P2020NXE2HHC - QorIQ Dual-Core 1.2GHz Power Arch SoC | NXP
부품 번호: P2020NXE2HHC ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $192.4 | $192,400.00 |
P2020NXE2HHC 개요
A communications SoC (System-on-Chip) is a highly integrated microprocessor that consolidates CPU cores, memory interfaces, networking peripherals, and security accelerators into a single silicon die. QorIQ P-series SoCs sit at the top of the value-performance tier of NXP's Power Architecture portfolio, scaling from the single-core P1011 at 533 MHz up through the dual-core P2020 at 1.2 GHz, all in pin-compatible packages. This scalability allows OEMs to reuse a single PCB design across multiple product lines by simply swapping the SoC.
Key specifications include dual Power Architecture e500v2 cores at 1.2 GHz, 32 KB instruction / 32 KB data L1 cache per core, a unified 256 KB L2 cache, dual DDR2/DDR3 controllers with ECC, three Gigabit Ethernet ports with IEEE 1588 support, three PCI Express Gen 1/Gen 2 controllers, two Serial RapidIO ports, two USB 2.0 controllers with PHY, and an integrated SEC 4.0 security engine for IPsec, SSL/TLS, and 3GPP cryptographic acceleration. The 45nm process node delivers strong performance per watt for thermally constrained fanless embedded enclosures.
The P2020NXE2HHC architecture is widely deployed in industrial routers, multi-service access equipment, factory automation controllers, military/aerospace networking, and defense-grade secure communications platforms. Its integrated SEC engine makes it well suited for IPsec VPN gateways, SSL offload appliances, and trusted computing applications where hardware-accelerated cryptography is required.
When designing with this part, ensure adequate thermal relief on the TE-PBGA II exposed pad, validate DDR3 signal integrity with 4+ layer PCB stack-ups, and follow NXP's reference PCB layout for the SERDES lanes. The part is in active EOL/Last Time Buy transition; confirm RoHS/REACH compliance at order entry. Use NXP CodeWarrior or Linux BSP packages for software development.
드롭인 대체품: P2020NXE2HHC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P2020NXE2HHC (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, Operating Temperature, PCI Express, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P2020NXN2MHC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P2010NXE2KHC
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →P1020NXE2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P2020NSN2NHC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1011NXN2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P2020NXE2HHC 최대 정격 & 전기적 특성
| Processor Type | PowerPC e500v2 Microprocessor IC QorIQ P2 |
| Core Architecture | Power Architecture e500v2, dual-core |
| Core Count | 2 |
| Operating Frequency | 1.2 GHz (800 MHz/800 MHz core config per NXP marketing code) |
| L1 Cache | 32 KB instruction + 32 KB data per core |
| L2 Cache | 256 KB unified |
| Memory Controller | DDR2/DDR3 with ECC support |
| Ethernet | 3x Gigabit Ethernet with IEEE 1588 |
| PCI Express | 3x PCIe Gen 1/Gen 2 controllers |
| Serial RapidIO | 2x SRIO ports |
| USB | 2x USB 2.0 with integrated PHY |
| Security Engine | SEC 4.0 (IPsec/SSL/3GPP acceleration) |
| 패키지 | 689-TEPBGA II (31x31 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +125C |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| Process Technology | 45nm |
| Revision | R2.1 |
P2020NXE2HHC 689-tepbga ii (31x31 mm) 핀 구성 가이드
P2020NXE2HHC(689-tepbga ii (31x31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P2020NXE2HHC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P2020NXE2HHC 적합 용도: 6 애플리케이션s: Industrial Multi-Service Routers, Factory Automation Controllers, Secure VPN/SSL Gateway Appliances, Military and Aerospace Networking, Wireless Base Station and Small Cell, Storage Area Network Controllers.
Industrial Multi-Service Routers
The P2020NXE2HHC is well suited for industrial multi-service routers and IP edge equipment where dual-core packet processing at 1.2 GHz delivers wire-speed forwarding for IPv4/IPv6, MPLS, and QoS classification. The triple Gigabit Ethernet ports with IEEE 1588 hardware timestamping support TDM-over-packet and IEEE 1588-2008 precision time protocol for industrial automation. The SEC 4.0 engine offloads IPsec and SSL/TLS at line rate, enabling VPN and secure remote management without CPU bottlenecks. Compared to discrete CPU + security coprocessor designs, the integrated SoC reduces BOM cost and PCB area while keeping power under 12 W for fanless DIN-rail mounting.
추천
Factory Automation Controllers
For factory automation controllers and PLC gateways, the P2020NXE2HHC delivers deterministic dual-core performance with industrial-grade -40C to +125C temperature rating. Its triple PCIe Gen 1/Gen 2 controllers connect to FPGA coprocessors, motion controllers, and high-speed ADC/DAC peripherals, while Serial RapidIO supports deterministic real-time communication with industrial drives. The DDR2/DDR3 controllers with ECC ensure data integrity in noisy factory environments. The integrated SEC engine supports secure boot and authenticated firmware updates required for IEC 62443 industrial cybersecurity standards, replacing discrete security chips on the same footprint.
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Secure VPN/SSL Gateway Appliances
The P2020NXE2HHC's SEC 4.0 hardware accelerator enables line-rate IPsec, SSL, and 3GPP cryptographic processing at multi-gigabit rates, ideal for enterprise VPN concentrators and SSL inspection appliances. Dual e500v2 cores at 1.2 GHz provide headroom for control plane tasks (routing, management, DPI) while the security engine handles data-plane crypto in parallel. The three Gigabit Ethernet ports support WAN/LAN/DMZ segregation in a single appliance, and the exposed thermal pad of the TE-PBGA II package enables passive cooling in 1U rackmount chassis. The -40C to +125C rating supports deployment in outdoor NEMA enclosures.
추천
Military and Aerospace Networking
For ruggedized military and aerospace networking platforms, the P2020NXE2HHC's extended -40C to +125C operating range and BGA package with exposed thermal pad enable reliable operation in extreme environments. Serial RapidIO supports real-time, deterministic communication with mission-critical avionics and ground-vehicle subsystems, while the SEC engine provides FIPS-grade cryptographic acceleration. The dual-core e500v2 architecture runs partitioned real-time operating systems (VxWorks, Green Hills INTEGRITY) for safety-critical workloads. The pin-compatible P2020 family allows OEMs to qualify multiple performance tiers on a single PCB design.
추천
Wireless Base Station and Small Cell
In wireless base stations and enterprise small-cell baseband units, the P2020NXE2HHC's dual-core e500v2 architecture at 1.2 GHz handles LTE Layer 2/3 processing and backhaul aggregation with hardware-accelerated IPsec for secure backhaul. The SERDES lanes connect to RF front-end ICs, while Gigabit Ethernet ports support S1/X2 interfaces. The integrated USB 2.0 with PHY enables local diagnostics and firmware update ports without external PHY chips. Compared to discrete DSP+CPU architectures, the QorIQ P2020 reduces BOM cost and power by integrating baseband, control plane, and security in a single device.
추천
Storage Area Network Controllers
The P2020NXE2HHC serves as a control plane processor for iSCSI, NAS, and Fibre Channel-over-Ethernet (FCoE) storage controllers, where dual-core processing at 1.2 GHz handles RAID management, deduplication metadata, and storage protocol stacks. The triple PCIe lanes connect to SAS/SATA host bus adapters and 10 GbE NICs, while the DDR3 with ECC controller supports large DRAM caches for write-back acceleration. The integrated SEC engine accelerates AES-NI and SHA operations for at-rest data encryption. Pin-compatible family members allow OEMs to scale from small-business NAS to enterprise SAN arrays on one PCB platform.
추천
추천 제품 요약
엔지니어링 참조 데이터: P2020NXE2HHC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P2020NXN2MHC | P2010NXE2KHC | P1020NXE2HFB | P2020NSN2NHC | P1011NXN2HFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Count | 2 (dual-core e500v2) | 2 (dual-core) | 1 (single-core) | 1 (single-core) | 2 (dual-core) | 1 (single-core) |
| Max Frequency | 1.2 GHz | 800-1000 MHz (speed grade N) | 1.0-1.2 GHz | 800 MHz | 800-1000 MHz | 533-800 MHz |
| Security Engine (SEC 4.0) | Yes | Yes | Yes | Yes | No (NSN variant) | No |
| Gigabit Ethernet Ports | 3 | 3 | 2 | 3 | 3 | 2-3 |
| PCIe Controllers | 3 | 3 | 2 | 2-3 | 3 | 2 |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Dual-core 1.2 GHz with SEC 4.0 in pin-compatible family (vs P2010NXE2KHC)
- Full security engine included (vs P2020NSN2NHC)
- Triple PCIe Gen 1/Gen 2 controllers (vs P1020NXE2HFB)
- 45nm process for strong performance per watt (vs Older PowerQUICC III devices)
설계 노트
Estimated: At typical dual-core 1.2 GHz load with SEC engine active, the P2020NXE2HHC dissipates approximately 8-12 W. The 689-TEPBGA II package requires a substantial PCB thermal pad land pattern with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to internal copper planes. For fanless industrial enclosures, use a 4+ layer PCB stack-up with the top inner plane dedicated to thermal spreading. Junction-to-ambient thermal performance depends heavily on PCB copper area; follow NXP AN4325 thermal management guidelines and validate with the NXP Power Estimation Tool.
The SERDES lanes (PCIe Gen 1/Gen 2 and Serial RapidIO) require strict impedance control (90 ohm differential) with matched trace lengths within 150 mil tolerance. Use a 4+ layer PCB with controlled dielectric (FR4-370HR or higher-grade). Place AC coupling capacitors at the SERDES transmitter side per NXP reference design. For DDR3-1600 operation, follow the JEDEC DDR3 fly-by topology with VTT termination at the end of the address/command bus; mismatches cause intermittent write errors. Reference: NXP QorIQ P2020 Hardware Specifications Guide section on memory interface design.
Per the NXP QorIQ P2020 errata document, certain R2.1 silicon revisions have PCIe link training issues under specific refclock configurations - apply the latest NXP errata patches in board bring-up. Do not hot-plug USB or PCIe without proper PERST# sequencing. The TE-PBGA II package is moisture-sensitive (MSL3); follow NXP JEDEC J-STD-033 handling procedures for floor-life exposure. For last-time-buy orders, request NXP's PCN documentation to confirm the latest silicon revision and any discontinued package variants.
The P2020NXE2HHC requires multiple supply rails (core VDD, DDR PHY VDD, SERDES AVDD, etc.) with specific sequencing requirements. Per NXP AN4317, the SERDES AVDD rails must be filtered with ferrite beads and bulk capacitance to prevent PLL jitter. Use a low-noise LDO (such as TPS7A4701 or LT3042) for the SERDES supply rails. Power-on reset sequencing should follow NXP's POR sequence to avoid latch-up. Decoupling requires 0.1 uF X7R ceramic capacitors placed within 2 mm of each supply ball, with bulk capacitance on the PCB thermal pad plane.
규정 준수 정보
RoHS and Lead Free status confirmed per digchip.com datasheet record and NXP product page. AEC-Q100 not applicable (industrial/networking SoC, not automotive-qualified per NXP QorIQ P2020 product datasheet). Halogen-free status not explicitly stated in verified data - flagged unknown. Conflict Minerals policy follows standard NXP corporate compliance. Part is in EOL/Last-Time-Buy phase per NXP product page as of 2026-10-17.
