P5010NSE1QMB557 - QorIQ P5 PowerPC 64-Bit MPU, 2GHz | NXP
부품 번호: P5010NSE1QMB557 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $382.42 | $382.42 |
| 10 | $360 | $3,600.00 |
| 50 | $335 | $16,750.00 |
| 100 | $310 | $31,000.00 |
| 500 | $285 | $142,500.00 |
P5010NSE1QMB557 개요
Background: A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computing system, executing instructions fetched from external memory. High-end communications MPUs like the QorIQ P5 family target networking infrastructure - routers, switches, wireless base stations, and security appliances - where deterministic performance, large memory bandwidth, and integrated high-speed serial interfaces (SerDes) are critical. Within the system hierarchy, an MPU sits above microcontrollers (MCUs) in performance, above DSPs in control-plane flexibility, and below FPGAs in raw parallel throughput.
Key features of the P5010 include: a hardware-accelerated data path supporting packet parsing and classification, integrated 10-Gigabit Ethernet and Gigabit Ethernet MACs, two PCIe Gen 2 controllers, multiple DMA engines, and a security engine supporting symmetric and asymmetric cryptographic algorithms. The platform's large L2 cache (1 MB) and L3 cache (512 KB) reduce external memory pressure and accelerate lookup-intensive workloads.
The P5010NSE1QMB557 is typically applied to networking equipment such as mid-range enterprise routers, network-attached storage controllers, industrial control gateways, and unified threat management (UTM) appliances. Its combination of deterministic single-thread execution and high-speed I/O makes it well-suited to control-plane tasks that require low latency alongside heavy peripheral bandwidth.
When designing with the FCPBGA-1295 package, engineers must use a multi-layer PCB (typically 12+ layers) with high-density breakouts, controlled-impedance SerDes routing, and matched-length DDR3 traces. The package's 37.5 mm body requires careful thermal management; at 2 GHz, the device dissipates approximately 8-15 W under typical workloads, often requiring a heatsink and forced airflow.
This page synthesizes cross-reference data, drop-in compatible variants from the QorIQ P5 family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: P5010NSE1QMB557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P5010NSE1QMB557 (동일 폼 팩터 및 풋프린트) — 차이점: Core Count, Memory Controller, Package, Security Engine.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P5010NSE1QMB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P5010NSE1MMB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P5020NSE1QMB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P5020NSE1MMB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P5010NSN1QMB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$318.25 / 개
데이터시트 보기 →P5010NSE1QMB557 사양
| Core Architecture | PowerPC e5500 (64-bit) |
| Core Count | 1 |
| Maximum Core Frequency | 2.0 GHz |
| L2 Cache | 1 MB |
| L3 Cache | 512 KB |
| Memory Controller | 64-bit DDR3/DDR3L with ECC |
| 패키지 | 1295-FCPBGA (37.5 x 37.5 mm) |
| 동작 온도 범위 | -40C to +105C |
| Ethernet Interfaces | 10 Gigabit Ethernet + Gigabit Ethernet MACs |
| PCIe Controllers | 2 x PCIe Gen 2 |
| Security Engine | Symmetric and asymmetric cryptography |
| DMA Engines | Multiple |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
P5010NSE1QMB557 1295-fcpbga (37.5 x 37.5 mm) 핀 구성 가이드
P5010NSE1QMB557(1295-fcpbga (37.5 x 37.5 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: P5010NSE1QMB557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P5010NSE1QMB557 적합 용도: 6 애플리케이션s: Enterprise Edge Routers, Unified Threat Management (UTM) Appliances, Industrial Control Gateways, Network-Attached Storage (NAS) Controllers, Wireless Base Station Controllers, Smart Grid Communication Concentrators.
Enterprise Edge Routers
The P5010NSE1QMB557 is well suited for enterprise edge router control-plane processing. Its single-core e5500 at 2.0 GHz delivers deterministic low-latency routing protocol execution (BGP, OSPF, IS-IS) where consistent response times matter more than aggregate throughput. The integrated Gigabit and 10-Gigabit Ethernet MACs reduce external PHY count, while the DDR3 controller with ECC ensures reliable operation across extended temperature ranges typical of telecom closet installations. Engineers typically pair this MPU with external switch fabric ASICs to handle data-plane forwarding, allowing the P5010 to focus on management and routing-table lookups.
추천
Unified Threat Management (UTM) Appliances
In UTM firewalls the P5010NSE1QMB557 handles security policy enforcement, IPSec/SSL VPN termination, and anti-malware coordination. The integrated security engine accelerates AES, 3DES, and SHA operations at line rate, while the 2.0 GHz core runs DPI engines and policy decision logic. The 1295-FCPBGA package supports the thermal envelope required for fan-cooled 1U rackmount appliances. Engineers should size DDR3 to 4-8 GB to accommodate concurrent flow tables and threat-signature caches.
추천
Industrial Control Gateways
The P5010NSE1QMB557's -40C to +105C industrial temperature range and 64-bit processing make it a fit for industrial gateways bridging fieldbus protocols (PROFINET, EtherCAT, Modbus TCP) with cloud connectivity. Its PCIe Gen 2 controllers support industrial expansion cards for CAN, RS-485, or wireless modules. The deterministic e5500 core ensures real-time protocol handling without jitter from context switches. Typical deployments include SCADA aggregators and predictive-maintenance gateways in factory automation.
추천
Network-Attached Storage (NAS) Controllers
NAS controllers benefit from the P5010NSE1QMB557's combination of 64-bit DDR3 bandwidth and integrated multi-gigabit Ethernet for storage I/O aggregation. The single-core architecture simplifies RAID management software stacks, while the security engine accelerates SMB/Kerberos authentication. The PCIe interface supports SAS/SATA controller ASICs for multi-drive bays. Engineers typically implement iSCSI or NFS target services here, with file-system caching benefiting from the 1 MB L2 cache.
추천
Wireless Base Station Controllers
In small-cell and pico-cell base stations, the P5010NSE1QMB557 manages the backhaul link and baseband coordination between Layer 1 DSP/FPGA accelerators and the core network. The 2.0 GHz e5500 core processes the S1/X2 interfaces, while the high-speed SerDes links connect to baseband ASICs. The industrial temperature rating supports outdoor enclosure deployment. Engineers integrate timing synchronization (IEEE 1588) using the MPU's hardware timestamping capabilities.
추천
Smart Grid Communication Concentrators
Utility communication concentrators aggregate data from thousands of smart meters via PLC, RF mesh, or cellular backhaul. The P5010NSE1QMB557's 64-bit processing handles DLMS/COSEM and IEC 61850 protocol stacks with deterministic latency. The extended temperature rating suits outdoor cabinet installations. Integrated crypto acceleration secures AMI communications while the Ethernet interfaces link to substation networks. The FCPBGA package's thermal envelope supports sealed enclosure designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: P5010NSE1QMB557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P5010NSE1QMB | P5010NSE1MMB | P5020NSE1QMB | P5020NSE1MMB | P5010NSN1QMB |
|---|---|---|---|---|---|---|
| Package | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same family | 1295-FCPBGA (37.5x37.5) - same family | 1295-FCPBGA (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 1 x e5500 | 1 x e5500 | 1 x e5500 | 2 x e5500 | 2 x e5500 | 1 x e5500 |
| Core Frequency | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 1.6 GHz |
| Memory Controller | 64-bit DDR3/DDR3L with ECC | 64-bit DDR3/DDR3L with ECC | 64-bit DDR3/DDR3L with ECC | 64-bit DDR3/DDR3L with ECC | 64-bit DDR3/DDR3L with ECC | 64-bit DDR3/DDR3L with ECC |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| L2 Cache | 1 MB | 1 MB | 1 MB | 1 MB per core (2 MB total) | 1 MB per core (2 MB total) | 1 MB |
| Architecture | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 |
주요 차별점
- Single-core deterministic performance with industrial temperature grade (vs P5020NSE1QMB)
- Full NXP QorIQ P5 silicon compatibility with ordering-code suffix flexibility (vs P5010NSE1QMB)
- Lower-frequency variant available within same package for power-constrained designs (vs P5010NSN1QMB)
설계 노트
The 1295-ball FCPBGA requires a 12+ layer PCB stackup with 0.4 mm pitch ball escape. Use via-in-pad with filled and plated-over vias for the inner rows to route out cleanly. SerDes differential pairs (100-ohm) must be length-matched to within 150 mils across the lane, and DDR3 byte-lane matching should target 25 mils. According to NXP hardware specifications, decouple each power rail with bulk ceramic capacitors and high-frequency 0402 capacitors within 100 mils of the balls.
Estimated: at 2.0 GHz with typical industrial workload, the P5010NSE1QMB557 dissipates 8-15 W. With the 1295-FCPBGA theta_JA around 12 C/W and a heatsink rated at 3 C/W, the junction temperature rise above ambient is approximately (10 W x 15 C/W) = 150C ambient-above without airflow. Use a copper heat-spreader plus 1 m/s airflow, or thermal interface material rated for the extended -40C to +105C range. Validate with thermal probes during worst-case testing.
Do not confuse the P5010NSE1QMB557 with the P5020 variant - the dual-core P5020 needs firmware initialization for both cores and may behave differently in single-threaded benchmarks. When sourcing from secondary distributors, verify the security engine revision against your software stack's requirements, since earlier silicon revisions lacked some cryptographic accelerators. The 557 packing suffix denotes tape-and-reel/tray packing, not silicon revision - this part shares the same die as P5010NSE1QMB.
규정 준수 정보
RoHS compliant per NXP product declaration. Not AEC-Q100 qualified - this is a communications MPU, not an automotive device. Industrial temperature grade -40C to +105C supports outdoor cabinet installations.
