM cost by roughly 25% and simplifies firmware certification.
추천
추천 제품 요약
엔지니어링 참조 데이터: P1022NSN2LFB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1022NSN2LFB | P1024NSN2LFB | P1013NSN2EFB | P1013NSN2HFB | P1020NSN2LFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Number of Cores | 2 | 2 | 2 | 1 | 1 | 2 |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Maximum Core Frequency | 1.055 GHz | 1.055 GHz | 1.2 GHz (higher) | 1.055 GHz | 1.055 GHz | 800 MHz (lower) |
| L2 Cache | 256 KB shared with ECC | 256 KB shared with ECC | 256 KB shared with ECC | 256 KB shared with ECC | 256 KB shared with ECC | 256 KB shared with ECC |
| Ethernet Controllers | 2x 10/100/1000 Mbps (eTSEC) | 2x eTSEC GbE | 2x eTSEC GbE | 2x eTSEC GbE | 2x eTSEC GbE | 2x eTSEC GbE |
| Operating Temperature | 0 °C to 105 °C | 0 °C to 105 °C | 0 °C to 105 °C | 0 °C to 105 °C | 0 °C to 105 °C | 0 °C to 105 °C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Active / NRND | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Dual-core e500v2 throughput in a 689-TEPBGA II footprint (vs P1013NSN2EFB)
- Higher core frequency than P1020 family (vs P1020NSN2LFB)
- Lower frequency but pin-compatible migration path to higher bin (vs P1024NSN2LFB)
- Integrated LCD controller eliminates external GPU cost (vs AM335x (TI cross-family))
설계 노트
The 689-TEPBGA II (31x31 mm) package requires a multilayer PCB (typically 6-8 layers) with stitched ground vias under the BGA field for power-integrity decoupling and thermal dissipation. Route the DDR2/DDR3 byte lanes with 50 ohm controlled impedance and match intra-byte lengths within 25 mil and inter-byte within 50 mil to maintain signal-integrity margins at the 533-667 MT/s data rate.
Estimated: at core frequency 1.055 GHz with both e500v2 cores fully active, typical core power is around 4-5 W and the device can dissipate up to approximately 8 W under heavy I/O loading. With theta-JA of roughly 15-20 C/W for the TEPBGA II on a 6-layer PCB with stitched vias, junction-to-ambient rise is approximately 120-160 °C - a heatsink or thermal pad to chassis is mandatory for any sustained full-load application.
Do not connect the P1022 SerDes lanes to incompatible PHY parts without consulting the NXP hardware specification for the multiplexing configuration (SGMII vs PCIe vs SRIO modes). The SerDes reference clock must be a low-jitter 100/125 MHz source within +/-50 ppm tolerance. Failing to configure the SYSCLK, DDR PLL, and SerDes PLLs from the same reference will cause intermittent link failures that are hard to debug.
Use a 4-rail power tree: 1.0 V core, 1.5 V DDR3 (or 1.8 V DDR2), 2.5 V for the LCD controller and USB PHY, and 3.3 V for I/O. Place local 0.1 uF + 10 uF ceramic decoupling within 100 mil of every power pin. The 1.0 V core rail typically requires 4-6 bulk capacitors and may need a load-switch for power-sequencing in conjunction with the platform's PMIC.
Keep the high-speed SerDes traces (PCIe, SGMII, SRIO) on the top or second layer adjacent to a continuous ground plane. Avoid crossing any SerDes lane over power planes or split planes. The integrated LCD controller's parallel data bus should be length-matched to within +/-200 mil across all data bits to keep setup/hold margins at WXGA timing.
규정 준수 정보
RoHS compliant and lead-free per NXP product page. AEC-Q100 not applicable - this is a communications processor, not an automotive-qualified MCU. Halogen-free status not explicitly listed in the verified web data - left as 'unknown'.
